3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...
3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...
3D-MEMS Probe for Fine Pitch Probing - Semiconductor Wafer Test ...
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Evaluation Items<br />
•Individual fine pitch cantilever<br />
•Contact <strong>for</strong>ce/Scrub mark/OT<br />
•Contact resistance<br />
•Contact tip wear<br />
•Actual probe layout<br />
•XY alignment<br />
•Planarity<br />
•Actual device<br />
June 3-6, 3<br />
2007 IEEE SW <strong>Test</strong> Workshop 13