3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...
3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...
3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...
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Conclusions<br />
1. <strong>Fine</strong> pitch cantilever (MA) has been<br />
developed by using the <strong>3D</strong>-<strong>MEMS</strong><br />
probe technology.<br />
2. Excellent contact with low <strong>for</strong>ce (0.2gf)<br />
against Au plated wafer.<br />
3. Mechanical stability over 1M<br />
touchdowns has been achieved.<br />
4. Evaluation on the actual device has<br />
been demonstrated.<br />
June 3-6, 3<br />
2007 IEEE SW <strong>Test</strong> Workshop 26