VSCC: Vertical Spring Contact Card for Bump Probing

VSCC
Vertical Spring Contact Card for Bump Probing
Patrick Mui, JEM America Corp. (Presenter)
Kaz Okubo, JEM America Corp.
Toshio Kazama, NHK Spring., LTD
Shunsuke Sasaki, NHK Spring Co.,LTD.
Yoshio Yamada, NHK Spring Co., LTD
Akira Okuma, NHK International
SWTW 2002

Outline
? VSCC Concept
? Electrical and Mechanical Data
? Maintenance
? Specifications
? Roadmap
? Summary
SWTW 2002

Vertical Spring Contact Card
Features:
? For probing area arrays (solder or Cu bumps).
? Mechanically-isolated probes.
? Stable alignment and planarity.
? Replaceable probes and head.
? No floating probes.
? Low, linear probe force.
? Two different tip shapes.
SWTW 2002

Vertical Spring Contact Card
Bump side
Contact to Bump
( Flat or pointed
Tip)
Contact to Interposer
( Conical Tip)
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MLO \ MLC side

SWTW 2002
Probe Head Aerial View
Probe Head with PCB

VSC Configuration
(Wire Transformer Type)
Stiffener
Wire Transformer
Board
Guide Plate
Spring Pin
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VSC Configuration
(Space Transformer with MLO/MLC)
Stiffener
Board
Spacer
Solder Reflow
MLO / MLC
Guide Plate
Spring Pin
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Current Rating under room temp
For 150um pitch pin
Spring Force [gf]
after 60sec current loaded
5
4
3
2
1
0
Rated current under room temperature
SCP10-2510BP
Change rate 80%
Rated current result
: 0.6A
SCP10-2510
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Current [A]• @• i60sec loading• j
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Dielectric Breakdown Voltage
Voltage Source
V
A
SCP14-3010
SCP12-2510
SCP10-2510
0.2mm Pitch
0.175mm
Pitch
0.15mm Pitch
AC 400V (for 1 minute)
AC 400V (for 1 minute)
AC 300V (for 1 minute)
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Impedance - S 11 Short Measurement
Impedance
6GHz
1GHz
10GHz
Smith Chart
Conductor Plate
(Short Terminated)
50M~ 10.05GHz
Measured at 0.150mm pitch
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Inductance
SPICE Equivalent Circuit Model Simulation
by S-NAP Circuit Simulator
DUT=SCP10-2510BP
Inductance
L [nH]
3
2
1
0
0.71nH
Pin Inductance
0 1 2 3 4 5 6
Frequency [GHz]
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Operating Frequency
(Insertion Loss)
Insertion Loss
(S 21 Through Measurement )
Frequency [GHz]
DUT=SCP10-2510BP
0
0 2 4 6 8 10 12 14 16 18 20
Insertion Loss [dB]
-3
-6
-9
?3dB
P0.15 S1G1 GO05
SG
Pitch=0.15mm
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Signal Integrity
(TDT Measurement)
Voltage
Voltage
[V]
[V]
2.5 2.5
2.0 2.0
1.5 1.5
1.0 1.0
0.5
Signal Delay (TDT Measured Data)
Response at 50ps Rise Time
Source
Response :: SCP10-2510BP (SG)
0.0 0.0
700 700 800 800 900 900 1000 1100 1200 1300 1400 1500 1600 1700
Time [ps]
SWTW 2002
Rise Time [ps]
Source
Response
Delay [ps]
50 58.6 20.8
100 108.3 22.6
200 208.4 24.7
300 309.0 26.4
400 406.9 28.6
500 506.9 30.0

Force / Resistance - Travel Curve
Average = 3.81gf @170um OD
SCP10-2510
DC Ressistance / Spring Force
SCP10-2510
Spring Force [gf]
30
25
20
15
10
5
1500
1250
1000
750
500
250
DC Resistance [m-ohm]
0
0 100 200
Travel [micro-m]
0
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CRES vs Touchdowns
Resistance
[m? ]
1000
800
600
400
200
0
Resistance Measurements
Durable Test Travel : 100?m
Resistance is Measured at 100?m Travel
MAX
AVE
MIN
100 1,000 10,000 100, 000 1,000,000
Number of Touchdowns
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Solder Bump Deformation After Probing
• Temp.: 85 degree
• O.D. : 170 um
* Contact Deformation Diameter
is measured on Xaxis
Top View
of Non-Contact
Solder Bump
First
contact
3 times
contact
6 times
contact
* * *
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Ball Deformation Measurement
Temp.: 85 degree TD: 1 time OD: 170um
1.77um
35um
Before Contact
After Contact
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Probe Alignment at 85 o C
DY µm
40
30
20
10
0
-10
-20
-30
15µm
✟
Series1
Series2
Series3
1000 TD
Series4
Series5
300K TD
Condition
Number of probes: 40pins
Number of DUT: Single
-40
-40 -20 0 20 40
DX µ m
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Planarity
20 um
15 um
10 um
Planarity
5 um
0 um
-5 um
-10 um
-15 um
-20 um
5µm
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Condition
Number of probes: 40pins
Number of DUT: Single

Cleaning Procedure
?Cleaning Sheet
Lapping film with 1-µm grain size
?Conditions
? OD : 100 µm
? Wiping action : 150 µm
? Number Touchdowns : 5~ 10
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Tip Cleaning
Number of Wipes
Initial
3K TDs 5 Times 10 Times 20 Times 30 Times
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Specifications
? Alignment : ±15 um
? Planarity : ±15 um
? Minimum Pitch : 150 um
? Material : P7, Steel
? Tip Diameter : 75 -100 um
? Tip Length : 250-300 20 um
? Contact Resistance : less than 1 ohm
? Contact Force : 4.1 - 6 g
? Recommended OD : 170 - 200 um
? Maximum Current : 500 mA
? Temperature Range : 25 - 85 o C
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Road Map
2000 2001 2002 2003
2004
PITCH
200um
150um
Temp.
85?
150?
Array size
50 50 mm
100 100 mm
Max. Pin
1,000 1,500 3000 8000
2000
2001
2002
2003
2004
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Summary
?New solution for area arrays.
?Stable mechanical and electrical performance.
?Very easy to repair.
?Proven in production at multiple sites.
SWTW 2002