PHB108NQ03LT N-channel TrenchMOS logic level FET

PHB108NQ03LT 

N-channel TrenchMOS logic level FET 

Rev. 04 — 2 February 2009 

Product data sheet 

1. Product profile 

1.1 General description 

Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic 

package using TrenchMOS technology. This product is designed and qualified for use in 

computing, communications, consumer and industrial applications only. 

1.2 Features and benefits 

• Low conduction losses due to low 

on-state resistance 

• Simple gate drive required due to low 

gate charge 

• Suitable for logic level gate drive 

sources 

1.3 Applications 

• DC-to-DC convertors 

• Switched-mode power supplies 

1.4 Quick reference data 

Table 1. 

Quick reference 

Symbol Parameter Conditions Min Typ Max Unit 

V DS drain-source voltage T j ≥ 25 °C; T j ≤ 175 °C - - 25 V 

I D drain current T mb =25°C; V GS =5V; 

- - 75 A 

see Figure 1; see Figure 3 

P tot total power 

T mb = 25 °C; see Figure 2 - - 187 W 

dissipation 

Dynamic characteristics 

Q GD gate-drain charge V GS = 4.5 V; I D =25A; 

V DS =12V; T j =25°C; 


- 5.6 - nC 

Static characteristics 

R DSon drain-source 

on-state resistance 

V GS =10V; I D =25A; 

T j = 25 °C; see Figure 10; 

see Figure 11 

- 5.3 6 mΩ

NXP Semiconductors 



2. Pinning information 

Table 2. 

Pinning information 

Pin Symbol Description Simplified outline Graphic symbol 

1 G gate 

2 D drain [1] 

mb 

3 S source 

mb D mounting base; connected to 

drain 

2 

1 3 

SOT404 

(D2PAK) 

G 

mbb076 

D 

S 

[1] It is not possible to make a connection to pin 2 

3. Ordering information 

Table 3. Ordering information 

Type number Package 

Name Description Version 

PHB108NQ03LT D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads (one 

lead cropped) 

SOT404 

PHB108NQ03LT_4 

© NXP B.V. 2009. All rights reserved. 

Product data sheet Rev. 04 — 2 February 2009 2 of 14




4. Limiting values 

Table 4. Limiting values 

In accordance with the Absolute Maximum Rating System (IEC 60134). 

Symbol Parameter Conditions Min Max Unit 

V DS drain-source voltage T j ≥ 25 °C; T j ≤ 175 °C - 25 V 

V DGR drain-gate voltage T j ≥ 25 °C; T j ≤ 175 °C; R GS =20kΩ - 25 V 

V GS gate-source voltage -20 20 V 

I D drain current V GS =5V; T mb =25°C; see Figure 1; 

- 75 A 

see Figure 3 

V GS =5V; T mb = 100 °C; see Figure 1 - 75 A 

I DM peak drain current t p ≤ 10 µs; pulsed; T mb =25°C; 

- 240 A 

see Figure 3 

P tot total power dissipation T mb =25°C; see Figure 2 - 187 W 

T stg storage temperature -55 175 °C 

T j junction temperature -55 175 °C 

Source-drain diode 

I S source current T mb =25°C - 75 A 

I SM peak source current t p ≤ 10 µs; pulsed; T mb =25°C - 240 A 

Avalance ruggedness 

E DS(AL)S 

non-repetitive 

drain-source avalanche 

energy 

V GS =10V; T j(init) =25°C; I D =43A; V sup ≤ 25 V; 

unclamped; t p = 0.25 ms; R GS =50Ω 

- 180 mJ 







120 

03ar58 

120 

03aa16 

I der 

(%) 

P der 

(%) 

80 

80 

40 

40 

0 

0 50 100 150 200 

T mb (°C) 

0 

0 50 100 150 200 

T mb (°C) 

Fig 1. 

Normalized continuous drain current as a 

function of mounting base temperature 

Fig 2. 

Normalized total power dissipation as a 

function of mounting base temperature 

10 3 1 10 10 2 

03ar59 

I D 

(A) 

Limit R DSon = V DS / I D 

t p = 10 µs 

10 2 

100 μs 

10 

DC 

1 ms 

10 ms 

1 

V DS (V) 

Fig 3. 

Safe operating area; continuous and peak drain currents as a function of drain-source voltage 







5. Thermal characteristics 

Table 5. 

Thermal characteristics 


R th(j-a) 

R th(j-mb) 

thermal resistance from 

junction to ambient 

thermal resistance from 

junction to mounting 

base 

vertical in still air; mounted on a 

printed-circuit board; minimum footprint 

- 50 - K/W 

see Figure 4 - - 0.8 K/W 

1 

Z th(j-mb) 

(K/W) 

10 -1 

δ = 0.5 

0.2 

0.1 

03ar60 

0.05 

0.02 

P 

t p 

δ = 

T 

10 -2 

single pulse 

10 -5 10 -4 10 -3 10 -2 10 -1 1 

t p (s) 

t p 

T 

t 

Fig 4. 

Transient thermal impedance from junction to mounting base as a function of pulse duration 







6. Characteristics 

Table 6. 

Characteristics 


Static characteristics 

V (BR)DSS drain-source 

I D =250µA; V GS =0V; T j =-55°C 22 - - V 

breakdown voltage 

I D =250µA; V GS =0V; T j =25°C 25 - - V 

V GS(th) 

gate-source threshold 

voltage 

I D =1mA; V DS = V GS ; T j = 175 °C; 


I D =1mA; V DS = V GS ; T j =-55°C; 


I D =1mA; V DS = V GS ; T j =25°C; 


0.5 - - V 

- - 2.2 V 

1 1.5 2 V 

I DSS drain leakage current V DS =25V; V GS =0V; T j = 175 °C - - 500 µA 

V DS =25V; V GS =0V; T j = 25 °C - - 1 µA 

I GSS gate leakage current V GS =10V; V DS =0V; T j = 25 °C - 0.02 100 nA 

V GS =-10V; V DS =0V; T j = 25 °C - 0.02 100 nA 

R DSon 

drain-source on-state 

resistance 

V GS =5V; I D =25A; T j =175°C; 


V GS =10V; I D =25A; T j =25°C; 


V GS =5V; I D =25A; T j =25°C; 


- 12.1 13.5 mΩ 

- 5.3 6 mΩ 

- 6.7 7.5 mΩ 

R G internal gate resistance f=1MHz; T j =25°C - 1.2 - Ω 

(AC) 

Dynamic characteristics 

Q G(tot) total gate charge I D =25A; V DS =12V; V GS =4.5V; 

- 16.3 - nC 

T j =25°C; see Figure 12; 

see Figure 13 

I D =0A; V DS =0V; V GS =4.5V; 

- 12.5 - nC 

T j =25°C 

Q GS gate-source charge I D =25A; V DS =12V; V GS =4.5V; 

- 4 - nC 

Q 

T j =25°C; see Figure 12; 

GS1 pre-threshold 

gate-source charge 

see Figure 13 

- 2.5 - nC 

Q GS2 post-threshold 

- 1.5 - nC 

gate-source charge 

Q GD gate-drain charge - 5.6 - nC 

V GS(pl) 

gate-source plateau 

voltage 

I D =25A; V DS =12V; T j =25°C; 


C iss input capacitance V DS =12V; V GS = 0 V; f = 1 MHz; 

T j =25°C; see Figure 14 

V DS =0V; V GS =0V; f=1MHz; 

T j =25°C 

C oss output capacitance V DS =12V; V GS = 0 V; f = 1 MHz; 

C rss reverse transfer 

T j =25°C; see Figure 14 

capacitance 

- 2.4 - V 

- 1375 - pF 

- 2120 - pF 

- 640 - pF 

- 250 - pF 







Table 6. 

Characteristics …continued 


t d(on) turn-on delay time V DS =12V; R L =0.5Ω; V GS =4.5V; 

- 15 - ns 

t r rise time 

R G(ext) =5.6Ω; T j =25°C 

- 38 - ns 

t d(off) turn-off delay time - 32 - ns 

t f fall time - 25 - ns 

Source-drain diode 

V SD source-drain voltage I S =25A; V GS =0V; T j =25°C; 

- 0.86 1.2 V 

see Figure 15 

t rr reverse recovery time I S =20A; dI S /dt = -100 A/µs; V GS =0V; 

- 34 - ns 

Q r recovered charge 

V DS =25V; T j =25°C 

- 21 - nC 

80 

I D 

(A) 

V GS (V) = 

10 6 5 4.5 

4 

03ar61 

3.5 

80 

I D 

(A) 

03ar63 

60 

60 

3 

40 

40 

20 

2.5 

20 

T j = 175 °C 25 °C 

2 

0 

0 0.2 0.4 0.6 0.8 1 

V DS (V) 

0 

0 1 2 3 4 

V GS (V) 

Fig 5. 

Output characteristics: drain current as a 

function of drain-source voltage; typical values 

Fig 6. 

Transfer characteristics: drain current as a 

function of gate-source voltage; typical values 







4000 

03ar67 

2.5 

03aa33 

C 

(pF) 

3000 

C iss 

V GS(th) 

(V) 

2 

max 

1.5 

typ 

2000 

C rss 

1 

min 

1000 

0.5 

0 

0 2 4 6 8 10 

V GS (V) 

0 

-60 0 60 120 

T j (°C) 

180 

Fig 7. 

Input and reverse transfer capacitances as a 

function of gate-source voltage; typical values 

Fig 8. 

Gate-source threshold voltage as a function of 

junction temperature 

I D 

(A) 

10 -2 

03aa36 

15 

R DSon 

(mΩ) 

V GS (V) = 

03ar62 

3.5 

10 -3 

10 

4 

10 -4 

min 

typ 

10 -1 0 1 2 3 

max 

5 

4.5 

5 

6 

10 

10 -5 

10 -6 

V GS (V) 

0 

0 20 40 60 80 

I D (A) 

Fig 9. 

Sub-threshold drain current as a function of 

gate-source voltage 

Fig 10. Drain-source on-state resistance as a function 

of drain current; typical values 







a 

2 

03af18 

10 

V GS 

(V) 

I D = 25 A 

T j = 25 °C 

03ar64 

1.5 

8 

1 

6 

12 V 

V DS = 19 V 

4 

0.5 

2 

0 

-60 0 60 120 180 

T j (°C) 

0 

0 10 20 30 40 Q G (nC) 

Fig 11. Normalized drain-source on-state resistance 

factor as a function of junction temperature 

Fig 12. Gate-source voltage as a function of gate 

charge; typical values 

03ar66 

10 4 10 -1 1 10 10 2 

V DS 

C 

(pF) 

I D 

Q GS 

V GS(pl) 

10 3 

C iss 

V GS(th) 

V GS 

Q GS1 Q GS2 

Q GD 

C oss 

Q G(tot) 

Fig 13. Gate charge waveform definitions 

003aaa508 

10 2 

C rss 

V DS (V) 

Fig 14. Input, output and reverse transfer capacitances 

as a function of drain-source voltage; typical 

values 







80 

03ar65 

I S 

(A) 

60 

40 

20 

175 °C 

T j = 25 °C 

0 

0.2 0.4 0.6 0.8 1 1.2 

V SD (V) 

Fig 15. Source current as a function of source-drain voltage; typical values 







7. Package outline 

Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) 

SOT404 

A 

E 

A 1 

D 1 

mounting 

base 

D 

H D 

2 

1 3 

L p 

b 

c 

e 

e 

Q 

0 2.5 5 mm 

scale 

DIMENSIONS (mm are the original dimensions) 

UNIT 

mm 

A 

4.50 

4.10 

D 

A 1 b c 

D 

max. 1 

1.40 

1.27 

0.85 

0.60 

0.64 

0.46 

11 

1.60 

1.20 

E e L p H D Q 

10.30 

9.70 

2.54 

2.90 

2.10 

15.80 

14.80 

2.60 

2.20 

OUTLINE 

VERSION 

REFERENCES 

IEC JEDEC JEITA 

EUROPEAN 

PROJECTION 

ISSUE DATE 

SOT404 

05-02-11 

06-03-16 

Fig 16. Package outline SOT404 (D2PAK) 







8. Revision history 

Table 7. 

Revision history 

Document ID Release date Data sheet status Change notice Supersedes 

PHB108NQ03LT_4 20090202 Product data sheet - PHB_PHD_PHU108NQ03LT_3 

Modifications: 

PHB_PHD_PHU108NQ03LT_3 

(9397 750 14707) 

PHP_PHB_PHD108NQ03LT-02 

(9397 750 10159) 

PHP_PHB_PHD108NQ03LT-01 

(9397 750 09065) 

• The format of this data sheet has been redesigned to comply with the new identity 

guidelines of NXP Semiconductors. 

• Legal texts have been adapted to the new company name where appropriate. 

20050418 Product data sheet 2004070095 PHP_PHB_PHD108NQ03LT-02 

20020911 Product data - PHP_PHB_PHD108NQ03LT-01 

20011218 Product data - - 







9. Legal information 

9.1 Data sheet status 

Document status [1][2] Product status [3] Definition 

Objective [short] data sheet Development This document contains data from the objective specification for product development. 

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. 

Product [short] data sheet Production This document contains the product specification. 

[1] Please consult the most recently issued document before initiating or completing a design. 

[2] The term 'short data sheet' is explained in section "Definitions". 

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product 

status information is available on the Internet at URL http://www.nxp.com. 

9.2 Definitions 

Draft — The document is a draft version only. The content is still under 

internal review and subject to formal approval, which may result in 

modifications or additions. NXP Semiconductors does not give any 

representations or warranties as to the accuracy or completeness of 

information included herein and shall have no liability for the consequences of 

use of such information. 

Short data sheet — A short data sheet is an extract from a full data sheet 

with the same product type number(s) and title. A short data sheet is intended 

for quick reference only and should not be relied upon to contain detailed and 

full information. For detailed and full information see the relevant full data 

sheet, which is available on request via the local NXP Semiconductors sales 

office. In case of any inconsistency or conflict with the short data sheet, the 

full data sheet shall prevail. 

9.3 Disclaimers 

General — Information in this document is believed to be accurate and 

reliable. However, NXP Semiconductors does not give any representations or 

warranties, expressed or implied, as to the accuracy or completeness of such 

information and shall have no liability for the consequences of use of such 

information. 

Right to make changes — NXP Semiconductors reserves the right to make 

changes to information published in this document, including without 

limitation specifications and product descriptions, at any time and without 

notice. This document supersedes and replaces all information supplied prior 

to the publication hereof. 

Suitability for use — NXP Semiconductors products are not designed, 

authorized or warranted to be suitable for use in medical, military, aircraft, 

space or life support equipment, nor in applications where failure or 

malfunction of an NXP Semiconductors product can reasonably be expected 

to result in personal injury, death or severe property or environmental 

damage. NXP Semiconductors accepts no liability for inclusion and/or use of 

NXP Semiconductors products in such equipment or applications and 

therefore such inclusion and/or use is at the customer’s own risk. 

Applications — Applications that are described herein for any of these 

products are for illustrative purposes only. NXP Semiconductors makes no 

representation or warranty that such applications will be suitable for the 

specified use without further testing or modification. 

Quick reference data — The Quick reference data is an extract of the 

product data given in the Limiting values and Characteristics sections of this 

document, and as such is not complete, exhaustive or legally binding. 

Limiting values — Stress above one or more limiting values (as defined in 

the Absolute Maximum Ratings System of IEC 60134) may cause permanent 

damage to the device. Limiting values are stress ratings only and operation of 

the device at these or any other conditions above those given in the 

Characteristics sections of this document is not implied. Exposure to limiting 

values for extended periods may affect device reliability. 

Terms and conditions of sale — NXP Semiconductors products are sold 

subject to the general terms and conditions of commercial sale, as published 

at http://www.nxp.com/profile/terms, including those pertaining to warranty, 

intellectual property rights infringement and limitation of liability, unless 

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of 

any inconsistency or conflict between information in this document and such 

terms and conditions, the latter will prevail. 

No offer to sell or license — Nothing in this document may be interpreted or 

construed as an offer to sell products that is open for acceptance or the grant, 

conveyance or implication of any license under any copyrights, patents or 

other industrial or intellectual property rights. 

9.4 Trademarks 

Notice: All referenced brands, product names, service names and trademarks 

are the property of their respective owners. 

TrenchMOS — is a trademark of NXP B.V. 

10. Contact information 

For more information, please visit: http://www.nxp.com 

For sales office addresses, please send an email to: salesaddresses@nxp.com 







11. Contents 

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1 

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2 

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2 

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 

5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6 

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 11 

8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .12 

9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .13 

9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .13 

9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 

9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 

9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 

10 Contact information. . . . . . . . . . . . . . . . . . . . . .13 

Please be aware that important notices concerning this document and the product(s) 

described herein, have been included in section ‘Legal information’. 


For more information, please visit: http://www.nxp.com 

For sales office addresses, please send an email to: salesaddresses@nxp.com 

Date of release: 2 February 2009 

Document identifier: PHB108NQ03LT_4

PHB108NQ03LT N-channel TrenchMOS logic level FET

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