Non-Vacuum Deposition of Buffer Layers and SuperPower CRADA ...

Non-Vacuum Deposition of Buffer Layers and 

SuperPower CRADA: Budget: 400 K 

Presenter: Raghu N. Bhattacharya (NREL) and 

Maxim Martchevskii (SuperPower Inc.) 

Co-Authors: Wenjun Zhao (NREL), Jonathan 

Mann (NREL), Yi-Yuan Xie and Venkat 

Selvamanickam (SuperPower Inc.) 

Acknowledgements: Andrew Norman, Bobby 

To, Sovannary Phok, Anna Duda, Phil Parilla, 

Glenn Teeter and Lynn Gedvilas (NREL) 

Venue: Alexandria, VA; Date: August 4-6, 2009 

This work has been performed by an employee of the Alliance for Sustainable Energy, LLC under contract number DE-AC-36-08GO-28308 with the US. department of Energy. 

The United States Government retains a non-exclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this work, or allow others to do so, 

for United States Government purposes. 

NREL is a national laboratory of the U.S. Department of Energy Office of Energy Efficiency and Renewable Energy operated by the Alliance for Sustainable Energy, LLC

NREL AND SUPERPOWER INC. CRADA 

• We transferred the electrodeposited Custabilizer 

technology to SuperPower Inc. 

• We are developing electroplated Agstabilization 

layer directly on a YBCO 

superconductor. 

National Renewable Energy Laboratory 

Innovation for Our Energy Future

Electrodeposition Process 

Electrical variables: • Potentials (V) (half-cell potential, overpotential, …) 

• Current (I) 

• Coulombs (Q) 

Cu 2+ +2e – Cu 

Ag 1+ + e - Ag 

Electrical variables: 

• Mode (diffusion, convection) 

• Surface concentration 

• Adsorption 

Electrode variables: 

• Material 

• Surface area 

• Geometry 

• Surface condition 

Solution variables: 

• Bulk concentration of electroactive [C O , C R ] 

• Concentrations of other species (electrolyte, pH, …) 

• Solvent 



Electrodeposition 

Mass Transfer to an electrode is governed by the Nernst-Planck Equation: 

J i (x) = – D i δC(x)/ δx [diffusion] – (z i F/RT)D i C i δФ(x)/ δx [migration] 

+ C i v(x) [convection] 

Where 

J i (x) = Flux of the species i (mol sec -1 cm -2 ) at distance x from the surface 

D i = Diffusion coefficient (cm 2 /sec) 

δC(x)/ δx = Concentration gradient at distance x 

δФ(x)/ δx = Potential gradient 

z i = Charge; C i = Concentration of species i 

v(x) = The velocity (cm/sec) with which a volume element in solution moves along 

the axis 

F = Faraday constant (9.64846 x 10 4 C/equiv) 

R = Molar gas constant (8.31441 J mol -1 -K -1 ) 

The minus sign arises because the direction of the flux opposes the direction of 

increasing electrochemical potential 



Electrodeposition 

The diffusion-limited plating current, i d 

, for a single species is 

given by following Cottrell equation: 

i (t) = i d (t) = nFAD 0 

1/2 

C 0* / 1/2 t 1/2 

The limiting current, i l 

, when the largest rate of mass transfer 

occurs under stirring condition is given by the following equation: 

i l = nFAm 0 C 0 

* 

Both equations show that current density is directly proportional to 

the concentration of solution that can be optimized to obtain the 

desired amount of deposited material on the electrode surface. 

n = number of electrons involved in the reaction; F= Faraday 

constant; A = area; D o 

= diffusion coefficient, C o* 

= concentration of 

O in the bulk solution (far from the electrode), t = time; m 0 

= mass 

transfer coefficient. 



The Electrodeposition of Cu and Ag Films 

Cu 2+ + 2e - 

Cu (s) 

E = E 0 Cu + RT/2F ln [Cu2+ ] = 0.337 + 0.0295 log [Cu 2+ ] (vs. SHE) 

Cu 1+ + e - Cu (s) 

E = E 0 Cu + RT/F ln [Cu1+ ] = 0.520 + 0.0591 log [Cu + ] (vs. SHE) 

Ag 1+ + e - Ag (s) 

E = E 0 Ag + RT/F ln [Ag+ ] = 0.799 + 0.0591 log [Ag + ] (vs. SHE) 



Cyclic Voltammogram of Copper Solution 

Cu + + e - Cu 



Cyclic Voltammogram of Silver Solution 

Ag + + e - Ag 

Ag + + e - Ag 



SEM of Electrodeposited Ag 

ED-Ag from Perchlorate solution 

ED-Ag 

Glass/Mo 

ED-Ag 

Glass/Mo 

ED-Ag from AgNO 3 /Acetonitrile 



ED-Ag/YBCO from NH 4 OH and Water Based Solution 

ED-Ag 

SuperPower YBCO 

TEM shows the 

structure of ED- 

Ag/YBCO/Buffer 

Layers/NiW. 

The interface of 

Ag/YBCO is sharp. 

No interfacial reaction 

was observed. 

0.5m 

Substrate 




3.5m Ag 

TEM shows a 3.5 µm 

ED-Ag layer on YBCO 





Ag 

8 0 0 

6 0 0 

Ag A g 

A g 

A g 

Ac q u ir e E D X 

A g 

4 0 0 

A g 

2 0 0 

C u 

C u 

O C u 

A g 

A g 

A g 

C u 

C u 


2 0 0 

5 

1 0 

E n e r g y ( k e V ) 

C u 

Cu 

1 5 

1 5 0 

C u 

C u 

C u 

Ba 

B a 

B a 

1 0 0 

O 

Y 

B a 

B a 

Y 

TEM and EDS analysis show 

there is no interfacial reaction 

between Ag and YBCO. 

E 

5 0 

Y 

Y 

A g 

AgA g 

A g A g 

A g 

B a 

A g 

A g A g 

B a 

5 

B a 

B a 

C u 

1 0 

n e rg y (k e V ) 

Y 

1 5 



ED-Ag/YBCO from Acetonitrile Solution 

3m ED-Ag 

Clean Interface 


Substrate 



ED-Ag/YBCO from Acetonitrile Solution 

600 

Ag 

Ar 

Ag 

Ag 

Ar 

Acquire EDX 

ED-Ag 

Counts 

400 

Ag 

200 

O 

S 

SAg 

Ag Ba 

Ba 

Ba 

Ba 

Ba Ba 

Ag 

Ba 

Ba 

Ni 

Cu 

Ni 

Cu 

5 

10 

Energy (keV) 

15 

20 

250 

Cu 

Acquire EDX 

200 

Ni 

Cu 

Ba 

Ba 

Ba 


Counts 

150 

100 

50 

Cu 

Cu 

Ni 

Y 

Y 

Y 

Ag 

Ag 

Y Ag Ba 

Ag Ag 

Ag 

Ba 

Ba 

Ba 

Ba 

Ba 

Ni 

Ni 

Cu 

Y 

Y 

Y 

ED-Ag layer is very adhesive to YBCO 

5 

10 

Energy (keV) 

15 

20 



T c of ED-Silver/SuperPower YBCO 

Ag + 

NO 

- 

3 

NO 

- 

3 

NO 

- 

3 

Solution 

NH 4 OH, Water 

tert-pentylamine, EtOH, water, acetonitrile 

NH 4 OH, DMSO 

E-Beam 

Resistance (arbitrary) 

Water/Ammonia 

Acetonitrile/Amine 

DMSO/Ammonia 

80 

85 

90 

Temperature (K) 

95 

100 



ED-Buffer: Annealing Profile 

1000-1100° C 

25° C 

4-6 hours 5-9 hours 3-6 hours 

only crystallizes if the 

sample is annealed with 

~1 hour of the deposition. 

• Lower gas flow results in 

an apparent etching of 

the buffer. (HBr?) 

• The deposited layer(s) 

1500 mL/min Ar 

150-450 mL/min 10% H 2 in N 2 



ED-Buffer: Gd 2 O 3 /NiW 

ED Gd 2 O 3 deposited from acetonitrile 

(002) NiW 

(004) GO 

(020) NiW 

84nm Gd 2 O 3 

(-440) GO 

NiW 

Gd 2 O 3 layer is 84nm; no pores 


[110] GO // [200] NiW; 

(002) GO // (002) NiW 


ED-Buffer: Gd 2 O 3 /NiW (XPS; XRD) 

100 

ED Gd 2 O 3 deposited from DMSO 

80 

2500 

(004) 

Gd 2 

O 3 

Atomic Concentration (%) 

60 

40 

Gadolinium 

Oxygen 

Nickel 

Tungsten 

Counts 

2000 

1500 

1000 

20 

Carbon 

500 

0 

0 

20 40 60 80 

Sputter Time (min) 

100 

20 

25 

30 

35 

2 Theta 

40 

45 

50 

• Biaxially textured electrodeposited Gd 2 O 3 films on 

textured Ni-W 



ED-Buffer: Gd 2 O 3 /NiW (XRD) 

400 

300 

Counts 

200 

7.5º 

100 

0 

0 

50 

100 

150 

200 

250 

300 

350 

Phi (degrees) 

2500 

2000 

Counts 

1500 

1000 

8.9º 

500 

•Biaxially textured electrodeposited 

Gd 2 O 3 films on textured Ni-W 

5 

10 

15 20 

Omega (degrees) 

25 

30 




ED Gd 2 O 3 deposited from DMSO 

(002) NiW 

(004) GO 

56nm Gd 2 O 3 

(020) NiW 

(-440) GO 

NiW 

Gd 2 O 3 layer is 56nm; no pores 


[110] GO // [200] NiW; 

(002) GO // (002) NiW 


ED-Buffer: CeO 2 /NiW (XPS; XRD) 

100 

ED CeO 2 deposited from DMSO 

10x10 3 8 

80 

Oxygen 

(002) 

CeO 2 

Atomic Concentration (%) 

60 

40 

Cerium 

Nickel 

Tungsten 

Counts 

6 

4 

20 

0 

Carbon 

2 

(111) 

CeO 2 

0 

50 100 150 

Sputter Time (min) 

20 

25 

30 

35 

2 Theta 

40 

45 

50 

• Textured CeO 2 films deposit on textured Ni-W 



ED-Buffer: Surface Morphology 

Gd 2 O 3 /NiW 

• The Gd bath deposits a 

smooth Gd 2 O 3 film with no 

evidence of cracking. 

100 

μm 

CeO 2 /NiW 

• The Ce bath deposits a 

smooth CeO 2 film severely 

affected by thermal cracking. 

100 

μm 



ED-Buffer: CeO 2 /NiW 

CeO 2 

1 

2 

CeO 2 

3 

4 

CeO 2 

5 

cracks 

• No sharp interface was observed 

• Cracks within CeO 2 layer due to the thickness 

• EDS shows Ce presence in the marked areas. 



MOD-YBCO:Calcination & Conversion Profile 

Calcination 

Conversion 

500 

800 

1h 

0.5h 

Temperature (ºC) 

400 

300 

200 

humid O2 

3h 

15m 

Tempeature (ºC) 

600 

400 

T=500 

P O2 

=300ppm 

D.P.=39ºC 

P O2 

=300ppm 

dry 

0.5h 

dry O2 

100 

30m 

T=180ºC 

200 

0 

1 

2 

Time (hr) 

3 

4 

0.0 

0.5 

1.0 1.5 

Time (hr) 

2.0 

2.5 

3.0 

Precursor solution: Y-TFA; Ba-TFA; Cu-acetate with a molar ratio of 1:2:3 

(replace Cu-TFA with Cu-acetate to reduce HF) 



MOD-YBCO: IR Solution Aging Study 

0.4 

Precursor solution: Y-; Ba-; Cu-TFAs with a molar ratio of 1:1.7:3 

0.3 

Ligand Stretching 

Ligand Bending 

Absorbance 

0.2 

0.1 

Water 

Solvent 

M-C 

Bonds 

0.0 

3500 3000 2500 2000 1500 1000 500 

Wavvenumbers (1/cm) 

•TFA is stable in the gel and is not the cause of the ageing. 

•Exchange of the TFA ligands on any of the metals with water 

or methanol could cause the changes observed in the M-C 

stretching region. (Y(TFA) 3 

+ 2MeOH Y(TFA) 2 

(MeOH) 2 

) 

8.1 

8.2 

29 

20.1 

20.2 

23 

0 

•The observed changes, however, followed no pattern. 

480 440 400 

Wavvenumbers (1/cm) 



MOD-YBCO: TGA/DSC (1 deg/min in air) 

Precursor solution: Y-TFA; Ba-TFA; Cu-acetate with a molar ratio of 1:2:3 

Temperature range for decomposition 



MOD-YBCO/LAO: XRD Characterization 

(005) 

(006)+(002)LAO 

Intensity (a.u.) 

(001) 

(002) 

(003)+(001)LAO 

(004) 

(007) 

25 

10 

20 

30 

2 ( deg) 

40 

50 

60 

50 

20 

40 

x10 3 

15 

10 

5 

1.2 o 

x10 3 

30 

20 

10 

0.7 o 

0 

0 

18 

19 

20 

21 

22 

0 

50 

100 150 200 

Phi Scan 

250 

300 

350 

Omega Scan 



MOD-YBCO on LAO 

µV 

100 

80 

60 

40 

042109-3LAO 

Sample size: 0.5cm by 2cm 

Ic=19A 

Jc=1.9MA/cm 2 

20 

2.0 

10 

12 

14 

16 

A 

18 

20 

22 

24 

resistance ( 

1.5 

1.0 

0.5 

042109-3LAO 

Tc=89K ; K=1K 

0.0 

80 

90 

100 

110 

temperature (K) 

120 

130 



MOD-YBCO on LAO 

YBCO 

50nm 5nm LAO 

LAO 

The area right above LAO is composed of amorphous 

phases and nano-meter sized crystalline particles. 



MOD-YBCO on ED-GZO/CeO 2 

15x10 3 

001 002 

003 

004 

GO (002) 

GZO (004) 

005 

006 

020209-3GZG R=155 

020909-3GZC R=650 

10 

Intensity 

030609-3GZC R=1.1k 

5 

032009-2GZC R=440 

031609-1GZC R=350 

0 

10 20 

30 2 

40 

50 

60 




2500 

2000 

1500 

1000 

RC003 

020209-3 R=155 

Phi103 

600 

121808-3 R=140 

500 

020209-5 R=166 

400 10 o 

020209-6 R=125 

6 o 300 

200 

121708-4 020209-3 R=134 R=155 

020209-5 R=166 

020209-6 R=125 

121808-3 R=140 

500 

100 

5 

10 

15 

20 

0 

50 

100 

150 

200 

250 

300 

350 

020209-3 R=155 


020209-6Ni, R=125 020209-5Ni R=166 



YBCO 

Buffer 

Interfacial reaction layer 

20nm 

NiW 

The YBCO layer is composed of randomly 

oriented nanometer crystalline particles 




YBCO 

100nm 

NiW 

Buffer 

The YBCO layer is composed of randomly oriented nanometer 

crystalline particles 




From DMSO 

From DMSO 

From acetonitrile 

Gd 2 Zr 2 O 7 

Gd 2 O 3 

NiW 

Gd 2 O 3 

5nm 

5nm 

5nm 

NiW 

Pores 

Sharp interface; 

No pores 

Sharp interface; 

No pores 



NREL and SUPERPOWER Inc. CRADA 

Maxim Martcheskii (SuperPower Inc.) 



Objective of developing a non-aqueous copper 

electrodeposition process at SuperPower 

In the standard surround copper stabilized (SCS) 2G wire manufacturing 

process, 1 to 2 microns of silver is normally required for acidic copper 

electroplating. Last year, we reported promising results on copper 

electrodeposition on REBCO samples with silver coating as thin as 0.1 m. 

The main objective of this CRADA work is to transfer the technology from 

NREL to SuperPower, and SuperPower will scale up from R&D to production. 

This will help increase the process throughout and reduce cost.

Advantages of NREL electrodeposition 

technique using new chemistry 

• The new chemistry for copper electrodeposition is a non aqueous 

solution and is benign enough to be applied directly to the REBCO layer. 

Therefore silver layer thickness may be significantly reduced. Pinholes in 

the silver layer will not lead to a degradation of the superconductivity 

• Good ability to overcoat various surfaces, even with poor conductivity. 

No pre-treatment in the “strike” solution is required. Under right conditions 

a dense, microcrystalline copper layer with very low porosity is deposited 

• Good adhesion of the deposited copper layer to the silver

Aim is to develop a new cost-effective 

stabilization process for the SCS type conductor: 

1. Deposition of a very thin (~ 0.1-0.5 m) silver layer 

2. Electrodepostion of ~1.0-5.0 m thick “protective” 

copper layer using the non-aqueous NREL process 

3. Electroplating of copper stabilizer up to the desired 

thickness using a conventional process with aqueous 

plating solution

Activities in the review period 

• SuperPower scientist (M.M.) visited NREL to get familiar with the 

new chemistry and the details of the new electrodeposition process 

• A series of experiments has been done at SuperPower at lab scale 

to optimize the process condition, minimize I c degradation and 

ensure reproducibility of the results. Scale-up to meter length has 

been attempted 

• SuperPower is currently working with commercial electroplating 

plant to establish a production line with new chemistry and perform 

reel-to-reel electroplating trials at 100+ meter long wire segments

Electrodepostion experiments at SuperPower 

Research Center (UH) 

Electrodeposition apparatus with non-aqueous solution bath was set up at 

SuperPower (UH location) for short sample experiments. 

Rate of Electrodeposition 

Copper layer 

thickness (mm) 

25 

20 

15 

10 

5 

0 

0 10 20 30 40 

Time (min) 

Rate is 0.6-0.7 

m/min

Test run on short samples: varying 

the electrodeposition parameters 

• 15 samples with 0.5 m Ag overlayer 20 cm long each are processed with 

different electrodeposition parameters. Non-contact I c s of the samples are 

tested before and after the electrodeposition. 

Non-contact I c 

(A) 

250 

200 

150 

100 

50 

0 

77 K 

1 

MOCVD-REBCO tape with 0.5 m Ag overlayer 

After EDP using non-aqueous solution 

2 

3 

4 

5 

6 

7 

8 

0 

0 100 200 300 

9 

10 

Position (cm) 

11 

12 

13 

14 

15 

325 

260 

195 

130 

65 

Sample 

# 

Current 

(A) 

Time 

(min) 

1 0.4 2 

2 0.4 3 

3 0.4 4 

4 0.4 5 

5 0.64 1 

6 0.64 2 

7 0.65 3 

8 0.64 4 

9 0.64 5 

10 1.02 1 

11 1.02 2 

12 0.5 4 

13 0.5 4 

14 0.5 4 

15 0.4 1 

Some degradation of I c 

occurs, mostly in samples plated at lower current density

Investigating the reasons for degradation 

2D magnetic field penetration maps reveal some local degradation spots 

developed after electrodeposition in non-aqueous solution. 

Original: 

After non-aqueous electrodeposition: 

15 

Sample # 

1 

When acidic copper plating was subsequently performed on these 

samples at the commercial plant, delamination of all samples occurred.

Preventing delamination 

Additional in-house acidic copper plating tests on the short samples preplated 

with NREL chemistry show that delamination indeed occurs due 

to lateral etching of the REBCO layer at exposed sides or pinholes, not 

due to poor overall adhesion of the NREL copper. 

Acidic copper electroplated on top of NREL copper: 

Cu delaminated due 

to the REBCO layer 

etched laterally 

from the cut side 

Protection of edges, cut lines and welding spots is obviously required 

to prevent exposure of the REBCO layer to the acidic solution when 

doing short sample experiments.

Test run on short samples: 

Modified NREL electroplating step 

• Test if the NREL copper deposited to different thicknesses provides enough 

protection to the REBCO layer during acidic electroplating process. 

• Five samples with 0.5 m Ag overlayer were deposited 

sample Time, min Thickness, m 

1 12 3.85 

2 13 4.16 

3 6 1.9 

4 6 1.9 

5 20 6.4 

• After the electrodeposition, the samples were spot welded in a single piece 

and plated for another ~3-4 min in the NREL solution along the welding lines, 

including pieces of the leader tape. 

• In this way a continuous copper coating was achieved, similar to what 

would be a result of a reel-to-reel plating. The additional deposited 1.5-2.0 

m thick copper layer protects exposed REBCO at the edges and welding 

spots from the exposure to the acidic bath.

Test run on short samples: 

Acidic plating step 

The samples were next 

processed at the electroplating 

plant using the regular acidic 

plating process. 

20 micron of copper was plated 

at each of the sample side. 

Five samples with electrodeposited NREL copper at thickness 3-8 m 

showed very uniform copper coating after the above modifications of 

electroplating procedures

Samples with 3-8 m of electrodeposited NREL 

copper demonstrate excellent I c retention after 

the acidic plating step 

Non-contact I c test shows: 

• some degradation 

occurs in samples 2, 3 

and 5 during the nonaqueous 

plating step. 

There is no apparent 

correlation between the 

degree of degradation 

and the plating time. 

I c 

(A) 

250 

200 

150 

100 

50 

Original 

After NREL Cu 

After acidic Cu 

• no global or local 

degradation occurs at the 

acidic plating step except 

at the end of sample 1. 

0 

5 4 3 2 1 

0 20 40 60 80 100 120 

x (cm)

Scaling up to 1 m length in a batch mode 

• To process HTS tapes at ~1 m length they are wound on a mandrel, 

fully immersed into the non-aqueous solution and used as cathode 

• In the first test run, a 1.15 m long wire with 0.5 m Ag overlayer was 

processed. 

• Copper layer of very “dull” appearance with numerous dark areas 

160 

along the wire was obtained 

140 

120 

before EDP 

after EDP 

U (V) 

100 

80 

60 

I c 

=65 A 

I c 

=317 A 

40 

20 

0 

0 50 100 150 200 250 300 350 

I (A) 

Severe degradation of I c is observed. 

The degradation spots seem to be 

distributed randomly along the length

Optimization of the electrodeposition conditions 

improved Cu deposit and eliminated I c degradation 

• Another ~ 40 cm long wire also with 0.5 m Ag overlayer was plated at 

different conditions 

• After the electrodeposition the copper layer appearance is much more 

uniform and there is only a minor (3%) degradation of the transport I c . 

40 

I c =311 A 

U (V) 

30 

20 

10 

before EDP 

after EDP 

I c =301 A 

Before deposition 

0 

0 50 100 150 200 250 300 350 

I (A) 

After deposition

Conclusions 

• Short samples with 0.5 m Ag overlayer have been processed at 

SuperPower with non-aqueous solution developed at NREL. Good I c 

retention is seen in a number of samples while some samples show local 

degradation to REBCO at low current densities. Investigation and 

consultations with NREL are underway to identify and eliminate the 

degradation cause 

• Electrodeposited NREL copper layer at thickness 3-8 m provides 

effective protection to the REBCO layer in the conventional electroplating 

process with aqueous solution 

•A 40 cm long wire processed at optimum conditions showed uniform 

copper layer and good I c retention of 97% 

Our plan is to assure consistence of I c retention and absence of 

REBCO degradation at the R&D scale, then scale up the process 

for production in the next FY.

Conclusions 

• We transferred the electrodeposited Cu-stabilizer technology 

to SuperPower Inc. 

• ED Silver Stabilizer Layer 

• ED-Ag YBCO superconductivity is minimally affected 

• ED Buffer Layers for NiW 

• Gd 2 O 3 layers are superior to Gd 2 Zr 2 O 7 layers 

• MOD YBCO Superconducting Films 

• MOD solution is stable except for ligand exchange 

• High quality YBCO thin films were produced by MOD, 

with T c at 89K (K=1K) and J c =1.9 MA/cm 2 

• The optimization of MOD conditions is required for YBCO 

on buffered metallic substrate. 



FY 2009 Plan/Results 

• Continue optimization of electrodeposited Cu stabilizer 

on YBCO-coated conductor. CRADA with 

SuperPower. Transfer the technology to SuperPower. 

Task completed. 

• Continue optimization of electrodeposited biaxially 

textured buffer layers for YBCO HTS. Task in 

progress. 

• Prepare MOD YBCO on textured electrodeposited 

buffer layers: In-house and industrial collaborative 

effort. Task in Progress. 

• Optimize non-vacuum techniques (electrodeposition 

and spray deposition) for producing YBCO 

superconductor. Discontinued. 

Additional task of electrodeposited Ag-stablization layer 



Research Collaboration and Integration 

• NREL-SuperPower Inc.: working together on 

electrodeposited Cu and Ag stabilization layer 

• General R&D collaboration with AMSC (received long 

length of textured Ni-W substrates) and ORNL on 

RABiTS based YBCO coated conductors 



Publication 

We are in a process of publishing a book on “High 

Temperature Superconductors,” edited by Raghu N. 

Bhattacharya and Mariappan Paranthaman. This book will be 

published by WILEY-VCH Verlag Gmbh & Co. KGaA, 

Weinheim. The contributors are Kaname Matsumoto 

(Kyushu Institute of Technology), Rudeger H. T. Wilke 

(Penn State), Sergey L. Bud’ko (Ames Laboratory), Paul C. 

Canfield (Iowa State University), Douglas K. Finnemore 

(Iowa State University), Judy Wu (U. Kansas), Hua Zhao (U. 

Kansas), Dave Christen (ORNL), Jim Thompson (ORNL), 

C. V. Varanasi (Air Force Research Laboratory), P. N. 

Barnes (Air Force Research Laboratory), Victor Maroni 

(ANL), Mariappan Paranthamann (ORNL), Raghu N. 

Bhattacharya (NREL) and others. 



FY 2010 Plan 

• Consistent with the project’s purpose and successful technology 

transfer to SuperPower in FY 2009, our plan for FY 2010 is to 

continue working with SuperPower in Cu-stabilization layer 

development ED-Ag and also to develop electrodeposited Ag-stabilization 

layer for YBCO superconductor. 

• ED Silver Stabilizer Layer 

• Improve uniformity of deposition (electrolytes) 

• Decrease impact on YBCO 

• ED Buffer Layers for NiW 

• Optimize deposition of CeO 2 on Gd 2 O 3 

• MOD YBCO Superconducting Films 

• Optimize calcination/annealing profiles on buffered NiW 

• Produce high quality MOD-YBCO films on ED-buffer layer

Non-Vacuum Deposition of Buffer Layers and SuperPower CRADA ...

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