3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...

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Contact Force / Scrub Mark / OT 0.7 7 Contact force(gf) 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 Over travel(um) Max. Contact Force Min. Contact Force Scrub mark 6 5 4 3 2 1 Scrub mark(um) June 3-6, 3 2007 IEEE SW Test Workshop 14
Cres (Ω) Contact Resistance(Au Plated 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 Wafer) 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 Probe Force(g) force Tip material June 3-6, 3 2007 IEEE SW Test Workshop 15 A B C D E F
Page 1 and 2: 3D-MEMS Probe for Fine Pitch Probin
Page 3 and 4: 1. Introduction June 3-6, 3 2007 IE
Page 5 and 6: Application of 3D-MEMS probe (MA) S
Page 7 and 8: Challenges in Fine Pitch Probing
Page 9 and 10: Development of 3D-MEMS Probe • De
Page 11 and 12: 3D-MEMS Probe Process Sacrificial l
Page 13: Evaluation Items •Individual fine
Page 17 and 18: Image of Contact Tip Wear TD : 0 TD
Page 19 and 20: SEM Image of Probes June 3-6, 3 200
Page 21 and 22: XY Alignment (after 1M TD) 10 8 6 4
Page 23 and 24: Planarity (After 1M TD) 20 15 Plana
Page 25 and 26: 4. Conclusions June 3-6, 3 2007 IEE
Page 27 and 28: 5. Next Steps June 3-6, 3 2007 IEEE
Page 29: Thank You. June 3-6, 3 2007 IEEE SW

3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...

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