University of Rajshahi Faculty of Engineering Department of Applied ...

University of Rajshahi 

Faculty of Engineering 

Department of Applied Physics and Electronic Engineering 

Syllabus for M. Sc. Course 

Session: 2012-2013 

Examination – 2013 

The Master of Science (M. Sc.) in Applied Physics & Electronic Engineering is 

divided into two Groups, namely General group (A) & Thesis group (B). The 

courses consist of total 1000 marks (10 units) and its duration is one year. 

General Group (Group A) 

The M.Sc. Examination in Applied Physics & Electronic Engineering for the 

General group (Group A) comprises of six theoretical courses each of four 

hours duration and each carries 100 marks (4 credits). Practical examinations 

shall be of 24 hours (4 days; 6 hours a day). Marks for practical examination 

are 140. Laboratory assessment carries 60 marks. Viva-voce examination and 

continuous assessment (including study tour/in-plant training) carry 100 (4 

credits) and 100 (4 credits) marks respectively. The courses APEE-501, APEE- 

502, APEE-503 and APEE-504 are compulsory. Two others from optional 

courses shall be taken with the prior approval of the Chairman of the 

Department. 

Thesis Group (Group B) 

The examination of the Thesis group (Group-B) comprises of six theoretical 

courses out of which four courses are compulsory (i.e. APEE-501,…,504) and 

two are optional courses which shall be taken with the prior approval of the 

Chairman on the recommendation of the thesis supervisor, each of four hours 

duration and each carries 100 marks (4 credits). Marks on continuous 

assessment including study tour/in-plant training, General Viva-voce and Vivavoce 

on thesis are 100, 100 and 50 (2 credit) respectively. The Dissertation 

carries 150 marks. Students opting for the Thesis Group must take prior 

permission of the Chairman of the Department. 

Eligibility for M.Sc Examination: 

In order to be eligible for taking up the M.Sc examination, a candidate must 

have pursued a regular course of study the attending not less than 75% of the 

number of classes held (Theoretical, Practical, Class 

assessment/Tutorial/Terminal/Home assignment) provided that the Academic 

Committee of the Department of special grounds and on such documentary 

evidence as may be necessary, may condone the cases of shortage of attendance 

ordinarily not below 60%. A candidate appearing at the examination under the

Syllabus for M. Sc. Course (APEE), R.U., Session : 2012-13 

benefit of this provision shall have to pay in addition to the examination fees, 

the requisite fee prescribed by the Syndicate for the purpose. 

A candidate, who failed to appear at the examination or fails to pass the 

examination, may on the approval of the relevant Department be readmitted to 

the following session. 

20% of the assessment marks shall be awarded for attendance in the class on 

the basis of the following table: 

Attendance Marks Attendance Marks Attendance Marks 

95-100% 20% 9095% 18% 8590% 16% 

8085% 14% 7580% 12% 7075% 10% 

6570% 8% 6065% 6%

Applied Physics and Electronic Engineering 

Where (GP)i = grade point obtained in individual course, (CP)i = credit point 

for respective course, GPA = grade point average obtained, and TCP = total 

credit point obtained. GPA shall be rounded off up to 2 (two) places after 

decimal to the advantage of the examinee. For instance, GPA=2.112 shall be 

rounded off as GPA=2.12. 

Award of Degree, Publication and Improvement of Results: 

(a) Award of Degree: The degree of Master of Science shall be awarded 

on the basis of GPA obtained by a candidate in M.Sc. In order to 

qualify for the M.Sc degree a candidate must obtain within 3 (three) 

academic years from the date of first admission: 

(i) a minimum GPA of 2.50, 

(ii) a minimum GP of 2.00 in the Practical/ Thesis, and 

(iii) a minimum TCP of 36. 

The result shall be given in GPA with the corresponding LG (Table of 

letter LG, GP and CP) in bracket. For example “GPA=2.67(C+)”. 

(b) Publication of Results: The result of a successful candidate shall be 

declared on the basis of GPA. The transcript in English shall show the 

course number, course title, credit, letter grade and grade point of 

individual courses, GPA and the corresponding LG in brackets. 

(c) Improvement of Result: 

(i) A candidate obtaining a GPA of less than 2.75 at the 

Examination shall be allowed to improve his result, only 

once as an irregular candidate within 3 academic years 

form the date of first admission. 

(ii) The year of examination, in the case of a result 

improvement, shall remain same as that of the regular 

examination. His/her previous grades for Practical 

courses, Class assessment/ Tutorial/ Thesis/ Dissertation 

courses shall remain valid (except the Theory and Vivavoce). 

If a candidate fails to improve his GPA, his 

previous result shall remain valid. 

3


Compulsory Courses Unit Marks Credit 

APEE-501: Digital Communications 1.0 100 4 

APEE-502: Power Electronics & Control System 1.0 100 4 

APEE-503: Bio Medical & Analytical 

Instrumentation 1.0 100 4 

APEE-504: Condensed Matter Physics 1.0 100 4 

APEE-512: Continuous assessment 1.0 100 4 

APEE-513: Viva-voce (General) 1.0 100 4 

APEE-514: Practical (For Group-A) 2.0 200 8 

or, 

APEE-515: Thesis (For Group-B) 

Optional Courses (Any two of the following): 

APEE-505: Wireless Communication 1.0 100 4 

APEE-506: Environmental Geophysics 1.0 100 4 

APEE-507: VLSI design 1.0 100 4 

APEE-508: Image Processing and Pattern Recognition 1.0 100 4 

APEE-509: Computer Graphics & Multimedia 1.0 100 4 

APEE-510: Thin Film Technology & Energy Devices 1.0 100 4 

APEE-511: Plasma Physics and Materials Processing 1.0 100 4 

Total = 10 1000 40 

Marks Distribution of Practical APEE-514 (For Group A) 

(i) Laboratory assessment 60 

(ii) 4 (Four) Experiment (35x4) 140 

200 

Marks Distribution of each experiment will be as follow: 

i) Experiment 25 

ii) Viva-voce on Experiment 10 

35 

Mark Distribution of Thesis APEE-515 (For Group B) 

i) Dissertation 150 

ii) Viva-voce on Thesis 50 

200 

4

Applied Physics and Electric Engineering 

APEE-501 

Digital Communications 

1.0 units 100 marks 4 credits 60 lectures 

(Time: 4 hrs; 5 out of 8 questions to be answered) 

1. Digital Communication Overview: Electronic Communications; Sources and 

sinks of information; ADC, Digital Communication; Radio receivers; Signal 

transmission, Switching and networks; Advantages of digital communication over 

analogue communication. 

2. Sampling, Multiplexing: Introduction, Pulse modulation, Sampling, Analogue 

pulse multiplexing, Quantised pulse amplitude modulation, Signal to quantisation 

noise ratio (SNqR), Pulse code modulation, Bandwidth reduction techniques. 

3. Baseband Transmission: Introduction, Baseband centre point detection, Error 

accumulation over multiple hops, Line coding, Multiplex telephony, Digital signal 

regeneration, Symbol timing recovery, Repeater design. 

4. Information Theory and Source Coding: Introduction, Information and entropy, 

Conditional entropy and redundancy, Information loss due to noise, Source coding, 

Variable length coding, Source coding examples. 

5. Error Control Coding: Introduction, Hamming distance and codeword weight, 

(n,k) Block codes, Syndrom decoding, Cyclic codes, Encoding of convolutional 

codes, Practical coders. 

6. Video transmission and storage: Introduction, Color representation, Conventional 

TV transmission systems, High definition TV, Digital video, Video data 

compression, Compression standards, Packet video. 

7. Queuing theory and its application in communication: Introduction, The arrival 

process, the simple server queue, Packet speech transmission. 

8. System noise and communications link budgets: Introduction, Physical aspects 

of noise, System noise calculations, Radio communication link budgets. 

Books Recommended: 

Text Books: 

1. Digital Communications – Ian Glover, Peter Grant, Prentice-Hall Inc. 

2. Computer Networking : J.F. Kuross & K. W. Ross 

3. Data & Computer Communication : William Stallings 

4. Computer Networks : Andrew S. Tanenbaum 

5


APEE-502 

Power Electronics and Control System 



1. Power Semiconductor Diode, Reverse Recovery Characteristics: Power diode 

types, effects of forward and reverse recovery time, series and parallel connected 

diode, Multiphase star rectifier, Three-phase bridge rectifier, Three-phase bridge 

rectifier with RL load, Effects of source and load inductance. 

2. Thyristor and Controlled Rectifiers: Thyristor types, series and parallel 

operation of thyristors, Programmable Unijunction Transistor, Principle of phasecontrolled 

converter operation, single phase semiconverters, single phase full 

converters, single phase dual converter, Three phase half-wave converter, three 

phase semiconverter, three phase full and dual converters, power factor 

improvement. Thyristor commutation technique, natural commutation, forced 

commutation. 

3. AC voltage Controllers: principle of off-on control, principle of phase control, 

single-phase bi-directional converter with resistive load, three –phase half wave 

and full wave controller, three phase bi-directional Delta connected controllers, 

cycloconverters, AC voltage controllers with PWM control. 

4. Power Transistor: Bipolar junction transistor, MOSFETs, SITs, IGFETs 

(switching characteristics and switching limits), series and parallel operation. 

5. DC chopper: principle of step-down operation, step-down chopper with RL load, 

chopper classification, switching-mode regulators, Thyristor chopper circuit, 

Applications. 

6. Pulse width-modulated inverters and resonant pulse inverters: Principle of 

operation of pulse width inverters, three phase bridge inverters, voltage control of 

single and three phase inverters, series and parallel resonant inverters, class E 

resonant inverter 

7. DC and AC drives: Basic characteristics of DC motors, operating models, single 

phase drives, three phase drives, chopper drives, induction motor drives, 

synchronous motor drives, Applications. 

8. Protection of devices and circuits: Cooling and heat sinks, snubber circuits, 

reverse recovery transients, supply and load side transient, voltage protection by 

selenium diode and metal oxide varistors, current protection. 

Books recommended: 

Text Books: 

1. Power Electronics : M. H. Rashid 

2. Power Electronics : Mohan/Undeland/Robbins 

3. Power Electronics : P. C. Sen 

6


APEE-503 

Bio Medical and Analytical Instrumentation 



1. Physics of Human Body: The cell, Body fluid, Musculo-skeletal system, 

Respiratory system, Nervous system, The circulatory system, The body as a control 

system, The heart, Bioelectricity, Work done by heart, Blood pressure and its 

measurements, Membrane potentials, Electrical activity of excitable cells, 

Molecular basis of muscle contraction, Basic electrical signals from the muscles. 

2. Interaction of Wave and Radiation with Human Body: Body’s detector and 

matter wave, Speech noise, Physiological effects of intense matter waves, 

Interaction of electromagnetic radiation on living mater, Penetration of ray’s into 

tissue. Biological effects of ionizing radiation: Dosimetry, Primary effects, 

Biophysical effects of whole body irradiation,Rradiation measurement and 

protection. 

3. Biopotentials Electrodes and Amplifiers: Biopotential electrode, Sensors, 

Transducers and bioelectric amplifiers, Electromagnetic interference of medical 

electronic equipment, ENG, EMG, ECG, ERG, EEG, MEG. 

4. Ultrasonography: Physics of ultrasonic wave, Ultrasonic transducers, Absorption 

and attenuation of ultrasound, Scan modes, scan pattern and scanning systems, 

Doppler imaging, Echocardiography, Ultrasonic flow meter, Ultrasonic blood 

pressure measurement. 

5. X-ray: X-ray production, X-ray image formation and contrast, Contrast types, 

Effects of photon energy, Area contrast, Fluoroscopic imaging system, computed 

tomography. 

6. Magnetic resonance imaging: Nuclear magnetic resonance, Image characteristics, 

Gamma camera. 

7. Analytical and Medical Laboratory Instruments: Blood components, 

Colorimeter, spectrophotometer, Blood cell counter, pH/Blood gas analyzer, 

chromatograph, Auto analyzer, Atomic absorption and atomic emission 

spectroscopy. 

8. Therapeutic and Prosthetic Devices: Cardiac pacemaker, Hemodilysis, 

Defibrillator, Surgical diathermy. 


Text Books: 

1. Biophysics Concepts and Mechanisms : C. J. Casey 

2. Introduction to Biomedical equipment : Joseph J Carr & John M Brown 

technology 

3. Medical Instrumentation : John G Webster 

4. Medical Physics : J. G. Skofronick 

5. Physical Principles of Medical Imaging : Sprawls 

7

8 


APEE-504 

Condensed Matter Physics 



1. Fermi Surface & Metals: Reduced zone Scheme, Periodic Zone Scheme, 

Construction of Fermi surface; Calculation of Energy bands, Deep Level Transient 

spectroscopy (DLTS), De Haas-Van Alphen effect, Nearly free electron 

approximation, Tight binding method, Wigner-Seitz method. Pseudo potential 

method. 

2. Plasmons, Polaritons and Polarons: Plasma optics, plasmons, Electrostatic 

Screening Mott. Metal Insulator transition, Polaritons, Fermi liquid, Polarons. 

3. Magnetic Resonance: Nuclear Magnetic resonance, Line width Hyperfine 

Splitting; Nuclear quadruple resonance; Electron paramagnetic resonance, 

Ferromagnetic resonance; Antiferromagnetic resonance. 

4. Ferroelectrics: General Properties of ferroeletric materials, classification and 

properties of representative ferroelectrics, Dipole Theory of ferroelectricity, Ionic 

displacement and the behaviour of Perovskite above the Curie temperature, Theory 

of Spontenous polarization of Perovskite, Thermodynamics of Ferroelectric 

transition, Ferroelectric Domains. 

5. Spin Electronics: Introduction, Technical basis of spin electronics, Spin injection, 

Giant magneto resistance (GMR), Tunneling magneto resistance (TMR), Spintronic 

devices and applications: Spin transistor. 

6. Nanomaterials and Nanostructures: Nanoscale fabrication: Introduction to 

nanolithography, Self assembly and self organization, Carbon nanotubes, Quantum 

dot, Quantum confinement, Nanocomposites. 

7. Nanodevices and Nanostructure Imaging: Molecular devices, I-V characteristics 

of molecular devices, Molecular switch and transistor, Nanostructure of quantum 

computation, Imaging techniques in nanostructure: Optical microscopy, Scanning 

probe Microscopy, AFM, SEM, STM, TEM. 

8. High Tc Superconductivity: Introduction, High-Tc superconducting oxides 

(YBCO, LSCO), Perovskites, Normal state of high-Tc oxides, Superconducting 

state, Microscopic theory of high-Tc superconductivity 


Text Books: 

1. Introduction to Solid State Physics : Charles Kittel 

2. Introduction to Nanoscale Science 

: Massimiliano Di Ventra 

and Technology 

3. Handbook of Nanoscience, Engineering, : William A. Goddard et al. 

and Technology 

4. Introduction to Superconductivity 

: Michel Cyrot and Davor Pavuna 

and High-Tc Materials


References Books: 

1. Solid State Physics : A.J. Dekker 

2. Electronic Process of in Materials : L Azaroff and J. Brophy 

3. Fundamental of Solid State 

Physics 

: B.S. Saxena, R.C. Gupta & 

P.N. Saxena 

4. Material Science for Engineers : L. H. Van Vlack 

5. Materials Science : J.L. Anderson, R.D. Leaver, 

J. H. Alexander & R.D. Rawlings 

APEE-505 

Wireless Communication 



1. Wireless Communication system: Second generation cellular network, 2.5G 

wireless networks and 2.5G TDMA standards, Third & Fourth generation wireless 

networks, CDMA 2000, WCDMA, GSM, WiMAX, WiFi. Wireless local loop and 

LMDS. 

2. Cellular Concept-system design fundamentals: Introduction, frequency reuse; 

Channel Assignment and handoff strategies, Interference and system capacity; 

Improving coverage & capacity in cellular system. 

3. Large Scale radio propagation (path loss): Free space propagation model, Radio 

propagation mechanisms (reflection, diffraction & scattering), Practical link budget 

design using path loss models, Outdoor and indoor propagation models. 

4. Small–scale radio propagation (fading and multipath): Small-scale multipath 

propagation, Small-scale multipath measurements, Parameters of mobile path 

channels, Types of small-scale fading, Rayleigh and Ricean distribution,. Statistical 

models for multipath fading channels. 

5. Modulation techniques for wireless radio: Digital modulation, line coding, Pulse 

shaping techniques, Linear modulation techniques (BPSK, DPSK) and different 

types of QPSK, QPSK transmission and detection techniques, Constant envelop 

modulation (BFSK, MSK, & GMSK), Combined linear and constant envelop 

modulation technique, Spread spectrum modulation techniques. 

6. Equalization, Diversity & Channel coding: Fundamentals of equalization, 

Equalization in communication receiver, Algorithm for adaptive equalization, 

Diversity technique, Channel coding, RAKE receiver, Block codes, Convolution 

codes, 

7. Speech coding: Characteristic of speech signals, Quantization techniques, 

Frequency domain coding of speech, Vocoders, Linear predictive coders. 

8. Multiple access techniques for wireless Communication: Introduction to 

multiple access, Frequency and time division multiple access, Spread spectrum 

multiple access, Space division multiple access, Packet radio, Capacity of cellular 

system, Wireless systems and standards. BTS installation & testing. 

9



Text Books: 

Wireless Communications : Theodore S. Rappaport, 

Reference Books: 

1. Principles of wireless networks : Kaveh Pahlavan & Prasant Krishnamurty 

2. Wireless Communication : Andrea Goldsmith 

APEE-506 

Environmental Geophysics 



1. Introduction: The environment, physics in the environment, environmental systems 

overview, human and global environment, environmental modeling, mass balances, 

model calibration and verification. 

2. Water: Sources of water, hydrologic cycle and processes, distribution of subsurface 

water, flow of surface and groundwater, saturated and unsaturated flow, differential 

equations governing groundwater flow, water quality, sources and effects of water 

pollution, water treatment process and purification, natural and engineering system. 

3. Atmosphere: Distribution and composition of atmosphere, physical and chemical 

fundamental of air, origin and fate of air pollutants, effects of air pollution in micro and 

macro levels, greenhouse effects, effects of air pollution on meteorological conditions, 

solar spectrum, the Einstein coefficient, Lambert Beer’s law, solar UV and life, ozone 

filter, effects of thermal pollution and its prevention. 

4. Noise: Basic acoustics, the wave equation, intensity and levels, human perceptions 

and noise criteria, effects of noise pollution, rating systems, active controls of noise 

pollution. 

5. Radiation: Radioactivity and radiation, Biological effects of ionizing radiation, shortterm 

and long-term and genetic effects, Radiation sources in the environment, reduction 

of internal and external radiation hazards, low-level and high-level radioactive waste 

management. 

6. Remote Sensing: Remote sensing system, remote sensing satellites, interaction with 

earth, atmospheric effects, sensors, scanners, image rectification, enhancement and 

classification, photo-interpretation, microwave remote sensing. 

7. Application of Remote Sensing in Geosciences: Measurement of image features, 

remote sensing for survey and mapping, lithological discrimination, ocean resources, 

monitoring land use, studies soil and agriculture, environmental applications, sustainable 

development, geophysical exploration, airborne geophysical survey, DEM. 

8. Geographic Information System (GIS): Basic concept, components of GIS, 

geographic data and structure, vector and raster approaches, spatial analysis operations, 

spatial analysis of discrete entities and continuous fields, GIS integration techniques, 

errors and its propagation, Application of GIS in environmental monitoring and impact 

analysis, hydrogeological studies and geophysical exploration. 

10


Text Books: 

1. Introduction to Environmental 

Engineering 

2. Fundamental of Remote 

Sensing 

3. Concepts and Techniques of 

Geographic Information 

Systems 


: M.L Davis and D.A. Cornwell 

: Remote Sensing Tutorial, Canada 

Centre for Remote Sensing 

: C.P.L. and Albert K.W. Yeung 

Reference Books : 

1. Environmental Physics : E. Boeker and R.V.Grondelle 

2. Environmental Modeling : J.L. Sehnoor 

3. Air Pollution : M.N. Rao and H.V.N. Rao 

4. Fundamentals of Remote : George Joseph. 

Sensing 

5. Principles of Geographic 

Information Systems 

: P.A. Burrough 

APEE-507 

VLSI Design 


(Time: 4hrs; 5 out of 8 questions to be answered) 

1. Digital Systems and VLSI: Design integrated circuits. Integrated circuit 

Manufacturing. CMOS technology. Integrated circuit Design techniques. A look into the 

future. 

2. Transistors and Layout.: Fabrication processes. Transistors. Wires and Vias. 

Design rules. Layout design and tools. 

3. Logic Gates: Combinational logic functions, Static complementary gates, Wires and 

delay, Switch logic, Alternative gate circuits. 

4. Combinational Logic Networks: Layout design methods. Simulation. 

Combinational network delay. Crosstalk, Power optimization. Switch logic networks. 

Combinational logic testing. 

5. Sequential Machines: Latches and Flip-Flops. Sequential systems and clocking 

disciplines. Sequential system design. Power optimization. Design validation. Sequential 

testing. 

6. Subsystem Design: Subsystem design principles. Combinational shifters. Adders. 

ALUs. Multipliers. High-density memory. Field-Programmable Gate Arrays. 

Programmable Logic Arrays. 

11


7. Floor planning: Floor planning methods. Floor planning large chips. Off-chip 

connections. 

8. Architecture Design: Hardware Description Languages. Register-Transfer design. 

High-level synthesis. Architecture for low power. Architecture testing. 


Text Book: 

1. Modern VLSI Design - Systems on Chip : Wayne Wolf 

Reference Book: 

2. Principles of CMOS VLSI Design : Weste & Eshraghian 

12 

APEE-508 

Image Processing and Pattern Recognition 



1. Introduction: Digital image, Steps in digital image processing, Components of an 

image processing system, Application of digital image processing, Image sampling 

and quantization, Basic relationships between pixels. 

2. Intensity Transformations and Spatial Filtering: Basic concepts, Intensity 

transformation functions, Histogram processing, Mechanics of spatial filtering, 

spatial correlation and convolution. 

3. Filtering in the Frequency Domain: Preliminary concepts, Extension to functions 

of two variables, Properties of 2-D DFT, Discrete cosine transform, Filtering 

fundamentals, Steps for filtering Image smoothing, Image sharpening, Image 

restoration, Noise models, Noise reduction, Inverse filtering, Wiener filter. 

4. Wavelets and Multiresolution Processing: Background, Haar transform, 

Multiresolution expansions, Wavelet transforms. 

5. Image compression: Fundamentals of image compression, Coding redundancy, 

Spatial and temporal redundancy, image compression model, Huffman coding. 

6. Morphological Image Processing: Erosion, Dilation, Opening, Closing, Basic 

morphological algorithms-Boundary extraction, Hole filling, Skeletons. 

7. Image Segmentation and Color Image Processing: Basic concepts, Point, linc, 

and edge detection, Thresholding, Region-based segmentation, Color models, 

Color transformations. 

8. Pattern Recognition: Patterns and pattern classes, Recognition based on decisiontheoretic 

methods, Basic model of a neuron, Perceptron, Neural networks, Learning 

methods.



Text Book: 

1. Digital Image Processing : Rafael C. Gonzalez, Richard E. Woods 


1. Image Processing, Analysis and Machine Vision : Millan Sonka, Vaclau 

Hlavac, Roger Boyle. 

2. Digital Image Processing : William K. Pratt 

APEE-509 

Computer Graphics and Multimedia 



1. Introduction & Graphic Devices: Brief history, Graphics input devices, Graphics 

storage devices, Communication devices, Common display devices, Raster-Scan 

CRT. 

2. Graphics Fundamentals and Scan Conversion: Hardware and software and the 

fundamental ideas behind modern computer graphics, Scan converting a point, a 

straight line, a circle. 

3. 2-Dimensional & 3-Dimensional Graphics Transformation And Creation: 

Geometric transformation; Coordinate transformation; Composite transformation; 

Two dimensional viewing transformation, Three dimensional viewing 

transformation; Applications as Adobe PhotoShop, Paintbrush etc. 

4. Geometric Forms, Models and Hidden Surfaces: Introduction, Simple geometric 

forms, Weinframe models, Curved surfaces, Curve design, Depth comparisons, Z- 

Buffer algorithm, Scan line algorithms. 

5. Multimedia Media and Data Streams: The perception Medium, The 

representation medium, Presentation medium, Storage medium, Combination 

Media, Multimedia, Asynchronous and synchronous transmission mode, The time 

interval between a complete transmission of consecutive packets. 

6. Sound: Computer representation of sound, Auto formats, MIDI Basic concepts, 

MIDI devices, MIDI software, Speech generation. 

7. Images, Graphics, Video and Animation: Digital image representation, image 

format, graphics format, image synthesis, Video signal representation, Computer 

video format, Animation Language, Display of Animation. 

8. Data Compression and Optical Storage Media: Storage space, Coding 

requirements, Basic compression techniques, JPEG, MPEG, Video disks and other 

WORMs, Compact disk digital audio, CD-ROM Extended architecture, CD-ROM 

based developments. 

13



Text Books: 

1. Computer Graphics :Roy A. Plastock Gordon Kalley 

2. Multimedia: computing, communications & Applications :Ralf Steinmetz and 

Klara Nahrstedt 

14 

APEE-510 

Thin Film Technology & Energy Devices 



1. Thin Film Preparation Techniques: Thermal evaporation, Evaporation theory 

and mechanism, E-beam evaporation, Sputtering, Plasma and Ion bean 

Sputtering, Sputtering yields, MBE, Chemical Vapor Deposition, Spray 

pyrolysis, Sol-gel technique. 

2. Growth and Structure of Thin Films: Thermodynamics of Nucleation, 

Atomistic Theory of Nucleation, Coalescence, Influence of deposition 

parameters, Crystallographic structure of Thin Films, Epitaxial-growth 

phenomena, Structural defects in Thin Films. 

3. Thickness measurements & Analytical Techniques: Electrical methods; 

Mechanical methods; Optical interference method; Analytical techniques, 

Chemical analysis, Structural analysis, Surface structure optical methods; Low 

energy electron interaction (LEEI) Auger electron spectroscopy, X-ray 

diffraction, Transmission Electron microscopy and Scanning Electron 

Microscopy. 

4. Transport Phenomena in Metal and Semiconducting Films: Electrical 

conduction in discontinuous & continuous films. Temperature effect, Field 

effect, Hall effect, Thermoelectric power, Quantum size effect, Activation 

process, Optical absorption, transmission, reflection, Photoconductive 

mechanisms. 

5. Transport Phenomena in Insulating Films: Electrical conduction in insulating 

films, Inhomogenous materials, Cermet, Electrical conduction, Effective 

medium theories, Maxwell-granett theory, Bruggman theory, Field effect, 

modified effects, Schottky effect, Poole-Frenkel effect, Tunneling & space 

charge limited Conduction. 

6. Energy Efficiency: Selective surface coating, Thermochromism, 

electrochromosim, photochromosim, Smart window , Materials for smart 

Window, Energy efficient devices.


7. Photovoltaic System & Modules: a-Si materials, Optimization of cell 

parameters, Heterojunction cells, Module efficiency measurements, Module 

control test specification, photoelectrochemical cells based on different 

semiconducting materials, Hydrogen based Fuel cells, New materials for 

hydrogen production. 

8. CVD and Spary Pyrolysis material: CVD Technique and measurements, 

materials for CVD, spray Pyrolysis Technique and measurements, materials for 

Spray Pyrolysis Sol-gel Techniques & material search. 


Text Books: 

1. Thin Film Phenomena :K.L. Chopra 

2. Hand Book of Thin Films Technology : Maissel and Glang 

3. Thin Film Technology :C.G,Gavanqirst and G.A Niklassons 

4. Solar Energy Conversion :A.E. Dixon and J.D. Leslie 


1. Thin Film Device, Applications :K.L.Chopra and I. Kaur 

2. Thin Film Physics :O.S. Heavens 

3. Solar Power Engineering :B.S. magal 

4. Solar Selective Surface :O.P. Agnihotri and B.K. Gupta 

5. Solar Engineering of Thermal Process :J.A. Duffie, and W.A. Beckman 

APEE-511 

Plasma Physics and Materials Processing 



1. Basic Plasma Equations And Equilibrium: Field Equations, Maxwell’s 

Equations, The Conservation Equations, Boltzman’s Equations, Macroscopic 

quantities, Particle Conservation, Momentum Conservation, Energy Conservation, 

Equilibrium Properties, Boltzman’s relation, Debye Length, Quasineutrality. 

2. Collision Processes: Basic concepts, Elastic and Inelastic Collisions, Collision 

Parameters, Differential Scattering Cross Section, Collision Dynamics, Energy 

Transfer, Small-Angle Scattering, Elastic Scattering, Polarization Scattering, 

Inelastic Collisions, Electric Dipole Radiation and Metastable Atoms, Cross 

Sections, Maxwellian Distribution, Surface Effects, Molecular collisions. 

3. Plasma Dynamics: Basic Motions, Nonmagnetized Plasma Dynamics, Guiding 

Center Motion, Dynamics of Magnetized Plasmas, Waves in Magnetized Plasmas, 

Wave Diagnostics. 

15


4. Diffusion and Transport: Basic relations, Diffusion Solutions, Low-Pressure 

Solutions, Diffusion across a Magnetic Field, Magnetic Multipole Confinement. 

5. Dc Sheaths: Basic Concepts and Equations, Bohm Sheath Criterion, High-voltage 

Sheath, Criteria for Sheath Formation, Collisional Sheaths, Probe Diagnostics. 

6. Chemical Reactions and Equilibrium: Energy and Enthalpy, Entropy and Gibbs 

Free Energy, Chemical Equilibrium, Heterogeneous Equilibrium. 

7. Chemical Kinetics and Surface Processes: Elementary Reactions, Gas-Phase 

Kinetics, Surface Processes, Surface Kinetics. 

8. Different Types of Discharges: Capacitive Discharges, Inductive Discharges, 

Wave-Heated Discharges, DC Discharges, Etching, Plasma-Enhanced chemical 

Vapor Deposition, Sputter Deposition, Plasma Immersion Ion Implantation. 


Text Books: 

1. Principles of Plasma Discharges and Materials Processing: Michael A. Lieberman and 

Allan J. Lichtenberg 


1. Gas Discharge Physics: Yuri P. Raizer. 

16

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