3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...

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Challenges in Fine Pitch Probing •SoC – Pad pitch shrink • 30μm pitch – Stable contact with low force – Avoid pad damage •Low-k • CUP (Circuit Under Pad) – Multi dut Probing June 3-6, 3 2007 IEEE SW Test Workshop 8
Development of 3D-MEMS Probe • Develop fine pitch cantilever with mechanical endurance • Achieve lower contact force with good contact resistance • Achieve precise xyz alignment in actual probe layout June 3-6, 3 2007 IEEE SW Test Workshop 9
Page 1 and 2: 3D-MEMS Probe for Fine Pitch Probin
Page 3 and 4: 1. Introduction June 3-6, 3 2007 IE
Page 5 and 6: Application of 3D-MEMS probe (MA) S
Page 7: Challenges in Fine Pitch Probing
Page 11 and 12: 3D-MEMS Probe Process Sacrificial l
Page 13 and 14: Evaluation Items •Individual fine
Page 15 and 16: Cres (Ω) Contact Resistance(Au Pla
Page 17 and 18: Image of Contact Tip Wear TD : 0 TD
Page 19 and 20: SEM Image of Probes June 3-6, 3 200
Page 21 and 22: XY Alignment (after 1M TD) 10 8 6 4
Page 23 and 24: Planarity (After 1M TD) 20 15 Plana
Page 25 and 26: 4. Conclusions June 3-6, 3 2007 IEE
Page 27 and 28: 5. Next Steps June 3-6, 3 2007 IEEE
Page 29: Thank You. June 3-6, 3 2007 IEEE SW

3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...

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