Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
<strong>Vertical</strong> <strong>Probing</strong> <strong>Experiences</strong><br />
<strong>Experiences</strong>: Probe Technologies<br />
• Spring<br />
– Spring Probe Through Guide<br />
Plates<br />
• Sourced From<br />
– JEM (VSC – <strong>Vertical</strong> Spring<br />
Contact)<br />
Illustration Courtesy of JEM<br />
– Wire Bonded to a Substrate &<br />
Formed; Tip Geometry<br />
• Sourced From<br />
– Formfactor (MicroSpring)<br />
Courtesy of Formfactor<br />
June 3, 2003 2003 Southwest <strong>Test</strong> <strong>Workshop</strong> 11
Change language