3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...
3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...
3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...
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Challenges in <strong>Fine</strong> <strong>Pitch</strong> <strong>Probing</strong><br />
•SoC<br />
– Pad pitch shrink<br />
• 30μm pitch<br />
– Stable contact with low <strong>for</strong>ce<br />
– Avoid pad damage<br />
•Low-k<br />
• CUP (Circuit Under Pad)<br />
– Multi dut <strong>Probing</strong><br />
June 3-6, 3<br />
2007 IEEE SW <strong>Test</strong> Workshop 8
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