3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...

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XY Alignment (Initial) 10 8 6 4 Target 2 ⊿Y [μm ] 0 -10 -8 -6 -4 -2 -2 0 2 4 6 8 10 -4 -6 -8 -10 ⊿X [μm ] June 3-6, 3 2007 IEEE SW <strong>Test</strong> Workshop 20
XY Alignment (after 1M TD) 10 8 6 4 2 Target ⊿Y [μm ] 0 -10 -8 -6 -4 -2 -2 0 2 4 6 8 10 -4 -6 -8 -10 ⊿X [μm ] June 3-6, 3 2007 IEEE SW <strong>Test</strong> Workshop 21
Page 1 and 2: 3D-MEMS Probe for Fine Pitch Probin
Page 3 and 4: 1. Introduction June 3-6, 3 2007 IE
Page 5 and 6: Application of 3D-MEMS probe (MA) S
Page 7 and 8: Challenges in Fine Pitch Probing
Page 9 and 10: Development of 3D-MEMS Probe • De
Page 11 and 12: 3D-MEMS Probe Process Sacrificial l
Page 13 and 14: Evaluation Items •Individual fine
Page 15 and 16: Cres (Ω) Contact Resistance(Au Pla
Page 17 and 18: Image of Contact Tip Wear TD : 0 TD
Page 19: SEM Image of Probes June 3-6, 3 200
Page 23 and 24: Planarity (After 1M TD) 20 15 Plana
Page 25 and 26: 4. Conclusions June 3-6, 3 2007 IEE
Page 27 and 28: 5. Next Steps June 3-6, 3 2007 IEEE
Page 29: Thank You. June 3-6, 3 2007 IEEE SW

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