international directory of die attach & flip-chip bonders/aligners
international directory of die attach & flip-chip bonders/aligners
international directory of die attach & flip-chip bonders/aligners
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INTERNATIONAL DIRECTORY OF DIE ATTACH & FLIP-CHIP BONDERS/ALIGNERS<br />
See detailed legend on page 37.<br />
F&K Delvotec<br />
Bondtechnik GmbH<br />
Daimlerstrasse 5-7<br />
85521 Ottobrunn, Germany<br />
1978<br />
b +49.89.62995.0<br />
Dr. Farhad Farassat<br />
x y<br />
4420 double-head <strong>die</strong> bonder<br />
x 1998<br />
y Manual, Semi-automatic,<br />
Automatic<br />
4501 single-station, large-area,<br />
multi-placement <strong>die</strong> bonder<br />
x January 2001<br />
y Automatic<br />
p<br />
COB<br />
Opto hybrids<br />
u<br />
SAW filters<br />
Flip Chip<br />
<br />
200 max.<br />
200 max.<br />
r<br />
±12 µm@3Σ<br />
±12 µm@3Σ<br />
Y<br />
.25-20 mm<br />
.25-20 mm<br />
Z 80 mm*<br />
80 mm*<br />
j 1200 x 1500<br />
1200 x 1500<br />
t<br />
A<br />
A, E, P<br />
b > <br />
fkdelvotec.com fkdelvotecusa.com<br />
Desmond Bradley<br />
desmond.bradley@de.fkdelvotec.com<br />
b +49.98.62995.120<br />
California: Rick Bailey, Sales Manager<br />
bailey.r@fkdelvotecusa.com<br />
b 949.595.2200<br />
*(10 µm@3Σ)<br />
Finetech Inc.<br />
1334 E. Chandler, Blvd., 5D2<br />
Phoenix, AZ 85048<br />
1992<br />
b 480.460.8777<br />
> 480.460.8778<br />
Gunter Kuerbis<br />
Opto-Bonder VA24P<br />
x 2001<br />
y Automatic<br />
Component assembly<br />
200<br />
5 µm@3Σ<br />
10 mm<br />
N/A<br />
950 x 600<br />
A, E, O*, P, S, T<br />
finetech.de<br />
Chris Underhill, General Manager<br />
finetech@cox.net<br />
*Thermosonic<br />
MRSI<br />
A Newport Corp. Company<br />
101 Billerica Ave.<br />
N. Billerica, MA 01862<br />
1984<br />
b 978.667.9449<br />
> 978.667.6109<br />
Neil Srivastava (VP/GM)<br />
MRSI-505<br />
x September 1996<br />
y Automatic<br />
MRSI-375<br />
x May 1998<br />
y Automatic<br />
Photonics<br />
ICs<br />
Microwave<br />
Flip Chip<br />
50-200<br />
50-300<br />
12 µm@3Σ<br />
10 µm@3Σ<br />
.20 mm, no max.<br />
.20 mm, no max.<br />
50 mm*<br />
33 mm*<br />
965 x 1320<br />
863 x 1194<br />
A, E, P, S<br />
A, E, P, S<br />
mrsigroup.com<br />
Daniel Crowley<br />
sales@mrsigroup.com<br />
MRSI Europe, Verbeekstraat 2<br />
2332 CA Leiden, The Netherlands<br />
Hans Siedsma, hsiedsma@mrsieurope.nl<br />
MRSI Asia Pacific, 190 Middle Road<br />
#19-05 Fortune Center, Singapore 188979<br />
Gheorghe Pascariu, gpascariu@mrsigroup.com<br />
MRSI-5005<br />
x July 2001<br />
y Automatic<br />
INTERNATIONAL DIRECTORY OF DIE ATTACH & FLIP-CHIP BONDERS/ALIGNERS<br />
See detailed legend on page 37.<br />
Palomar Technologies Inc.<br />
2330 Oak Ridge Way<br />
Vista, CA 92083<br />
1995<br />
b 760.931.3600<br />
> 760.931.3600<br />
Kevin Conlon<br />
Semiconductor Equipment Corp.<br />
5154 Goldman Ave.<br />
Moorpark, CA 93020<br />
1975<br />
b 805.529.2293<br />
> 805.529.2193<br />
Don Moore<br />
Shinkawa Ltd.<br />
Tokyo 208-8585, Japan<br />
1959<br />
b +81.42.560.1231<br />
Kenji Fujiyama<br />
Sysmelec<br />
Route de Berne 5<br />
CH-2076 Gals, Switzerland<br />
1982<br />
b 860.434.2708<br />
> 860.434.3079<br />
Jean-Claude Prèlaz<br />
x y<br />
3500-II automatic laser diode<br />
<strong>attach</strong> cell<br />
x March 2001<br />
y Automatic<br />
410XP precision <strong>die</strong> bonder<br />
x Not supplied<br />
y Semi-automatic<br />
SFB-200<br />
x 2002<br />
y Automatic<br />
SPA-300<br />
x 2001<br />
y Automatic<br />
SMB 1000<br />
x 2001<br />
y Automatic<br />
Singapore’s fastest emerging IC Assembly and Test manufacturing and engineering services *diagonal sizeprovider. In addition to<br />
value added services and leading edge test technology, UTAC’s strategic proximity within the ASEAN hub provides<br />
competitive logistic advantages and Asia’s highest rated IP protection.<br />
Chip Scale Review • August/September 2002 • [ChipScaleReview.com]<br />
38 Chip Scale Review August/September 2002 [ChipScaleReview.com]<br />
Photonics<br />
p<br />
Photonics<br />
FC <strong>attach</strong><br />
Epoxy <strong>die</strong> <strong>attach</strong><br />
Opto assembly<br />
Microwave u<br />
Flip Chip<br />
Flip Chip<br />
50-200<br />
<br />
100-200<br />
N/A<br />
150-200<br />
150-300<br />
100-200<br />
5 µm@3Σ<br />
r<br />
±5 µm@3Σ<br />
±1-2 µm<br />
±5 µm<br />
N/A<br />
±1 µm@3Σ<br />
.20 mm, no max. Y<br />
.178-50.8 mm<br />
.254-25.4 mm 2<br />
.3-3.0 mm<br />
.8-2.5 mm<br />
.20-2.4/9.5 mm*<br />
50 mm*<br />
Z<br />
50.8 mm*<br />
N/A<br />
N/A<br />
N/A<br />
55 mm (0.5 µm)<br />
812 x 1003<br />
j 1520 x 1070<br />
2032 x 1473<br />
1000 x 1100<br />
1365 x 1230<br />
1850 x 1865<br />
A, E, P, S<br />
t<br />
E<br />
A, E, P, S<br />
Thermosonic<br />
A<br />
A, E, P, S<br />
*Place to a force<br />
b > <br />
palomartechnologies.com<br />
Ed<strong>die</strong> Wills<br />
ewills@<strong>bonders</strong>.com<br />
*(0.3 µm)<br />
semicorp.com<br />
Lester Salvatierra, Sales Manager<br />
seclester@aol.com<br />
shinkawa.com<br />
Doug Day, General Manager<br />
d_day@shinkawausa.com<br />
b 480.831.7988<br />
Shinkawa USA: 1930 S. Alma School Rd.,<br />
D-107, Mesa, AZ 85210<br />
sysmelec.com<br />
Farid Assaf, VP<br />
f.assaf@sysmelec.com<br />
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