Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
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<strong>Vertical</strong> <strong>Probing</strong> <strong>Experiences</strong><br />
<strong>Experiences</strong>: Applications<br />
• Buckling Beam<br />
Products<br />
Discrete IC’s, power, ASICs,<br />
µprocessors, µcontrollers, RF,<br />
Mixed Signal, Chip Sets, <strong>Test</strong> Chip<br />
µcontrollers, DRAM, Smart Cards,<br />
Flash (emb), <strong>Test</strong> Chip<br />
Metallurgy<br />
Pitch (µm)<br />
PbSn Bump<br />
160 - 500<br />
Al Pad<br />
80 - 250<br />
I/O’s<br />
Config.<br />
#<br />
Area Array<br />
5 - ~5K<br />
Peripheral /<br />
Inline<br />
32 - ~5K<br />
June 3, 2003 2003 Southwest <strong>Test</strong> <strong>Workshop</strong> 12
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