international directory of die attach & flip-chip bonders/aligners
international directory of die attach & flip-chip bonders/aligners
international directory of die attach & flip-chip bonders/aligners
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INTERNATIONAL DIRECTORY OF WIRE BONDERS<br />
Company<br />
Address<br />
Founded<br />
b Phone<br />
> Fax<br />
President CEO<br />
Advertisers are shown in Boldface type.<br />
Model #/Name<br />
x Introduced<br />
y Automation Level<br />
ÖMethod/Type<br />
p Primary Application<br />
u Secondary Application<br />
Bond Pitch Capability<br />
k Bonding Area (mm)<br />
P Conversion Time 1<br />
P Conversion Time 2<br />
t Bond Placement Repeatability<br />
£ Material<br />
Handling<br />
þ Package/<br />
Leadframe<br />
Dimensions<br />
(mm)<br />
jFootprint (W x D mm)<br />
Web Site<br />
Customer Contact<br />
and E-Mail<br />
b Phone<br />
> Fax<br />
Other Offices<br />
L<br />
E<br />
G<br />
E<br />
N<br />
D<br />
P Conversion<br />
Time<br />
1=Same leadframe<br />
type; 2=Different<br />
leadframe type<br />
Kaijo Corp.<br />
Hamura City<br />
Tokyo, Japan 205-8607<br />
1948<br />
Ryuzou Ohrui<br />
Kulicke & S<strong>of</strong>fa Inc.<br />
2101 Blair Mill Rd.<br />
Willow Grove, PA 19090<br />
1951<br />
b 215.784.6640<br />
C. Scott Kulicke<br />
Fb150 Series<br />
x 2000<br />
y Manual, Semi-automatic,<br />
Automatic<br />
ÖThermosonic gold bonder<br />
MPB Series<br />
x January 2000<br />
y Manual, Semi-automatic,<br />
Automatic<br />
ÖThermosonic gold bonder<br />
MAXµm<br />
x May 2002<br />
y Automatic<br />
ÖUltrasonic ball bonder<br />
Triton<br />
x March 2001<br />
y Automatic<br />
ÖThermosonic and<br />
ultrasonic wedge bonder<br />
Fine-pitch, standard ICs<br />
Large-area bonding<br />
Processors, logic, memory<br />
Hybrids<br />
Hoop leadframes<br />
FPDs<br />
Hybrids<br />
Opto/Ribbon<br />
50 µm<br />
50 µm<br />
45 µm@3Σ 50 µm@3Σ<br />
X: 55, Y: 65<br />
X: 117, Y: 117<br />
X: 56, Y: 66<br />
X: 63.5, Y: 63.5<br />
>5 min.*<br />
>5 min.*<br />
>5 min. 15 min.*<br />
>15 min.*<br />
>8 min.<br />
+65.880.9488<br />
Vince McTaggart, Program Manager<br />
vmctaggart@kns.com<br />
b 215.784.6819<br />
Palomar Technologies Inc.<br />
N See Die Attach<br />
Gold Bumper<br />
x July 2001<br />
y Automatic<br />
ÖThermosonic ball bonder<br />
Flip Chip<br />
Wireless<br />
80 µm<br />
X: 305, Y: 152<br />
N/A<br />
N/A<br />
±2.5 µm@3Σ<br />
£ Continuous<br />
bonding handlers,<br />
standard<br />
Auer boats,<br />
custom<br />
handling<br />
800 x 800<br />
palomartechnologies.com<br />
Jerry Jordan<br />
jjordan@<strong>bonders</strong>.com<br />
Shinkawa Ltd.<br />
N See Die Attach<br />
UTC-1000<br />
x 2001<br />
y Automatic<br />
ÖThermosonic gold<br />
ball bonder<br />
ICs<br />
MCMs/MCPs<br />
45 µm inline<br />
X: 55, Y: 65<br />
3 min.<br />
10 min.<br />
±2.5 µm@3Σ<br />
£ Flat carrier,<br />
strip, tape<br />
BGA<br />
þ L=95-262,<br />
W=20-80,<br />
T=0.07-0.7<br />
700 x 700<br />
shinkawa.com<br />
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makes it easy to find the right suppliers, quickly!<br />
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8Chip Scale Review’s<br />
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“Helping you do your job better”<br />
Chip Scale Review • August/September 2002 • [ChipScaleReview.com]<br />
Chip Scale Review August/September 2002 [ChipScaleReview.com] 41
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