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3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...

3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...

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Challenges in <strong>Fine</strong> <strong>Pitch</strong> <strong>Probing</strong><br />

• LCD-driver<br />

– Pad pitch shrink<br />

•20μm staggered, 24μm inline<br />

– Stable contact with low <strong>for</strong>ce<br />

– Avoid gold bump damage<br />

– Multi dut probing<br />

June 3-6, 3<br />

2007 IEEE SW <strong>Test</strong> Workshop 7

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