Epotec - electrical and electronic applications - Aditya Birla Chemicals

Electrical and Electronic
Epotec ® Epoxy Systems
®

Transcending the conventional barriers of business
to send out a message that “We Care”
The Aditya Birla Group
A US $29.2 billion corporation, the Aditya Birla
Group is in the League of Fortune 500. It is
anchored by an extraordinary force of 130,000
employees, belonging to 30 different nationalities.
In India, the Group has been adjudged “The Best
Employer in India and among the top 20 in Asia” by
the Hewitt-Economic Times and Wall Street Journal
Study 2007. Over 60 per cent of its revenues flow
from its overseas operations.
The Group operates in 25 countries - India, UK,
Germany, Hungary, Brazil, Italy, France,
Luxembourg, Switzerland, Australia, USA, Canada,
Egypt, China, Thailand, Laos, Indonesia,
Philippines, Dubai, Singapore, Myanmar,
Bangladesh, Vietnam, Malaysia and Korea.
A Global Perspective
A metals powerhouse, among the world’s most
cost-efficient aluminium and copper producers.
Hindalco-Novelis is the largest aluminium rolling
company. It is one of the 3 biggest producers of
primary aluminium in Asia, with the largest single
location copper smelter.
No. 1 in viscose staple fibre.
The 4 th largest producer of insulators.
The 4 th largest producer of carbon black.
The 11 th largest cement producer globally, the 7 th
largest in Asia and the 2 nd largest in India.
Among the world’s top 15 BPO companies and
among India’s top 4.
Among the best energy efficient fertilizer plants.
In India
A premier branded garments player.
The 2 nd largest player in viscose filament yarn.
The 2 nd largest in the Chlor-alkali sector.
Among the top 5 mobile telephony companies.
A leading player in Life Insurance and Asset
Management.
Among the top 3 super-market chains in the Retail
business.
Beyond Business
The Aditya Birla Group is working in 3,700 villages,
reaching out to 7 million people annually through
the Aditya Birla Centre for Community Initiatives and
Rural Development, spearheaded by Mrs.
Rajashree Birla. The Group’s functions span 42
schools and 18 hospitals, furthering its focus on
health care, education, sustainable livelihood,
infrastructure and social causes.
For more information visit www.adityabirla.com
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Epotec ® Epoxy Systems | Electrical and Electronic

Our Company acts as a solution provider, formulating specialized
Epoxy systems for your specific performance needs.
Aditya Birla Chemicals, Epoxy Division
Thai Epoxy and Allied Products Company Limited
(Thai Epoxy), has recently been transformed to the
Epoxy Division of Aditya Birla Chemicals (Thailand)
Limited. It is part of the Aditya Birla Group of
Companies. Being the pioneer manufacturer of
epoxy resins in the ASEAN region, the Company
constitutes its success on its Specialized Epoxy
Systems and its complete in-house Research and
Application Development Center. Sustainability has
also been achieved through its group-wide unique
World Class Manufacturing (WCM) strategy for
enterprise excellence.
Located within the prestigious Map Tha Phut
Industrial Estate at Rayong Province in Thailand, the
Company started commercial production in 1992
with technology from Tohto Kasei Company Limited,
Japan’s largest producer of epoxy resins. The
Company is currently accredited and certified with
ISO 9001:2000 and ISO 14001 in recognition of its
quality and environment management systems.
The Company offers a wide range of epoxies and
modifiers that vary in chemical structure, molecular
weight, viscosity and functionality. All products are
marketed under the trade name of Epotec ® ,
including liquid, solid, solutions, blends and other
multifunctional epoxy resins. Epoxy Resin, a
performance polymer, is a versatile resin which
finds application in adhesives, civil engineering,
composites, casting and encapsulation of electrical
components, and coatings including protective,
marine, floor, powder, can and coil.
The Company stretches its business arms in all six
continents of the globe.
Certified ISO 9001:2000 by
Certified ISO 14001 by
008 008
Epotec ® Epoxy Systems | Electrical and Electronic
3

®
Electrical and Electronic
This booklet highlights the Epotec ® range
of Epoxy Systems for Electrical and
Electronic Applications. These systems
find end-use in the following components:
Electrical Components
Current Transformer
Power Transformer
Instrument Transformer
Switchgear Component
Insulators
Bushing
Electronic Components
Power Semi-conductor
Capacitors
Inductive Components
Ignition Coils
Filter Circuits
Proximity Switches
Modules
Relays
Connectors
Sensors
Switch Mode Transformers
From the beginning of the electrical and electronic
industry, critical circuit components have been
coated, buried or otherwise encased in dielectric
materials to isolate them from adverse
environmental and operational effects such as
oxygen, moisture, temperature, electrical flashers,
current leakage, salt spay, radiation, solvent,
chemicals, micro-organisms, mechanical shock
and vibrations. The first materials used for this
purpose were waxes and asphalted polymer.
Although these substances are still used to some
extent, synthetic polymers, such as epoxy resins,
are now most widely used in electrical
encapsulation.
The benefits and importance of epoxy resins have
been recognized after World War II by the electrical
and electronic industries as a self-supporting
insulating material. Our Company, since its
inception, has given prime importance to this
segment. As a result of intensive development work
in close cooperation with our customers, our
Company has compiled its present broad range of
resins, curing agents and resin systems available to
meet the wide variety of requirements stipulated in
national and international standards.
Our goal is to continue our focus on quality and
innovation thereby partnering the electrical and
electronic industry in their technical progress. It is
part of our philosophy not only to safeguard high
and consistent product quality, but also to support
our customers with information and technical
service when using our products. This intent is
borne out of our activities including, our willingness
to supply processing information literature and
other solutions to technical problems. Development
of tailored systems for specific customer
requirements is also part of our philosophy.
Up-to-date Research & Development facility and
the services of an Application Development Center
are available for product development and technical
support to our customers.
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Epotec ® Epoxy Systems | Electrical and Electronic

Formulation
Epotec ® Epoxy Systems offer ready to use
formulated products, however, users may select
appropriate filler, diluents, plasticizers, modifiers,
and pigments according to their choice.
Fillers are an important part of the formulation and
mixed about 2 to 3 times of epoxy resin. Due to
high loading, fillers become an important
component for electrical and electronic
manufacturers.
Several common fillers are used to achieve the
desired end properties. Single or combinations of
fillers can be used with or without treatment. Fillers
treated by silanes provide excellent wetting, low mix
viscosity, strong bonding with matrix, and prevent
sedimentation during long storage.
Fillers modify the properties of the mix resulting
in the following benefits:
Reduced cost.
Increased abrasion resistance.
Increased rigidity and impact strength.
Reduced shrinkage and water absorption.
Increased heat deflection temperature.
Modified electrical and thermal properties.
Reduced flammability.
Reduced flexural and tensile strength.
Selection of Fillers
Silica quartz
Alumina trihydrate (ATH)
Alumina
Mica
Calcium carbonate
Hollow glass sphere
Carbon black
Metallic powder
Common Properties
High electrical properties.
Fire retardant applications.
Excellent abrasion resistance.
High thermal resistance
Common filler, high surface area and resin absorption.
Light weight and good surface finish.
High thermal stability and semi-conducting properties.
Modification of electrical and thermal properties.
Epotec ® Epoxy Systems | Electrical and Electronic
5

®
Processes & Applications
Epotec ® Epoxy Systems are best known for casting
into molds, cavities, cores and patterns. They are
also extensively used for encapsulation
(encapsulation and embedment are frequently used
inter-changeably), impregnation and protection of
electrical and electronic assemblies and
components. Usually low-pressure-reacted resins
are utilized and curing is performed at room
temperature to elevated temperature, up to 200°C.
Room temperature curing Epotec ® Systems are
preferred for low voltage, small components, while
heat-cured Epotec ® Systems offer extremely high
physical, thermal and chemical resistance. As such,
heat-cured Epotec ® Systems are used for medium
and high voltage applications.
There are few common process techniques for use
of Epotec ® Epoxy Resins in electrical and electronic
components.
Pottings
Potting is a variation of casting in which the
prefabricated mold, a thin shell of metal or plastic,
becomes an integral part of the finished product.
The resin is fluid enough to flow around the
components being embedded and fills all voids,
including the container. Potting is used frequently to
reduce weight, avoid breakdown and prevent failure
due to moisture and vibration in components.
Encapsulation
Encapsulation is a method of providing a protective
coating on the inside of coils, closed-packed
electronic assemblies and wire bundles. For
saturation of components it is essential to select
Epotec ® Resins of high flow and high wetting
properties. The components finally are surrounded
by a thin film of resin. Components encapsulated in
this manner maintain high electrical insulation,
excellent environmental protection against heat,
moisture and chemicals, and also protect
microelectronic assemblies with their fine interconnection.
Impregnation
Encapsulation is more of a coating process which
allows minimum penetration of resin into compact
assemblies, whereas impregnation is a process
specifically designed to ensure that the liquid resin
has completely entered into interstices of assembly
prior to curing. Some transformer and electronic
equipment manufacture requires both encapsulation
and impregnation.
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Epotec ® Epoxy Systems | Electrical and Electronic

Castings
In this technique, a mold is prepared to give the proper dimensions to the finished part. The molds are designed
to provide minimum internal stresses as the resin shrinks during curing. The resin, curing agent and fillers are
mixed and poured slowly into the mold, preferably in a vacuum to avoid air entrapment. The entire assembly is
then cured either at room temperature, by its own exothermic heat or in an oven. The part is then released from
the mold. Castings technique is divided into the following subcategories:
7
4
5
6
Vacuum Casting
In this process, epoxy compound, including resin,
curing agent and filler, are poured under gravity into
steel molds under vacuum. Partially cured
components are demolded and post curing is
performed in oven.
3 3 3
7
1 Autoclave
2
2 Static Mixer / Buffer Tank
3 Dosing Pump
4 Resin Tank
8
1
5 Flexibilizer / Accelerator Tank
6 Curing Agent Tank
7 Vacuum Plant
8 Control Panel
6
6
4 5
3 3
Automation Pressure Gelation (APG) or Liquid
Injection Molding (LIM)
In this process, the liquid epoxy compound,
premixed with fillers and additives, is directly
pumped into a split mold which is v-mounted on a
clamping machine. Only gelling step is allowed in
the mold and final curing of component is
performed in separate oven. This method allows to
compensate for chemical shrinkage and is used
extensively for mass production of insulating
components for electrical industries.
7 1
1
2 2
1 APG Clamping Unit
2 Static Mixer
3 Dosing Unit
4 Resin Mixing Tank
5 Curing Agent Mixing Tank
6 Vacuum Plant
7 Control Panel
NOTE: The above diagrams only demonstrate a simple representation
of the associated processes. This is only for a purpose of reference,
and may not be accurate in terms of details and scaling.
Epotec ® Epoxy Systems | Electrical and Electronic
7

®
Typical Properties of Epotec ® Epoxy Systems for Electrical and Electronic Applications
TABLE 1.0 Electrical and Electronic Applications
EPOTEC ® SYSTEMS
UNIT
Resin
100 pbw 1
YDC 6001
YDC 6002
YDC 6004
YDC 6015
YDC 6003
YDC 6003
YDC 6030
YDC 6006
YDH 184
YDH 184
YDH 184M1
YDC 6020i
YDC 6029
YDC 6018
Curing Agent
pbw 1
TH 7656 / 30
TH 7656 / 30
TH 7657 / 100
TH 7652 P1 / 80
TH 7658 / 80
TH 7662 / 80
TH 7670 / 82
TH 7269 / 9 - 10
TH 7351 / 90
TH 7356 / 90
TH 7356P / 80
TH 7652i / 32
TH 7668 / 30
TH 8251 / 18
Accelerator
pbw 1
-
-
TA 7852 / 1
-
-
-
TA 7854 / 0.5 - 2
-
TA 7851 / 0.5 - 3
TA 7851 / 0.5 - 2
-
TA 7851 / 1.5
-
-
Flexibilizer
pbw 1
-
-
TP 01 / 10
TP 01 / 0 - 8
-
-
-
-
-
-
-
-
-
-
Filler (silica flour 300 mesh)
pbw 1
200
200
400
320 - 350
270
270
270
150
300
270
270
Prefilled
Prefilled
Prefilled
Filler loading (pbw 1 filler)
%
61
61
65
65
60
60
60
58
61
61
61
-
-
-
Curing condition
Hot Cure
Hot Cure
Hot Cure
Hot Cure
Hot Cure
Hot Cure
Hot Cure
Ambient Cure
Hot Cure
Hot Cure
Hot Cure
Hot Cure
Hot Cure
Ambient Cure
Processing technique
CVC
CVC
CVC
CVC, PG, APG
CVC, PG, APG
CVC, PG, APG
CVC, APG
CVC
CVC, PG, APG
CVC, PG, APG
CVC, PG, APG
CVC
CVC
CVC
Processing temperature
˚C
120 - 140
120 - 140
Ambient - 80
Ambient - 80
Ambient - 80
Ambient - 80
60 - 80
Ambient
40 - 80
40 - 80
40 - 80
60 - 80
60 - 80
RT
Initial viscosity of mix
mPa s/˚C
1,900 / 120
500 / 140
-
-
4,000 / 120
2,500 / 140
-
-
1,500 / 80
-
-
-
10,000 / 60
1,500 / 80
-
-
40,000 / 40
1,000 / 80
-
-
70,000 / 40
1,500 / 80
-
-
1,700 / 60
-
-
-
8,500 / 25
-
-
-
1,000 / 80
-
-
-
100 / 80
-
-
-
6,400 / 25
3,000 / 40
700 / 60
-
700 - 900 / 25
-
-
-
2,500 - 3,500 / 25
-
-
-
-
-
-
-
Pot life of mix (< 5kg)
h/˚C
6 / 120
1 / 120
14 / 40
24 - 48 / 25
15 / 40
15 / 40
24 - 48 / 25
0.5 / 25
1 / 80
4 / 60
4 / 60
24 - 36 / 25
24 - 36 / 25
0.5 / 25
-
0.5 / 140
1.5 / 80
-
2 / 80
2 / 80
-
(100g mix)
-
1 / 80
1 / 80
-
-
-
Gel time
min/˚C
780 / 110
330 / 130
150 / 150
160 / 120
60 / 140
-
100 / 80
35 / 100
15 / 120
20 / 120
-
-
285 / 80
14 / 120
8 / 140
270 / 80
15 / 120
8 / 140
80 - 90 / 120
25 - 30 / 140
-
-
-
-
4 / 140
3 / 150
2 / 160
4 / 140
3 / 150
2 / 160
11 / 120
5 / 140
-
40 / 80
4 / 120
-
115 - 150 / 80
30 - 40 / 100
-
-
-
-
Minimum cure time
h/˚C
16 / 140
14 / 140
3 / 120
10 / 140
6 / 80 + 10 / 130
6 / 80 + 10 / 130
6 / 80 + 10 / 130
6 / 80
6 / 80 + 10 / 140
6 / 80 + 10 / 140
6 / 80 + 10 / 140
4 / 80 + 2 / 130
4 / 80 + 2 / 130
24 / RT
Minimum postcure time
h/˚C
-
-
-
-
6 / 140
6 / 140
-
-
-
-
-
-
-
-
NOTE: CVC - Conventional Vacuum Casting, PG - Pressure Gelation, APG - Automatic Pressure Gelation
1 Part by weight (pbw)
PROPERTIES OF CASTING
METHOD
UNIT
Tensile strength
ISO 527
N/mm 2
85 - 95
80 - 100
70 - 80
75 - 85
70 - 80
75 - 85
75 - 85
35 - 45
90 - 100
90 - 100
70 - 90
40 - 60
30 - 50
5 - 10
Elongation at break
ISO 527
%
1.1 - 1.5
1.0 - 1.5
0.8 - 1.2
1.1 - 1.3
1.0 - 1.5
1 - 2
1 - 2
2 - 4
1.7 - 1.9
1.7 - 1.9
1.3 - 1.5
-
-
1.5
Flexural strength
ISO 178
N/mm 2
135 - 145
130 - 150
115 - 125
135 - 155
110 - 130
110 - 120
110 - 140
90 - 100
150 - 165
150 - 165
150 - 170
70 - 90
70 - 90
15 - 20
Impact strength
ISO / R 179
kJ/mm 2
15 - 22
15 - 22
10 - 15
-
7 - 10
11 - 13
10 - 15
7 - 10
8 - 9
8 - 9
-
8 - 11
8-11
-
Elastic modulus in tension
ISO / R 527
N/mm 2
10,000 - 11,000
12,000 - 14,000
12,000 - 14,000
-
9,000 - 11,000
9,000 - 11,000
10,000 - 12,000
15,500 - 16,000
10,000 - 11,000
10,000 - 11,000
10,500 - 12,000
-
-
1400 - 1800
Deflection temperature (HDT)
ISO / R 75
˚C
110 - 120
110 - 120
80 - 90
100 - 110
105 - 120
95 - 105
80 - 90
65 - 70
95 - 105
95 - 110
72 - 80
75 - 85
85 - 95
55 - 65
Glass transition point
DSC
˚C
115
115
90 - 100
100 - 110
110 - 125
100 - 110
85 - 95
55 - 65
100 - 110
100 - 110
75 - 80
75 - 90
90 - 105
60 - 70
Water absorption 1 (23˚C / 10 days)
ISO / R 62
% w/w
0.15 - 0.25
0.15 - 0.25
0.1 - 0.2
-
0.10 - 0.15
0.1 - 0.2
0.1 - 0.2
0.4
0.1 - 0.2
0.1 - 0.2
0.1 - 0.2
< 0.15
< 0.15
0.2 - 0.4 (24 hrs)
Tan d at 50 Hz (23˚C)
IEC 60250
%
1.5
2 - 3
2 - 3
2 - 3
2.5
3
2 - 3
0.32 - 0.37
2
2
2
2 - 3
2 - 3
1 - 2
Arc resistance
ASTM D-495
sec
180 - 190
185 - 190
185 - 195
180 - 190
182 - 186
182 - 186
180 - 190
180
185 - 190
185 - 190
185 - 190
180 - 190
180 - 190
-
Tracking resistance (CTI)
IEC 60112
V
> 400
> 400
> 600
> 600
> 600
> 600
> 600
400
> 600
> 600
> 600
> 600
> 600
> 600
Electrical strength 2 (23˚C / 50 Hz)
IEC 60243 - 1
kV/mm
22 - 24
22 - 25
18 - 22
17 - 21
18 - 20
18 - 20
18 - 22
18 - 22
19 - 21
19 - 22
6 - 10
17 - 20
> 20
6 - 8
1 60 x 10 x 4 mm test specimens, 2 20 seconds value for 2 mm sheet
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Epotec ® Epoxy Systems | Electrical and Electronic
Epotec ® Epoxy Systems | Electrical and Electronic
10

Important Considerations for Epotec ® Resins
The epoxy casting resins, generally, are liquids at processing temperature when combined with the curing
agents. The mixture is cured at room or elevated temperature to the thermoset state. There are a number of
common considerations involved in achieving good, solid, crack-free, bubble-free castings. These include:
Exotherm
Exotherm is the increase in temperature of
compound above the cure temperature due to
energies released as the epoxy group reacts. For
fast resins it is quite possible for the center of a
casting to generate bubbling due to vapor pressure,
and which lead to char and explodes in extreme
conditions.
Reactivity
Reactivity of epoxy resins while curing ideally obeys
Arrhenius’ law which in effect states “For every 10°C
rise in temperature, the reaction rate doubles”.
Hence, if a compound will gel in 30 minutes at room
temperature of 25°C then if warmed to 35°C, it will
gel in approximately 15 minutes; at 45°C, in 7½
minutes. Thus when heat is used as a means of
achieving low viscosity, reactivity becomes an
opposing factor.
Shrinkage
Shrinkage is the reduction in volume or in linear
dimensions observed during cure. Shrinkage
induces stresses which can damage pressure
sensitive inserts or which can lead to crack under
thermal cycling.
Thermal Expansion
Thermal expansion characteristics are the function
of epoxy resin, curing agent, modifiers, and fillers
present in formulation. In general, the more highly
flexibilized the compound, the higher the expansion
rate; the more highly filled the lower the expansion
rate. Ideally the expansion rate of the resin should
be matched to those of the inserts present or should
provide an intermediate value in the case of different
expansion rate of the inserts.
Thermal Shock
Thermal shock is a severe problem with rigid epoxy
resin system. The problem is magnified when higher
temperature operation is required, in so far as many
flexible systems are inherently unsuited for
this service because of relatively poor thermal
stability. To obtain satisfactory thermal shock
resistance for severe thermal cycling, sophistication
in the formulation is required. Initial stresses caused
by shrinkage and cure temperature should be
minimized. Reversible stresses caused by the
expansion characteristics of the compound should
be reduced to the level of practical.
Thermal Stability
Thermal stability indicates the ability of the resin to
serve at elevated temperature and maintain
minimum specified properties. With elevated
temperature aging there is generally a progressive
loss of strength and an overall reduction in
properties. Often there is progressive embrittlement
because of loss of volatile fragments and increased
cross-linking. As temperature is further increased
surface charing will occur, followed by cracking and
decomposition.
Vapor Pressure
The temperature at which the vapor pressure
equals the surrounding or atmospheric pressure,
the boundary between the gas and liquid
disappears and the substance boils. If epoxy
compound becomes too hot, this may lead to
generation of gas bubbles trapped in the cured
structure.
Viscosity
The viscosity of resin controls the quantity of filler
and determines the viscosity of formulated
compound. In order to assist removal of air bubbles
from compound and to obtain a desired, void-free
structure, it is often desirable to have low viscosity
at processing temperature.
Epotec ® Epoxy Systems | Electrical and Electronic
11

Glossary
Arc Resistance
The ability of a material to resist the
action of high voltage electricals are
usually stated in terms of the time
required to render the material
electrically conductive. Failure of the
specimen may be caused by
heating to incandescence, burning,
tracking or carbonization of the
surface.
Coefficient of Thermal Expansion
The fractional change in length (or
sometimes in volume, when
specified) of a material for a unit
change in temperature.
Deflection Temperature under
Load
The temperature at which a simple
beam has deflected a given amount
under load (formerly called heat
distortion temperature). This is the
temperature at which a specimen
deflects 0.010 inches at a load of 66
or 264 psi.
Dielectric Constant (Permittivity)
That property of a dielectric which
determines the electrostatic energy
stored per unit volume for unit
potential.
The ratio of the capacity of
condenser having a diele.ctric
material between the plates to that
of the same condenser when the
dielectric is replaced by vacuum.
Also known as specific inductive
capacity, it is expressed as:
Partial Discharge (PD)
Partial discharge is a phenomenon
which occurs on or inside the test
body when an alternative voltage of
a critical level is set up or
exceeded. It can be explained by
the gaseous gaps (very fine pores,
irregularities). The effect of internal
partial discharges are particularity
damaging and may shorten the
service life of the insulation.
Thermal Conductivity
The measure of the ability of a
material to conduct heat. For a
homogenous material it is the ideal
rate of heat flow, under steady
conditions, through unit area, per
unit temperature gradient in the
direction perpendicular to the area.
Thermal Shock
The stress-producing phenomenon
resulting from a sudden
temperature drop.
Thermal Stability
The resistance to permanent
change in properties caused solely
by heat.
Tracking Resistance
Resistance of solid insulation
materials against combined effect
of electrical stress and electrolytic
contamination. This is also known
as comparative tracking index.
E =
Cp
Co
=
Q
CoV
Dissipation Factor
The ratio of the power loss in a
dielectric material to the total power
transmitted through the dielectric.
Glass Transition Temperature (Tg)
The temperature at which the
amorphous polymer changes from a
glass-like brittle state to rubbery
state.
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Epotec ® Epoxy Systems | Electrical and Electronic

®
Disclaimer
This brochure is designed to provide you with information to the Epotec ® range of Products referred to, and should be read in
conjunction with the latest Technical Data Sheets (TDS) and Material Safety Data Sheets (MSDS), and may not be construed
as legally binding. Nothing contained herein constitutes an offer for the sale of any product. The Company makes no
warranties, either expressed or implied, with respect to its product or the results of its use, or with respect to any information
provided by the Company.
Because of changes in conditions and circumstances the Company reserves the right, subject to all applicable laws, at any
time, at its discretion, and without notice, to discontinue or change the specifications and the prices of their products, and to
either permanently or temporarily withdraw any such products from the market without incurring any liability to any prospective
purchaser or purchaser. It is the sole responsibility of the user to test our products for suitability in the intended use. Always
consult an authorized Epotec ® representative for the latest information with respect to specifications, prices, and availability.
Material Safety, Handling and Storage Conditions
Due to variety of materials used in epoxy systems, please consult Epotec ® Technical Data Sheets (TDS) and Material Safety
Data Sheets (MSDS). TDS and MSDS are available for all Epotec ® products upon request. Alternatively, visit www.epotec.info
for detailed material safety, handling, and storage conditions.

02
Epoxy Division
Aditya Birla Chemicals (Thailand) Limited
Electrical and Electronic
Epotec ® Epoxy Systems
®
Electrical
and Electronic
Epotec ® Epoxy Systems
www.epotec.info
www.adityabirlachemicals.com
Bangkok Office
888/160-161, 16th Floor, Mahatun Plaza Building,
Ploenchit Road, Bangkok 10330, Thailand.
Tel. (66 2) 253 5031-3
Fax. (66 2) 253 5030
Email. info@epotec.info
Rayong Plant
Map Tha Phut Industrial Estate, No. 2, I-5 Road,
A. Muang, Rayong 21150, Thailand.
Tel. (66 38) 685 233-4
Fax. (66 38) 683 982
The Company endeavors to ensure all information is correct at the time of printing.
Information in this document ‘Epotec® Epoxy Systems - Electrical and Electronic’ is subject
to change without notice.
© Copyright 2010. Aditya Birla Chemicals (Thailand) Limited. Epotec® is a registered
trademark of Aditya Birla Chemicals (Thailand) Limited. All trademarks, trade names, service
marks and logos referenced herein belong to their respective companies. All rights reserved.
02-0410