Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
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<strong>Vertical</strong> <strong>Probing</strong> <strong>Experiences</strong><br />
<strong>Experiences</strong>: Pad damage v. Technology<br />
nm<br />
Cantilever<br />
2000-2500<br />
Pad<br />
Surface<br />
<strong>Vertical</strong><br />
Membrane<br />
Metal Thickness<br />
1000<br />
500<br />
SCRUB<br />
HEIGHT<br />
- 400 SCRUB<br />
- 500 DEPTH<br />
- 600/800<br />
- 1200<br />
Courtesy of Infineon<br />
June 3, 2003 2003 Southwest <strong>Test</strong> <strong>Workshop</strong> 16