Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
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<strong>Vertical</strong> <strong>Probing</strong> <strong>Experiences</strong><br />
<strong>Experiences</strong>: Selection<br />
• Buckling Beam<br />
Sourcing<br />
Decision<br />
2nd<br />
Strengths<br />
Weaknesses<br />
Price, Performance,<br />
Support<br />
Some<br />
Mature,<br />
Repairable,<br />
Robust, Multi-<br />
DUT, Tip<br />
Shape<br />
Pitch &<br />
Frequency<br />
Limitations<br />
June 3, 2003 2003 Southwest <strong>Test</strong> <strong>Workshop</strong> 22
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