international directory of die attach & flip-chip bonders/aligners
international directory of die attach & flip-chip bonders/aligners
international directory of die attach & flip-chip bonders/aligners
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INTERNATIONAL DIRECTORY OF DIE ATTACH & FLIP-CHIP BONDERS/ALIGNERS<br />
Company<br />
Address<br />
Founded<br />
b Phone<br />
> Fax<br />
President CEO<br />
Advertisers are shown in Boldface type.<br />
Model #/Name<br />
x Introduced<br />
y Automation Level<br />
p Primary Application<br />
u Secondary Application<br />
Wafer-Size Capability (mm)<br />
r Placement Accuracy<br />
Y Die-Edge Length Capability<br />
Z Z-Axis Travel (Accuracy)<br />
jFootprint (mm)<br />
t Bonding Method<br />
Web Site<br />
Customer Contact<br />
and E-Mail<br />
b Phone<br />
> Fax<br />
Other Offices<br />
L<br />
E<br />
G<br />
E<br />
N<br />
D<br />
t Bonding Method<br />
A=Adhesive; E=Eutectic;<br />
F=Flux; O=Other;<br />
P=Preform; S=Solder;<br />
T=Tape<br />
Alphasem AG<br />
A Dover Technologies Company<br />
Andhauserstrasse 64<br />
CH-8572 Berg/TG, Switzerland 1979<br />
b +41.71.637.63.63<br />
> +41.71.637.63.64<br />
Hans Rudolf Meister<br />
Easyline 8032<br />
x May 2002<br />
y Automatic<br />
MLP/QFN<br />
SOIC, TSOP, PLCC, QFP<br />
100-200<br />
±38µm@3Σ<br />
.25-20.3 mm<br />
8 mm<br />
900 x 1100<br />
A<br />
alphasem.com<br />
Philippe Gaille, alphasem.sales@alphasem.com<br />
Alphasem Corp., 2117 S. 48th St., Ste. 106<br />
Tempe, AZ 85282<br />
b 602.431.6655<br />
ASM Pacific Technology<br />
4/F, Watson Centre<br />
16 Kung Yip St., Hong Kong<br />
1975<br />
b +852.2619.2000<br />
> +852.2619.2118<br />
Arthur H. del Prado<br />
AD 900 <strong>flip</strong>-<strong>chip</strong> bonder<br />
x 2001<br />
y Automatic<br />
AD 8930 high-speed epoxy<br />
<strong>die</strong> bonder<br />
x 2002<br />
y Automatic<br />
FCIP<br />
Discretes<br />
Opto<br />
Opto<br />
200 max.<br />
152 max.<br />
±12.5 µm@3Σ* ±31.8 µm@3Σ<br />
.25-17.7 mm<br />
.15-5.1 mm<br />
40 mm<br />
6 mm<br />
1270 x 1100<br />
1150 x 1180<br />
A, F, S<br />
A<br />
asmpacific.com<br />
Jerry Dellheim, VP–Strategic Marketing<br />
jdellheim@asmpacific.com<br />
b 408.451.0800<br />
San Jose<br />
*Res. 1.25 µm<br />
Athlete FA<br />
(formerly Misuzu FA Corp.)<br />
Nagano 392-0012, Japan<br />
1988<br />
Akira Yamazaki<br />
CB-1750 <strong>flip</strong>-<strong>chip</strong> bonder<br />
x April 2000<br />
y Automatic<br />
Flip Chip<br />
GaAs<br />
200<br />
5 µm@3Σ<br />
1-20 mm 2<br />
120 mm (1 µm)<br />
2300 x 1500<br />
A, S, T (ACF)<br />
athlete-fa.co.jp<br />
Hiro Asakura, International Sales Group<br />
info@athlete-fa.co.jp<br />
b +81.266.53.3369<br />
> +81.266.58.1755<br />
DATACON Technology AG<br />
Innstrasse 16<br />
A-6240 Radfeld/Tyrol, Austria<br />
1986<br />
b +43.5337.600.0<br />
> +43.5337.600.660<br />
Helmut Rutterschmidt<br />
2200 apm <strong>die</strong> <strong>attach</strong>/<strong>flip</strong>-<strong>chip</strong><br />
bonder<br />
x April 2000<br />
y Automatic<br />
2200 apm+<br />
x July 2001<br />
y Automatic<br />
MCM<br />
MCM<br />
Flip Chip<br />
Flip Chip<br />
203.3 max.<br />
304.8 max.<br />
10 µm@3Σ<br />
10 µm@3Σ<br />
.17-35 mm*<br />
.17-50 mm<br />
±35 mm**<br />
±35 mm**<br />
800 x 1200<br />
1000 x 1200<br />
A, F, P, S, T<br />
A, F, P, S, T<br />
datacon.at<br />
Dana Baedke, Marketing Comm. Manager<br />
dana.baedke@datacon.at<br />
b 215.245.3052<br />
Datacon North America, Seven Neshaminy<br />
Interplex 116, Trevose, PA 19053<br />
b 215.245.3050 > 215.245.3060<br />
*Up to 62 mm with custom aps. **±47 mm special (±0.1 µm)<br />
DIAS Automation (HK) Ltd.<br />
Kowloon, Hong Kong<br />
1985<br />
W.S. Leung<br />
A-8020<br />
x December 1999<br />
y Automatic<br />
Epoxy <strong>die</strong> <strong>attach</strong><br />
Pick-and-place<br />
100-300<br />
25 µm<br />
N/A<br />
30 mm (±4 µm)<br />
1200 x 1150<br />
N/A<br />
diasautomation.com<br />
Bally Bang<br />
dias@hkstar.com<br />
b +852.2333.6298<br />
> +852.2764.0187<br />
Dr. Tresky AG<br />
Bobnirainstrasse 13<br />
CH-8800 Thalwil, Germany<br />
1980<br />
Dr. M. Tresky<br />
T-310X-XP<br />
x 1999<br />
y Semi-automatic<br />
IC assembly<br />
Opto assembly<br />
200 max.<br />
N/A<br />
N/A<br />
N/A<br />
1060 x 600<br />
N/A<br />
tresky.com<br />
Alex Tresky, Vice President<br />
alex.tresky@tresky.com<br />
b +41.1.772.19.41<br />
Eclipse Industries LLC<br />
3941 Brookridge Dr.<br />
Mechanicsburg, PA 17050<br />
2000<br />
Steven Solon<br />
DS-107 aligner/bonder<br />
x March 2002<br />
y Manual, Semi-automatic,<br />
Automatic<br />
Flip Chip<br />
Opto/MEMS<br />
300 max.<br />
2 µm<br />
0.2-50 mm<br />
N/A<br />
1300 x 1000<br />
N/A<br />
eclipseindustries.com<br />
Steven Solon, President<br />
ssolon@eclipseindustries.com<br />
b +717.732.4551<br />
> +717.732.7789<br />
ESEC SA<br />
Hinterbergstrasse, 32<br />
CH-6330, Cham, Switzerland<br />
1968<br />
b +41.41.749.5111<br />
Juergen Knorr<br />
2008 Die Bonder XP FC<br />
x January 2002<br />
y Automatic<br />
Micron 5003<br />
x July 2001<br />
y Automatic<br />
Flip Chip<br />
Flip Chip<br />
IC <strong>die</strong> <strong>attach</strong><br />
Opto<br />
150-300<br />
200<br />
18 µm@3Σ<br />
5 µm@3Σ<br />
.25-25 mm<br />
25 mm (wafer)*<br />
N/A<br />
140 mm**<br />
1220 x 1280<br />
1955 x 1534<br />
A, T<br />
A, E, P, S, T<br />
esec.com<br />
Peter Buehlmann, peter.buehlmann@esec.com<br />
ESEC (USA) Inc., 1407 W. Drivers Way,<br />
Tempe, AZ 85284<br />
b 480.893.6990<br />
Walter Gisler, walter.gisler@esec.com<br />
*50 mm from tape or waffle pack **±5 µm<br />
Chip Scale Review • August/September 2002 • [ChipScaleReview.com]<br />
Chip Scale Review August/September 2002 [ChipScaleReview.com] 37
INTERNATIONAL DIRECTORY OF DIE ATTACH & FLIP-CHIP BONDERS/ALIGNERS<br />
See detailed legend on page 37.<br />
F&K Delvotec<br />
Bondtechnik GmbH<br />
Daimlerstrasse 5-7<br />
85521 Ottobrunn, Germany<br />
1978<br />
b +49.89.62995.0<br />
Dr. Farhad Farassat<br />
x y<br />
4420 double-head <strong>die</strong> bonder<br />
x 1998<br />
y Manual, Semi-automatic,<br />
Automatic<br />
4501 single-station, large-area,<br />
multi-placement <strong>die</strong> bonder<br />
x January 2001<br />
y Automatic<br />
p<br />
COB<br />
Opto hybrids<br />
u<br />
SAW filters<br />
Flip Chip<br />
<br />
200 max.<br />
200 max.<br />
r<br />
±12 µm@3Σ<br />
±12 µm@3Σ<br />
Y<br />
.25-20 mm<br />
.25-20 mm<br />
Z 80 mm*<br />
80 mm*<br />
j 1200 x 1500<br />
1200 x 1500<br />
t<br />
A<br />
A, E, P<br />
b > <br />
fkdelvotec.com fkdelvotecusa.com<br />
Desmond Bradley<br />
desmond.bradley@de.fkdelvotec.com<br />
b +49.98.62995.120<br />
California: Rick Bailey, Sales Manager<br />
bailey.r@fkdelvotecusa.com<br />
b 949.595.2200<br />
*(10 µm@3Σ)<br />
Finetech Inc.<br />
1334 E. Chandler, Blvd., 5D2<br />
Phoenix, AZ 85048<br />
1992<br />
b 480.460.8777<br />
> 480.460.8778<br />
Gunter Kuerbis<br />
Opto-Bonder VA24P<br />
x 2001<br />
y Automatic<br />
Component assembly<br />
200<br />
5 µm@3Σ<br />
10 mm<br />
N/A<br />
950 x 600<br />
A, E, O*, P, S, T<br />
finetech.de<br />
Chris Underhill, General Manager<br />
finetech@cox.net<br />
*Thermosonic<br />
MRSI<br />
A Newport Corp. Company<br />
101 Billerica Ave.<br />
N. Billerica, MA 01862<br />
1984<br />
b 978.667.9449<br />
> 978.667.6109<br />
Neil Srivastava (VP/GM)<br />
MRSI-505<br />
x September 1996<br />
y Automatic<br />
MRSI-375<br />
x May 1998<br />
y Automatic<br />
Photonics<br />
ICs<br />
Microwave<br />
Flip Chip<br />
50-200<br />
50-300<br />
12 µm@3Σ<br />
10 µm@3Σ<br />
.20 mm, no max.<br />
.20 mm, no max.<br />
50 mm*<br />
33 mm*<br />
965 x 1320<br />
863 x 1194<br />
A, E, P, S<br />
A, E, P, S<br />
mrsigroup.com<br />
Daniel Crowley<br />
sales@mrsigroup.com<br />
MRSI Europe, Verbeekstraat 2<br />
2332 CA Leiden, The Netherlands<br />
Hans Siedsma, hsiedsma@mrsieurope.nl<br />
MRSI Asia Pacific, 190 Middle Road<br />
#19-05 Fortune Center, Singapore 188979<br />
Gheorghe Pascariu, gpascariu@mrsigroup.com<br />
MRSI-5005<br />
x July 2001<br />
y Automatic<br />
INTERNATIONAL DIRECTORY OF DIE ATTACH & FLIP-CHIP BONDERS/ALIGNERS<br />
See detailed legend on page 37.<br />
Palomar Technologies Inc.<br />
2330 Oak Ridge Way<br />
Vista, CA 92083<br />
1995<br />
b 760.931.3600<br />
> 760.931.3600<br />
Kevin Conlon<br />
Semiconductor Equipment Corp.<br />
5154 Goldman Ave.<br />
Moorpark, CA 93020<br />
1975<br />
b 805.529.2293<br />
> 805.529.2193<br />
Don Moore<br />
Shinkawa Ltd.<br />
Tokyo 208-8585, Japan<br />
1959<br />
b +81.42.560.1231<br />
Kenji Fujiyama<br />
Sysmelec<br />
Route de Berne 5<br />
CH-2076 Gals, Switzerland<br />
1982<br />
b 860.434.2708<br />
> 860.434.3079<br />
Jean-Claude Prèlaz<br />
x y<br />
3500-II automatic laser diode<br />
<strong>attach</strong> cell<br />
x March 2001<br />
y Automatic<br />
410XP precision <strong>die</strong> bonder<br />
x Not supplied<br />
y Semi-automatic<br />
SFB-200<br />
x 2002<br />
y Automatic<br />
SPA-300<br />
x 2001<br />
y Automatic<br />
SMB 1000<br />
x 2001<br />
y Automatic<br />
Singapore’s fastest emerging IC Assembly and Test manufacturing and engineering services *diagonal sizeprovider. In addition to<br />
value added services and leading edge test technology, UTAC’s strategic proximity within the ASEAN hub provides<br />
competitive logistic advantages and Asia’s highest rated IP protection.<br />
Chip Scale Review • August/September 2002 • [ChipScaleReview.com]<br />
38 Chip Scale Review August/September 2002 [ChipScaleReview.com]<br />
Photonics<br />
p<br />
Photonics<br />
FC <strong>attach</strong><br />
Epoxy <strong>die</strong> <strong>attach</strong><br />
Opto assembly<br />
Microwave u<br />
Flip Chip<br />
Flip Chip<br />
50-200<br />
<br />
100-200<br />
N/A<br />
150-200<br />
150-300<br />
100-200<br />
5 µm@3Σ<br />
r<br />
±5 µm@3Σ<br />
±1-2 µm<br />
±5 µm<br />
N/A<br />
±1 µm@3Σ<br />
.20 mm, no max. Y<br />
.178-50.8 mm<br />
.254-25.4 mm 2<br />
.3-3.0 mm<br />
.8-2.5 mm<br />
.20-2.4/9.5 mm*<br />
50 mm*<br />
Z<br />
50.8 mm*<br />
N/A<br />
N/A<br />
N/A<br />
55 mm (0.5 µm)<br />
812 x 1003<br />
j 1520 x 1070<br />
2032 x 1473<br />
1000 x 1100<br />
1365 x 1230<br />
1850 x 1865<br />
A, E, P, S<br />
t<br />
E<br />
A, E, P, S<br />
Thermosonic<br />
A<br />
A, E, P, S<br />
*Place to a force<br />
b > <br />
palomartechnologies.com<br />
Ed<strong>die</strong> Wills<br />
ewills@<strong>bonders</strong>.com<br />
*(0.3 µm)<br />
semicorp.com<br />
Lester Salvatierra, Sales Manager<br />
seclester@aol.com<br />
shinkawa.com<br />
Doug Day, General Manager<br />
d_day@shinkawausa.com<br />
b 480.831.7988<br />
Shinkawa USA: 1930 S. Alma School Rd.,<br />
D-107, Mesa, AZ 85210<br />
sysmelec.com<br />
Farid Assaf, VP<br />
f.assaf@sysmelec.com<br />
Planning Your Next<br />
Move in Packaging
INTERNATIONAL DIRECTORY OF DIE ATTACH & FLIP-CHIP BONDERS/ALIGNERS<br />
See detailed legend on page 37.<br />
Toray Engineering Co. Ltd.<br />
Otsu, Shiga 520-2141 Japan<br />
1960<br />
b +81.77.544.6221<br />
Junichi Ujike<br />
Universal Instruments<br />
P.O. Box 825<br />
Binghamton, NY 13902<br />
1919<br />
b 607.779.7522<br />
Ian McEvoy<br />
x y<br />
FC2000 <strong>flip</strong>-<strong>chip</strong> bonder<br />
x October 2001<br />
y Not supplied<br />
GSMxs (Model 5785A)<br />
x 1999<br />
y Automatic<br />
p<br />
Flip Chip<br />
Flip Chip<br />
u<br />
Hybrid assembly<br />
<br />
200 max. (w/option)*<br />
300 max.<br />
r<br />
N/A<br />
N/A<br />
Y<br />
N/A<br />
.20-25 mm<br />
Z<br />
N/A<br />
N/A<br />
j 1300 x 1300<br />
1676 x 2184<br />
t<br />
S, ACP, NCF, NCP<br />
A, E, P, S<br />
b > <br />
toray-eng.com<br />
Akiha Morris, Sales Assistant<br />
akiha_morris@toray-eng.co.jp<br />
TEK (America) Inc., 2045 Martin Ave.<br />
Santa Clara, CA 95050<br />
b 408.486.0615<br />
*Chip size: 3.0 x 3.0 x 0.3 mm to 20 x 20 x 1 mm<br />
uic.com<br />
Richard Boulanger, boulange@uic.com<br />
b 607.779.4992<br />
Karen Moore-Watts, Dir. Global Marketing<br />
moore@uic.com<br />
Other <strong>of</strong>fices throughout Europe and Asia<br />
INTERNATIONAL DIRECTORY OF WIRE BONDERS<br />
Company<br />
Address<br />
Founded<br />
b Phone<br />
> Fax<br />
President CEO<br />
Advertisers are shown in Boldface type.<br />
Model #/Name<br />
x Introduced<br />
y Automation Level<br />
ÖMethod/Type<br />
p Primary Application<br />
u Secondary Application<br />
Bond Pitch Capability<br />
k Bonding Area (mm)<br />
P Conversion Time 1<br />
P Conversion Time 2<br />
t Bond Placement Repeatability<br />
£ Material<br />
Handling<br />
þ Package/<br />
Leadframe<br />
Dimensions<br />
(mm)<br />
jFootprint (W x D mm)<br />
Web Site<br />
Customer Contact<br />
and E-Mail<br />
b Phone<br />
> Fax<br />
Other Offices<br />
L<br />
E<br />
G<br />
E<br />
N<br />
D<br />
P Conversion<br />
Time<br />
1=Same leadframe<br />
type; 2=Different<br />
leadframe type<br />
ASM Pacific Technology Ltd.<br />
N See Die Attach<br />
Eagle 60 Ultra-Fast Wire<br />
Bonder<br />
x 2002<br />
y Automatic<br />
ÖThermosonic gold<br />
ball bonder<br />
IC copper interconnect<br />
35 µm<br />
INTERNATIONAL DIRECTORY OF WIRE BONDERS<br />
Company<br />
Address<br />
Founded<br />
b Phone<br />
> Fax<br />
President CEO<br />
Advertisers are shown in Boldface type.<br />
Model #/Name<br />
x Introduced<br />
y Automation Level<br />
ÖMethod/Type<br />
p Primary Application<br />
u Secondary Application<br />
Bond Pitch Capability<br />
k Bonding Area (mm)<br />
P Conversion Time 1<br />
P Conversion Time 2<br />
t Bond Placement Repeatability<br />
£ Material<br />
Handling<br />
þ Package/<br />
Leadframe<br />
Dimensions<br />
(mm)<br />
jFootprint (W x D mm)<br />
Web Site<br />
Customer Contact<br />
and E-Mail<br />
b Phone<br />
> Fax<br />
Other Offices<br />
L<br />
E<br />
G<br />
E<br />
N<br />
D<br />
P Conversion<br />
Time<br />
1=Same leadframe<br />
type; 2=Different<br />
leadframe type<br />
Kaijo Corp.<br />
Hamura City<br />
Tokyo, Japan 205-8607<br />
1948<br />
Ryuzou Ohrui<br />
Kulicke & S<strong>of</strong>fa Inc.<br />
2101 Blair Mill Rd.<br />
Willow Grove, PA 19090<br />
1951<br />
b 215.784.6640<br />
C. Scott Kulicke<br />
Fb150 Series<br />
x 2000<br />
y Manual, Semi-automatic,<br />
Automatic<br />
ÖThermosonic gold bonder<br />
MPB Series<br />
x January 2000<br />
y Manual, Semi-automatic,<br />
Automatic<br />
ÖThermosonic gold bonder<br />
MAXµm<br />
x May 2002<br />
y Automatic<br />
ÖUltrasonic ball bonder<br />
Triton<br />
x March 2001<br />
y Automatic<br />
ÖThermosonic and<br />
ultrasonic wedge bonder<br />
Fine-pitch, standard ICs<br />
Large-area bonding<br />
Processors, logic, memory<br />
Hybrids<br />
Hoop leadframes<br />
FPDs<br />
Hybrids<br />
Opto/Ribbon<br />
50 µm<br />
50 µm<br />
45 µm@3Σ 50 µm@3Σ<br />
X: 55, Y: 65<br />
X: 117, Y: 117<br />
X: 56, Y: 66<br />
X: 63.5, Y: 63.5<br />
>5 min.*<br />
>5 min.*<br />
>5 min. 15 min.*<br />
>15 min.*<br />
>8 min.<br />
+65.880.9488<br />
Vince McTaggart, Program Manager<br />
vmctaggart@kns.com<br />
b 215.784.6819<br />
Palomar Technologies Inc.<br />
N See Die Attach<br />
Gold Bumper<br />
x July 2001<br />
y Automatic<br />
ÖThermosonic ball bonder<br />
Flip Chip<br />
Wireless<br />
80 µm<br />
X: 305, Y: 152<br />
N/A<br />
N/A<br />
±2.5 µm@3Σ<br />
£ Continuous<br />
bonding handlers,<br />
standard<br />
Auer boats,<br />
custom<br />
handling<br />
800 x 800<br />
palomartechnologies.com<br />
Jerry Jordan<br />
jjordan@<strong>bonders</strong>.com<br />
Shinkawa Ltd.<br />
N See Die Attach<br />
UTC-1000<br />
x 2001<br />
y Automatic<br />
ÖThermosonic gold<br />
ball bonder<br />
ICs<br />
MCMs/MCPs<br />
45 µm inline<br />
X: 55, Y: 65<br />
3 min.<br />
10 min.<br />
±2.5 µm@3Σ<br />
£ Flat carrier,<br />
strip, tape<br />
BGA<br />
þ L=95-262,<br />
W=20-80,<br />
T=0.07-0.7<br />
700 x 700<br />
shinkawa.com<br />
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Chip Scale Review August/September 2002 [ChipScaleReview.com] 41
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