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Vertical Probing Experiences - Semiconductor Wafer Test Workshop

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<strong>Vertical</strong> <strong>Probing</strong> <strong>Experiences</strong><br />

<strong>Experiences</strong>: Applications<br />

• Hybrid Cantilever<br />

Logic Chip Sets<br />

Products<br />

ASICs, µcontrollers<br />

Metallurgy<br />

Pitch (µm)<br />

PbSn Bump<br />

200 - 250<br />

Al Pad<br />

35/50<br />

I/O’s<br />

Config.<br />

#<br />

Area Array<br />

400 - 800<br />

Staggered<br />

100 - 300<br />

June 3, 2003 2003 Southwest <strong>Test</strong> <strong>Workshop</strong> 14

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