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3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...

3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...

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Conclusions<br />

1. <strong>Fine</strong> pitch cantilever (MA) has been<br />

developed by using the <strong>3D</strong>-<strong>MEMS</strong><br />

probe technology.<br />

2. Excellent contact with low <strong>for</strong>ce (0.2gf)<br />

against Au plated wafer.<br />

3. Mechanical stability over 1M<br />

touchdowns has been achieved.<br />

4. Evaluation on the actual device has<br />

been demonstrated.<br />

June 3-6, 3<br />

2007 IEEE SW <strong>Test</strong> Workshop 26

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