wlcsp-11-p2 - Ricoh
wlcsp-11-p2 - Ricoh
wlcsp-11-p2 - Ricoh
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PACKAGE INFORMATION<br />
PE-WLCSP-<strong>11</strong>-P2-07<strong>11</strong>06<br />
POWER DISSIPATION (WLCSP-<strong>11</strong>-P2)<br />
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.<br />
This specification is based on the measurement at the condition below:<br />
Measurement Conditions<br />
Standard Land Pattern<br />
Environment<br />
Mounting on Board (Wind velocity=0m/s)<br />
Board Material<br />
Glass cloth epoxy plastic (Double sided)<br />
Board Dimensions<br />
40mm × 40mm × 1.6mm<br />
Copper Ratio Top side : Approx. 80%, Back side : Approx. 90%<br />
Through-hole<br />
φ0.6mm × 31pcs<br />
Measurement Result<br />
Power Dissipation<br />
Thermal Resistance<br />
Thermal Resistance<br />
(Topt=25°C, Tjmax=125°C)<br />
Standard Land Pattern<br />
1000mW<br />
θja=(125−25°C)/1W=100°C/W<br />
θjc=7°C/W<br />
1200<br />
40<br />
Power Dissipation PD(mW)<br />
1000<br />
800<br />
600<br />
400<br />
200<br />
1000<br />
On Board<br />
40<br />
0<br />
0 25 50 75 85 100 125 150<br />
Ambient Temperature (°C)<br />
Power Dissipation<br />
Measurement Board Pattern<br />
IC Mount Area Unit : mm
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