Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
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<strong>Vertical</strong> <strong>Probing</strong> <strong>Experiences</strong><br />
Wrap-Up<br />
• Buckling Beam is Predominant Technology<br />
– Mature, Robust, Multiple Sources<br />
• <strong>Vertical</strong> Probes<br />
– Accelerating Usage Across Application<br />
Spectrum<br />
– Proliferation of Suppliers / Technologies<br />
– Growing Multi-DUT Use<br />
• Technical & Business Challenges to Meet<br />
Future Needs<br />
June 3, 2003 2003 Southwest <strong>Test</strong> <strong>Workshop</strong> 27
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