in PDF Format - Embedded-Control-Europe.com

Dear Readers, 

VIEWPOINT 

… and once again it s time for the 

embedded community to meet at 

the fairgrounds in Nuremberg to 

participate at the embedded world 

Exhibition & Conference 2012. According 

to the organizer this year 

the event has evolved to the world’s 

largest international trade fair and 

congress for everything connected 

with embedded systems. Right on 

time for its tenth edition it has set 

a new record: from 28th February 

to 1st March 2012 around 900 international 

companies will be presenting 

their products in increased 

exhibition space. With Halls 1, 2, 

4, 4A and 5, the rapidly growing event is therefore occupying new 

and larger “work rooms”. The embedded world conference and the 

electronic displays conference will impress with a total of around 300 

experts’ lectures. International speakers will provide first-class knowhow 

from all areas of Embedded System development and on display 

technologies at first hand. 

The motto of the 2012 event “welcome to a smarter world” reminds 

me of the former IBM slogan “make our planet smarter” and shows 

the major trend in the embedded industry: integrating intelligence in 

nearly every device and link all of them via Internet. A few weeks ago 

at OOP 2012 in Munich IBM Rational promoted OSLC (open services 

for lifecycle collaboration) an Internet based three step transformation 

of project resources into hyper data comparable to hypertext concept. 

First step is to use URLs for any resource, step two is to define lifecycle 

resources in XML and use common elements, and in step three suited 

interfaces are necessary to get access to services of the resources. To 

further standardize OSLC the Eclipse Lyo project was founded to 

create software design kits for tool providers which simplifies implementation 

and enhance acceptance of OSLC specifications. 

The idea behind OSLC – to make our planet smarter - originally 

created for software development and evolved further into entire systems 

is now reaching the embedded world. Our cover story “Transforming 

the world with intelligent systems” starting at page 6 describes 

how solutions from Intel and its Embedded Alliance, a global 

ecosystem of more than 200 members, are driving smarter and more 

connected embedded designs. Some of these solutions will be presented 

at embedded world Exhibition & Conference in Nuremberg. 

To help you as an embedded specialist to plan your visit at the show 

we integrated some useful information in this issue. For example 

you ll find articles comprising the opinion of experts about future 

trends in various segments of the embedded industry, a list of 

exhibitors starting at page 32, and new products introduced at this 

event. 

I look forward to seeing you in Nuremberg 

Yours sincerely 

Wolfgang Patelay 

Editor 

3 February 2012

CONTENTS 

Viewpoint 3 

Cover Story 

Transforming the World 

with Intelligent Systems 6 

Embedded World Preview 

APU with high performance graphics 

enables real-time operation 13 

Embedded Computing trends 2012: 

increased efficiency, new technologies 15 

Ecosystem around CompactPCI Serial 

promises bright future 18 

Quo vadis Microcontrollers? 23 

Technical trends for embedded development 

and test tools 30 

Exhibitors List 32 

Embedded World Highlights 

Preview about exhibition highlights 

of Embedded World 40 

Cover Photo 

Intel 

February 2012 4 


with Intelligent Systems PAGE 6 

How Intel solutions are driving smarter, 

more connected designs 


increased efficiency, new technologies PAGE 15 

In this article you will find opinions from experts about future 

trends in embedded computing, starting with small form factor 

boards and progressing up to larger baseboards. 

Quo vadis Microcontrollers? PAGE 23 

In this article managers of various MCU suppliers express their 

opinions about future trends for MCUs in different embedded 

market segments. 


and test tools PAGE 30 

In this article two experts in the embedded tools industry express 

their opinions about the innovations and trends they see in this 

domain. 


of Embedded World PAGE 40 

This year Embedded World Exhibition&Conference brings the 

embedded community together in Nürnberg for the tenth time. 

After last year’s record number of exhibitors and visitors, the exhibition 

is moving to the larger halls 1, 2, 4, 4A and 5.

COVER STORY 


with Intelligent Systems 

by Jim Robinson, General Manager, Marketing and Business Operations, 

Intel ® Intelligent Systems Group 

How Intel solutions 

are driving smarter, 

more connected designs 

n The demand for embedded computing is 

booming. Billions of devices are being deployed 

to power a diverse set of applications, including 

communications and energy infrastructure, 

in-vehicle infotainment (IVI) systems, retail 

systems, and digital signs. Across these and 

other applications, a common theme is emerging: 

devices need to be more than isolated, 

fixed-function systems. They need to become 

Intelligent Systems with advanced connectivity 

and functionality. Developing and selling these 

Intelligent Systems is the key to being a player 

in the explosion in devices and data. 

Intel and the Intel® Embedded Alliance, a global 

ecosystem of more than 200 members, are helping 

original equipment manufacturers (OEMs) 

and developers around the world address this 

changing market segment. Working in concert, 

Intel and the Alliance are developing the hardware, 

software, tools and system integration 

services that make it easier for developers to 

speed new Intelligent Systems to market. 

In this article, we look at what it takes for a device 

to be an Intelligent System and show how 

these devices deliver expanded functionality, 

enhanced productivity, and improved efficiency 

to businesses and consumers. We give details 

how Intel and the Alliance are providing the 

processing performance, connectivity, security 

and manageability necessary to bring these 

systems to life. We also look at examples of the 

kind of solutions being offered by Intel and 

the Alliance in key industries such as communications, 

retail and automotive. 

Defining Intelligent Systems 

To understand what differentiates an Intelligent 

System, let’s consider signage applications. A 

standalone digital sign can engender greater 

engagement in a retail environment, enticing 

consumers to buy more. That sign becomes 

much more valuable when connected to an intelligent 

media server with the power to run 

high definition (HD) images and video on 

multiple screens. It becomes even more valuable 

when equipped for remote management and 

security, ensuring maximum uptime and timely 

content updates, all from a central location. 

For greater value still, add a camera and anonymous 

video analytics software that can identify 

the age, gender, and viewing time of each user, 

and serve up targeted content. The final step 

is to use the cloud to deliver and store both 

the display media and the viewing data. The 

result is an Intelligent System that provides 

valuable business intelligence and can rapidly 

scale to thousands of locations worldwide. 

Innovations like these are driving the current 

transformation from traditional embedded devices 

to intelligent, connected devices. Market 


research firm IDC and others have identified 

this shift and created a new embedded category 

called “Intelligent Systems.” According to their 

definition, Intelligent Systems are devices enabled 

with high-performance microprocessors 

and high-level operating systems that: 

• Connect other devices and services through 

a network or the Internet 

• Are secure and manageable 

• Intuitively recognize the user 

• Are commerce- and service-enabled 

According to Mario Morales, vice president of 

semiconductor research at IDC, “… this new 

generation of intelligent systems and its ecosystem 

will have broad reach and establish the 

next wave in computing over the next five 

years.” Mukund Ghangurde, director of product 

management for the Windows Embedded product 

line at Microsoft agrees. He says, “We see a 

major transformation underway in the industry 

– a transformation that is changing the way 

software and data are consumed and delivered. 

The rising demand for computing power to extend 

beyond desktops and servers, connectivity 

and the implementation of dynamic user experiences 

has fundamentally transformed the way 

embedded devices are built, the way we use 

them, and the value they provide across our 

work and our personal lives.” (Microsoft is an 

Associate member of the Alliance.)

EMBEDDED WORLD HIGHLIGHTS 

Figure 1. The 2011 IDC worldwide embedded semiconductor forecast 

predicts that systems on chip (SoC) and standalone microprocessor 

units (MCU) will account for two thirds of all revenues by 2015, while 

microcontroller (MCU) and digital signal processor (DSP) products 

will see much smaller growth. The forecast excludes PCs and cell 

phones. (Data courtesy of IDC.) 

More and more applications and end users are demanding such 

capable and connected devices. According to a September 2011 IDC 

report, the market for products in the Intelligent Systems category is 

projected to grow from 19% of all electronic system unit shipments in 

2011 to more than one-third by 2015, representing more than $2 

trillion in revenue. 1 The same report predicts that systems on chip 

(SoC) and standalone microprocessor units will account for two thirds 

of all embedded semiconductor revenues by 2012 (see Figure 1). 

The progression of embedded systems from isolated, fixed-function devices 

to Intelligent Systems is rapidly bringing the “Internet of Things” 

to reality. According to the IDC report, this momentum will “accelerate 

beyond 2015 as the ecosystem of hardware, software, and services 

vendors bring more intelligence into systems through higher levels of 

performance and programmability, more forms of connectivity, increasing 

penetration of sensors, and a growing base of cloud-based applications 

and data.” For OEMs, the Intelligent Systems market presents 

an excellent opportunity to develop devices that through their advanced 

features, connectivity, and other advantages enable them to better differentiate 

their products from their competitors and command a higher 

price point. 

Four Foundational Building Blocks for Intelligent Systems 

Recognizing that intelligence is needed across the full spectrum of computing, 

Intel and the Alliance are helping to accelerate this transition to 

Intelligent Systems by supplying silicon, software, and services to enable 

intelligence from devices to the cloud. Together, we are providing all 

four of the key building blocks – performance, connectivity, security, 

and manageability – required to enable data to flow seamlessly and 

securely from sensors to the network and on to the data center. Let's 

now take a brief look at of these four foundational elements. 

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Performance 

Intelligent Systems have unique processing requirements for which 

Intel® architecture (IA) is ideally suited. These include processing rich 

content with heavy computational demands and high-bandwidth requirements, 

processing analytic information, servicing data from 

multiple monitors and sensors, and handling combined real-time and 

non-real-time information processing. Intel works with Alliance 

members to optimize their software for IA to ensure devices run more 

efficiently and have ample performance headroom to meet the complex 

processing requirements of Intelligent Systems. 

Backed by seven-year lifecycle support, IA processors for Intelligent 

Systems span from power-efficient sub-3 watt Intel® Atom processors 

(Figure 2) to Intel® Xeon® processors providing up to 12 cores in a 

dual-socket configuration. The top-to-bottom scalability of the embedded 

Intel architecture product line enables board-level solutions ranging 

from small form factor modules to full ATCA systems providing the 

requisite high-performance across the spectrum of Intelligent Systems. 

Driving ever better performance per watt with each new generation of 

processors is the “tick, tock” cadence by which Intel advances its manufacturing 

technology and microarchitecture. For example, the future 

3rd generation Intel® Core processor family will be the first to use 

Intel’s ground-breaking 22nm Tri-Gate process, which will offer significant 

advances in both power and performance. From the architecture 

perspective, IA processors integrate a variety of advanced capabilities, 

such as high definition (HD) video and media-processing features, that 

lower system power demands and help board manufacturers reduce 

their bill of materials (BOM). 

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Connectivity 

Overall CPU 

3DMark v.1.2.0 

Figure 2. Intel® Atom processor N2600 power profiling. 2 

Demand in nearly every industry is growing for devices that intelligently 

connect to other devices, to the enterprise, and to cloud services. Such 

connectivity – often referred to as machine-to-machine or M2M communications 

– requires powerful hardware to run sophisticated connectivity 

applications; embedded-specific device middleware to shorten 

the design cycle; and applications and services to enable the supporting 

infrastructure. Intel architecture-based products from the Alliance are 

an excellent match for each of these needs, offering advanced wired, 

wireless, and cellular network connectivity in a wide range of boards 

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COVER STORY 

powered by high-performance, low-power embedded 

processors. The Kontron M2M Smart 

Services Developer Kit is an excellent example. 

(Kontron is a Premier member of the Alliance.) 

This Intel® Atom processor-based kit brings 

together a comprehensive set of hardware, software, 

cloud services, and cellular service contracts, 

empowering developers to rapidly deploy 

complex applications. New in the latest Intel 

Atom processors is Intel® Smart Connect Technology. 

This feature automatically performs 

periodic connections to the network whenever 

available even while a device is in sleep mode. 

This keeps devices always updated, always 

ready to go upon wake, and helps mobile devices 

make the most of cloud services. 

Security 

Billions of Intelligent Systems provide tempting 

targets for malware and today’s increasingly 

sophisticated attackers. End-to-end security 

that covers embedded endpoints throughout 

the network infrastructure is a must-have. To 

provide a comprehensive security platform 

for embedded devices and systems in all states 

of operation, Intel provides a combination of 

hardware technologies along with software 

technologies from subsidiaries McAfee (an As- 

MicroSys 

El 

ectr ectronics 

GmbH 

sociate member of the Alliance) and Wind 

River (an Associate member of the Alliance). 

Meanwhile, Intel is helping the industry address 

security in many ways. For instance, through 

Intel® vPro technology, many Intel processors 

provide Intel® Virtualization Technology 

(Intel® VT) and Intel® Trusted Execution Technology 

(Intel® TXT) 3 to help secure virtual 

environments. Intel VT uses hardware-assist 

to trap and execute certain instructions on behalf 

of guest OSs, relieving the hypervisor of 

such duties. This makes these commonly used 

virtualization operations more secure because 

they are performed in hardware and thus unalterable 

by hackers. Intel TXT provides a protection 

layer that hardens virtual environments 

against malicious software insertions before 

virtual machines (VMs) launch. To help encryption 

software perform faster and provide 

stronger protection, many Intel processors 

offer Intel® Advanced Encryption Standard – 

New Instructions (Intel® AES-NI). 4 

Manageability 

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manageability solutions through Intel® Active Management 

Technology (Intel® AMT), which is built 

into Intel® Core vPro processors. Intel AMT 

enables IT technicians to remotely troubleshoot 

and repair devices, quickly deploy security patches, 

and manage data security settings. 

Applying Intelligent Systems to 

Key Sectors 

Intel is taking a holistic approach by working 

closely with Alliance members to focus on solutions 

that meet market needs, help OEMs 

speed solutions to market, and enhance the ultimate 

device owner’s experience. Probably the 

best ways to illustrate this are examples of Intelligent 

Systems being offered by Intel and the 

Alliance in some key industries. 

Scalable Telecom Performance 

In the past, real-time IP media processing typically 

ran on specialized digital signal processing 

(DSP) hardware. With the growing multi-core 

performance of Intel Xeon processors, these 

processing-intensive applications can now be 

deployed on general-purpose servers, enabling 

a lower-cost solution. A good example is the 

 

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Figure 3. IP forwarding performance for a 2.4 

GHZ Intel® Xeon® processor E5645 running 

6WINDGate. The performance varies based 

on the number of fast path protocols running 

in the system. 

Radisys Software Media Server. (Radisys is a 

Premier member of the Alliance.) This costeffective 

IP media processing platform can 

scale to thousands of ports on a single 1U 

rackmount server platform, or tens of thousands 

of ports on a fault-resilient bladed chassis 

architecture. 

Using server-class hardware, the Radisys software 

can consolidate the functions of announcement 

and record ing servers, audio and video conference 

bridges, interactive voice response units 

(IVR/VRU), messaging equipment, and speech 

platforms onto one server. 

A special “co-residency” capability allows integration 

of a VoIP telecommunications application. 

This enables original equipment manufacturers 

(OEMs) to offer integrated all-in-one 

telecommunication products for even greater 

cost advantage. Intel Xeon processors are key 


to delivering this impressive scalability and 

performance. These multi-core pro cessors have 

the performance to consolidate applications, 

services, control plane processing, and packet 

processing on a single platform. 

Advantech, a Premier member of the Alliance, 

and 6WIND, an Affiliate member offer a solution 

for United Threat Management (UTM) 

that provides another way to tap this scalable 

performance. Using Advantech’s FWA-6500 

Network Appliance Platform and 6WIND’s 

6WINDGate packet processing software, this 

solution splits the networking stack to provide 

a multi-core optimized fast path that processes 

the majority of packets outside of the OS environment. 

This enables performance to scale 

linearly over cores, using multi-core Intel Xeon 

processors to their full advantage (Figure 3). 

Road-Ready IVI 

Figure 4. Emerson uses the Intel® AIM Suite to enable intelligent signage. 

In a world of ever-present connectivity, in-vehicle 

infotainment (IVI) systems present a serious 

embedded design challenge. These systems 

need to combine a wide range of hardware, 

software, and communications components 

to provide features such as hands-free 

communications, voice-activated music selection, 

real-time navigation/traffic information, 

streaming multimedia, and interactive gaming. 

Intel and the Alliance are helping OEMs build 

this next generation of intelligent IVI systems 

in a number of ways. 

For example, ArcherMind Technology, a General 

member of the Alliance, is offering developers 

a total telematics solution supporting 

GPS, rearview camera, Wi-Fi, Bluetooth, HD 

audio and video, hands-free calling, voice 

recognition, and much more. It’s designed to 

run Android on an Intel® Atom processor 

E6xx series-based platform. 

11 February 2012

COVER STORY 

To help developers get a jump on using such a 

system, Wind River offers a Wind River Platform 

for Android. This platform includes a fully validated 

Android build optimized for Intel® 

Atom processors, best-in-class commercial software 

components, and an automated software 

test framework. This platform enables developers 

to rapidly deliver a customized solution 

to fit specific IVI or other market needs without 

having to reinvest in bringing up core platform 

components and ensuring their stability. 

An Affiliate member of the Alliance, Green 

Hills Software, has worked with Intel to create 

an IVI platform that safely combines infotainment, 

driver-assistance, and instrument cluster 

features on a single electronic control unit. 

This innovative solution takes advantage of 

the Intel VT support available in the Intel 

Atom processor E6xx series to safely share 

hardware – including the graphics engine – 

across these applications, cuting system costs 

and improving flexibility. 

1 “Intelligent Systems Transforming the Embedded 

Industry, According to IDC,” IDC press release, September 

9, 2011. 

2 Results: 

All results are collected by Intel Corporation on a 

system based on the Intel® Atom processor N2600. 

The results presented in this document are collected 

on a single sample. The data has not been post 

processed to account for part to part variation. 

Test Configuration : 

Processor: Intel® Atom processor N2600 ( 

2Cores/4Threads); Chipset: Intel® NM10 Express 

chipset; Bios Rev: CTCRB052 

Platform: Cedar Rock CRB, SODIMM 1x 2GB 

/DDR3/1066MHz 

Software:Windows 7 x64 was used to run TAT 3.8.6.1052, 

3DMark 06, Elephants Dream 720P/1080P video 

with VLC player; CentOS 0.5 was used to run 

CPU2006 [400.Perlbench for CINT(specint) and 

416.Gamess for CFP (specfp)] 

Going to Market with Retail Solutions 

Alliance members and Intel are collaborating 

with retailers to develop technologies that deliver 

immersive and personalized retail experiences 

for consumers. For example, Emerson, a Premier 

member, is developing a reference platform for 

digital signage that will make it easier for 

retailers to take advantage of context-aware 

technology. Running Microsoft Windows Embedded 

Standard 7 on the Emerson MCASE- 

820 embedded computer, this solution is a fully 

configured, application-ready platform capable 

of running popular signage software. The platform 

uses Intel® Audience Impression Metrics 

Suite (Intel®AIM Suite) software to perform 

Anonymous Video Analytics on data from cameras 

embedded in signage (Figure 4). This enables 

Emerson’s solution to identify the gender 

and age bracket of a user to serve up appropriate 

content, plus record dwell time to track results. 

The solution currently employs based on 2nd 

generation Intel® Core processors and is 

Bios: Intel® Hyper Threading enabled, C states were 

disabled for all tests unless otherwise stated 

For more information go to 

http://www.intel.com/performance 

Disclaimer: 

Software and workloads used in performance tests 

may have been optimized for performance only on 

Intel microprocessors. Performance tests, such as 

SYSmark and Mobile Mark, are measured using specific 

computer systems, components, software, operations 

and functions. Any change to any of those 

factors may cause the results to vary. You should 

consult other information and performance tests to 

assist you in fully evaluating your contemplated 

purchases, including the performance of that product 

when combined with other products. 

3 No computer system can provide absolute security 

under all conditions. Intel® Trusted Execution Technology 

(Intel® TXT) requires a computer system 

with Intel® Virtualization Technology, an Intel TXTenabled 

processor, chipset, BIOS, Authenticated 

Code Modules and an Intel TXT-compatible meas- 


gearing up to take advantage of the graphics 

and I/O performance improvements in the 

upcoming 3rd generation Intel Core processors. 

Make the Transformation to 

Intelligent Systems 

Intel and the Alliance are bringing expanded 

experiences, enhanced productivity, and improved 

efficiency to businesses and consumers 

through a new breed of embedded device: the 

Intelligent System. Their work is helping OEMs 

speed a wide variety of new Intelligent Systems 

to market with the performance, connectivity, 

security and manageability required to deliver 

on the full promise billions of embedded devices 

offer to society and the world at large. n 

For information on the latest products and 

services from Alliance members, see: 

intel.com/embedded/solutionsdirectory. For 

more information about the Alliance, visit: 

intel.com/go/embeddedalliance. 

ured launched environment (MLE). Intel TXT also 

requires the system to contain a TPM v1.s. For 

more information, visit http://www.intel.com/technology/security. 

4 Intel® AES-NI requires a computer system with an 

AES-NI enabled processor, as well as non-Intel software 

to execute the instructions in the correct sequence. 

For availability, consult your reseller or 

system manufacturer. 

For more information, see http://software.intel.com - 

/en-us/articles/intel-advanced-encryptionstandardinstructions-aes-ni/. 

5 Requires activation and a system with a corporate 

network connection, an Intel® AMT-enabled chipset, 

network hardware and software. For notebooks, 

Intel® AMT may be unavailable or limited over a 

host OS-based VPN, when connecting wirelessly, on 

battery power, sleeping, hibernating or powered off. 

Results dependent upon hardware, setup & configuration. 

For more information, visit http:// - 

www.intel.com/technology/platform-technology/intelamt.

APU with high performance graphics 

enables real-time operation 

By Dr. Carsten Emde, OSADL and Cameron Swen, AMD 

This article describes 

the advanced enabled by 

the G-series Accelerated 

Processing Unit 

introduced by AMD 

n If you look around these days, you will see a 

plethora of devices displaying sharp graphics 

and vivid video in applications such as e-book 

readers, mobile phones and tablets. This same 

trend has been developing in embedded applications 

as well, in devices such as vending and 

point-of-sale machines and kiosks, signage and 

casino games, and, last not least, in the graphical 

user interface of machines. But solutions haven’t 

been available for power-sensitive applications 

that require real-time operation with an ecosystem 

of supported software and long term avail- 

Figure 1. Within the compact footprint of 19 

mm x 19 mm, the AMD embedded G-Series 

APU integrates a single-core or dual-core 

CPU, a programmable AMD Radeon GPU, 

plus a video decoding unit and a memory 

and PCI Express controller on a single die. 

EMBEDDED WORLD PREVIEW 

ability, many of which could leverage the same 

class of graphics performance. With the introduction 

of the Accelerated Processing Unit, delivering 

unprecedented graphics performance 

per watt through integrated advanced graphics 

and hardware acceleration, AMD is now able 

to offer a solution that delivers an outstanding 

multi-media and Internet experience, with new 

level of visual performance. 

The term real-time is often seen as a somewhat 

incorrect term and is better described as determinism. 

Determinism is related to the response 

time of the system to interrupts, i.e. asynchronous 

external events. The determinism of a 

particular real-time system could, for example, 

be that this system reacts deterministically 

within 200µs. This means that, under the given

� 


Figure 2. Latency ohistogram 

showing the result of 

100 million measurements, longest latency 78 µs, 

AMD G-T56N APU at 1400 MHz. 

operational conditions, the external event will 

invariably cause a reaction at the application 

level within 200 µs – no exception allowed. To 

measure real-time capability, an internal or external 

signal is generated which initiates interrupt 

processing which in turn initiates a process. 

The delay between the injection of the signal 

to the start of the related user-space process is 

measured and represents the total latency. This 

measurement is repeated a great number of 

times and the longest ever measured value is 

taken as the result, which is also referred to as 

worst case latency. y In figure 2, the latency hist 

togram shows the AMD G-T56N APU at 1400 

MHz. The measurements were carried out a 

n 

total of 100 million times. The worst case 

latency was measured as 78µs. To deliver even 

more certainty and to visualize certain measurement 

conditions, several latency histograms 

like this can be put before one another as seen 

in figure 3. In this case, more than 400 measurement 

cycles were carried out over a period 

of 7 months, which adds up to over 40 billion 

single measurements. This results in an extremely 

precise result. The determinism can be 

recognized by the fact that, after an initial optimization 

phase, the latency during the last 20 

billion measurements did never exceed 150µs. d 

Exactly where are the application areas of realtime 

systems with attractive embedded graphics 

�which 

require determinism to be found? Basi- 

cally in any area where devices, machines, 

equipment and vehicles need an attractive, 

high performance GUI but for cost, power or 

space reasons are limited to just one single 

CPU. This requires that control and processing 

tasks maintain their real-time capability in 

spite of high-performance graphic routines 

running in parallel that are used for the human 

machine interface (HMI). The real-time operating 

system with multi-tasking and prioritybased 

scheduler takes care of this but largely 

depends on appropriate hardware that allows 

independent operation of the CPU and the 

GPU. The need for this type of combined 

CPU/GPU solutions is also found in applications 

from industrial controls to medical devices. 

For enabled applications that do not 

have graphics requirements, AMD Accelerated 

Parallel Processing (APP) can be leveraged to 

enable the graphics processor to aid the CPU 

in extremely compute-intensive tasks, for example, 

for object recognition in intelligent 

camera systems. n 

Figure 3. Over 400 consecutive latency measurements 

under different conditions put one before 

another representing a total of 40 billion single 

measurements, longest latency 200µs, after optimization 

150µs (throttling switched off). Same 

processor (AMD G-T56N APU) as in figure 2. 

S

In this article you will find opinions 

from experts about future trends in 

embedded computing, starting with 

small form factor boards and progressing 

up to larger baseboards. 

n For Norbert Hauser, Executive Vice-President 

Marketing at Kontron, increased efficiency is 

the name of the game in the future of embedded 

computing: “2012 will be the year when 

embedded computing technology will see very 

exciting new launches from all major processor 

vendors. Kontron will support these new processors 

on all appropriate form factors and systems. 

The embedded processor launches are not limited 

to a single architecture, but include ARMbased 

SoCs as well as the latest SFF and highperformance 

x86 processors. Across all processor 

architectures, the next generation SFF 

processors will feature multi core technology 

to improve the performance per watt and will 

bring increased graphics performance. And 

the multi core technology is not limited to a 

sole CPU architecture for symmetric or asymmetric 

multi processing, but also includes heterogeneous 

multi core boards which combine 

for example x86 with GPUs to provide highly 

efficient computing and graphics performance. 

Even ultra-low power applications will be 

based on multi core technology. Especially for 

these applications, Kontron has just launched 

a new Computer-on-Modules standard specifically 

developed for low power SOC- and 

ARM-based designs. 



increased efficiency, new technologies 

By Wolfgang Patelay 

Norbert Hauser, 

Executive Vice- 

President 

Marketing, 

Kontron 

“This new standard for ARM- and SoC-based 

Computer-on-Modules is especially beneficial 

for the development of ultra-compact and 

low power applications and is a perfect complementation 

of the x86 portfolio by Kontron 

to fill the gap towards ultra-low power mobile 

devices with attractive graphics technology. 

Kontron now offers designers different processor 

technologies with different advantages on 

dedicated platforms, allowing them to select 

the right one for their form, fit and function 

needs. Furthermore, SOC-based hardware requires 

a different design approach that addresses 

a new I/O mix. 

Kontron is satisfying these development needs 

by leveraging the new low power embedded architecture 

platform and existing standards, such 

as Pico-ITX and mini-ITX, that can serve as 

best-fit building blocks for next-generation smart 

connected devices utilizing ARM technology. 

“But providing modules and boards with latest 

processor technology is only half the task. In 

order to make efficient use of the individual 

technological advantages, OEMs also demand 

directly usable, application-ready platforms to 

minimize development risks and reduce their 

time to market. Therefore they also require 

the underlying software services, so that they 

ideally only need to install the application 

software to get their application running, even 

on heterogeneous platforms. 

The software services that embedded computer 

vendors need to provide, do not only have to 

feature comprehensive board support packages 

for all relevant operating systems, but should 

also come with the further software and middleware 

services required for multi core technology 

and ARM architectures. These services 

include for example virtualization services to 

enable space and energy efficient 2-in-1 solutions, 

a unified cross form factor and cross 

processor architecture middleware to ease the 

software development and also life cycle management 

for x86, PowerPC and ARM-based 

platforms.” 

www.embedded-control-europe.com/newsletter 

www www.embedded-con 

ntrol-europe.com/nnewsletter 

15 February 2012


Christian Eder, 

Marketing 

Manager, 

congatec 

n Christian Eder, Marketing Manager at congatec 

sees acceleration in the adoption of new 

technologies in the embedded market – even 

for ARM architectures. He states: “Industries 

which use embedded products are often viewed 

as conservative. But nowadays new technologies 

are being adopted in these sectors more rapidly 

- a trend that I witness over and over again in 

my role as editor of the COM Express specification 

and design guide. The fast pace of technology 

development by the CPU manufacturers 

and the extreme increase in the performance of 

processors and interfaces leads to a steady increase 

in the complexity of new board developments. 

Of course, this is nothing new for the 


x86 world; it is precisely for this reason that 

COMs (computer-on-modules) have become 

so successful during the last 10 years. What is 

new, however, is that the same trend now applies 

to ARM processors. The latest versions use fast 

DDR3 RAM and PCI Express; to implement 

this on a board requires a considerable amount 

of know-how and experience in high speed design. 

The logical consequence is modularization: 

the complex part of the design is implemented 

on a general-purpose module, which is then 

mounted on an application-specific baseboard 

– that is still the brilliant idea of COMs. 

“The ARM processors are most comparable to 

the lower x86 section, at least as far as interfaces 

and power consumption are concerned. The 

well-established Qseven module concept is therefore 

a suitable solution. Following a spate of 

product announcements for this standard, 2012 

will see practical applications in many sectors. I 

expect to see the publication of an updated 

COM Express specification some time during 

the first two quarters of the year. It will take the 

predicted end of the VGA and LVDS video interfaces 

into account and further strengthen 

DisplayPort. Also, many new projects will be realized 

on the new Type 6. Next to graphics improvements, 

this will herald the end of the two 

traditional interfaces PCI and IDE. As a matter 

of fact, the switch from IDE to SATA has already 

been completed in most applications - SATA 

drives are not only faster and technically better 

as far as EMC is concerned, but they are now 

cheaper as well. The loss of the PCI bus, on the 

other hand, is really painful for some customers. 

But the launch of COM Express Type 6 does 

not mean the end of Type 2. This product line 

is still the most successful COM version and 

will therefore continue to be supported in the 

coming years. However, for serious design 

changes or complete re-designs the new Type 6 

will quickly overtake the six-year-old Type 2. 

“Any profound changes require the development 

of new standards. However, currently this point 

has not been reached yet. While latest interfaces 

nowadays will become faster, they will not require 

new pins. Completely new I/Os are not 

in sight. Although there are always some new 

standards initiatives, in my view, there is currently 

no need for their existence, because they 

do not differ sufficiently from the established 

COM Express and Qseven standards.” 

n Peter Hoser, Sales Director OEM at Fujitsu 

Technology Solutions, defines the trend as high 

reliability at a moderate cost for mainboards 

for semi-industrial PCs. He starts with an example 

and explains: “It is late at night, the cold 

is biting, and to make things worse, rain is 

pouring down. All you want to do is quickly 

get a train ticket and hurry home. No way! 

Once again, the ticket machine is out of order.

Peter Hoser, 

Sales Director 

OEM, Fujitsu 

Technology 

Solutions 

This is a nuisance, but, alas, hardly a surprise 

to insiders. They know that in the field of 

kiosk terminals, digital signage, or closed-circuit 

television (to name but a very few applications), 

desktop PCs or main boards from the retail 

market are often used due to their low cost or 

even a lack of expertise on the part of the solution 

provider. But in many cases these devices 

cannot stand the harsh conditions of outdoor 

operation or even non-stop indoor operation 

for long. This is a major annoyance for both 

the companies operating the systems and end 

users, as they are entitled to expect the permanent 

availability of automated solutions. 

“For this reason, Intel is offering so-named embedded 

building blocks, i.e. assembly kits for 

rugged industrial PCs, in an attempt to help 

mainstream PC manufacturers enter the embedded 

computing market. Using these synchronised 

sets of standard components is supposed 

to enable the manufacturers to produce 

inexpensive industrial PCs for all sorts of applications. 

I wonder if this will work out. The 

high cost of materials caused by the complex 

designs of the embedded building blocks, the 

lack of resources for technical support on the 

part of the manufacturers, long development 

times, often small batch sizes, an increased warranty 

risk, and the additional resources needed 

to build up customer relations within a new 

type of clientele could soon overwhelm the capacities 

of integrators. What is more, sufficiently 

large numbers of specialised manufacturers are 

already selling dedicated PCs into the industrial-use 

market segment. However, there is a continuous 

rise in the number of applications making 

demands that can best be met by a mixture 

between inexpensive desktop PCs and reliable 

industrial PCs with long life cycles, and this situation 

offers a good opportunity for PC manufacturers. 

Some examples of these semi-industrial 

applications are kiosk terminals, digital 

signs, and digital advertising displays. 

“For many customers in this field, the Intel 

kits are probably already too highly specialised 

and hence too costly. In order to meet the demands 

of its various applications, this target 

group requires a simpler concept, either desktop 

PCs based on desktop main boards, with the 

main boards specifically designed for permanent 

operation and an extended life cycle, or cost-efficient, 

mass-produced industrial main boards, 

or preferably fully certified, PC-style assembly 

kits such as the D3003-S or other Fujitsu products. 

Thanks to the familiarity of main board 

technology, the attractive conditions of purchase 

for the hardware and software, and the low production 

cost of the main boards should make it 

easy for PC manufacturers to close the gap between 

desktop and industrial PCs. This will 

come as a relief to the poor train traveller mentioned 

earlier as he will no longer be forced to 

dodge the fare. “In order for the building block 

concept to succeed, the ease of use and cost- 


performance ratio of the kit are crucial, but so 

is choosing the concept that is best suited to 

each particular application. This means that 

specialised manufacturers will definitely remain 

the preferred choice when it comes to designing 

and building sophisticated, customer-specific 

PCs and controls. But semi-industrial PCs or 

standardised IPCs can also be built efficiently 

and in a profitable manner by PC manufacturers 

with mass production facilities, thanks to the 

use of specialised main boards such as those offered 

by Fujitsu Technology Solutions. Can this 

concept succeed? Yes, it can. Or, to put it in 

other words: with the right blocks, embedded 

building no longer shocks!” n 

17 February 2012


Ecosystem around CompactPCI Serial 

promises bright future 


This article proves that team work 

is nearly always successful but 

especially in embedded computing. 

Therefore three German companies 

joint their forces in latest 

CompactPCI technology. 

Since the mid-1990s, CompactPCI has made a 

name for itself as a scalable, cost-effective and 

easily implemented standard that can be adapted 

in many ways. It was developed as a reliable, 

robust and maintenance-friendly technology 

platform. Because CompactPCI is one of the 

most successful modular system standards, it 

is no surprise that the standard has been continually 

adapted to newer specifications as 

technology and application requirements became 

more advanced. CompactPCI PlusIO 

(PICMG 2.30) and CompactPCI Serial 

(PICMG CPCI-S.0) allow new systems to be 

built, using time-proven CompactPCI technology 

that incorporates the performance advantages 

of serial point-to-point communications, 

meeting all the requirements of modern 

modular systems without the increased costs 

of other alternative standards. 

CompactPCI Serial remains backwards compatible 

to CompactPCI PlusIO and CompactPCI, 

so it can interface with older systems, too. In 

order to establish a new technology on the market, 

the potential users need choices - both 

when choosing a suitable supplier and through 

a large product range. EKF, Schroff and MEN 

are three of the current suppliers of CompactPCI 

PlusIO and CompactPCI Serial products, and 

can offer a wide range of flexible and modular 

system solutions based on the new standards. 

n Bernd Kleeberg, Sales and Marketing Manager, 

EKF Elektronik, comments: “With CompactPCI 

Serial and CompactPCI PlusIO we believe in a 

bright future for CompactPCI technology. High 

bandwidth, multiple CPU options and I/O implementation 

together with the proven Eurocard 

form factor open a wide range of today’s and 

future applications. Powerful server systems 

e. g. with integrated RAID solutions as multimedia 

servers etc. can be built up very easily 

and on a standardized platform. This avoids 

proprietary solutions and allows flexibility 

together with economical advantages.” 

n Manfred Schmitz, CTO at MEN Mikro 

Elektronik adds: “CompactPCI PlusIO and 

CompactPCI Serial combine all advantages of 

CompactPCI by using modern serial interconnects. 

Therefore they are the ideal basis to 

build and offer solutions for harsh environments 

and for mission-critical applications. This 

means e.g. the modularity and maintenancefriendliness 

of the 19‶ mechanics together 

with the robust connection, hot-swappability, 


Bernd Kleeberg, 

Sales and 


Manager, EKF 

Elektronik 

Manfred 

Schmitz, CTO at 

MEN Mikro 

Elektronik 

multi-processing capabilities and conductive 

cooling possibilities. MEN COTS and custom 

boards work in an operating temperature from 

to -40 to +85°C, are prepared for coating, with 

all components firmly soldered and using 

on-board FPGAs for additional flexibility.” 

Christian 

Ganninger, 

Category 

Manager 

Systems EMEA, 

Schroff/Pentair 

Technical 

Products EMEA 

n Christian Ganninger, Category Manager 

Systems EMEA at Schroff GmbH/Pentair Technical 

Products EMEA concludes: “CompactPCI 

Serial combined with CompactPCI PlusIO, as 

a migration path, simplifies the change to this 

bus technology with fast serial data transfer 

for users of other 19’’-based standards. Through 

a hybrid backplane it is even possible to use 

standard CompactPCI cards and faster CompactPCI 

Serial cards in one system. You can 

continue using the systems which are defined 

for CompactPCI, only the backplane needs to 

be changed. The high demands regarding 

cooling and power supply which exist both for 

CompactPCI and for CompactPCI Serial are 

already considered in our CompactPCI systems.” 

At Embedded World 2012, EKF, Schroff and 

MEN will show their growing product ranges 

of different Intel and PowerPC boards, peripheral 

cards and enclosures for building 

complete system solutions based on this futureoriented 

technology. 

www.embedded-control-europe.com 

The Online Information Source for Europe`s Embedded Engineers

RS COMPONENTS SPECIAL 

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21 February 2012

Quo vadis Microcontrollers? 


In this article managers 

of various MCU suppliers 

express their opinions 

about future trends for 

MCUs in different embedded 

market segments. 

Jim Stuart, 

Product 


Manager 

Industrial and 

Multi Market 

Microcontrollers, 

EMEA, Freescale 

n Jim Stuart, Product Marketing Manager Industrial 

and Multi Market Microcontrollers, 

EMEA, Freescale, defines the trends particularly 

for the industrial market. “For industrial and 

consumer markets, Freescale is aggressively 

driving ARM architectures to push the boundaries 

of the performance, price, low power 

and integration. The company is breaking 

through barriers of performance at the top 

end of the MPU spectrum and blurring the 

boundaries of ARM MCUs and ARM MPUs 

with a new breed of eMPUs featuring multicore 

architectures. At the low end of the spectrum 

the ARM Cortex -M class of products has 

started to fill the space traditionally held by 

8-bit in the entry level space - shrinking geometries 

and lower costs make this an inevitability. 

Given the dominance of the flash area and 

analog circuitry on small MCUs, and the relatively 

shrinking size of the digital logic, the reality 

of the sub 50 cent 32-bit microcontroller 

is now with us. The extreme ease of use for 

the new breeds of 32-bit MCUs removes any 

fear of using 32-bit devices rather than 8-bit 

ones. Across the range of the 32-bit MCU, 

Freescale continues to drive feature and memory 

integration, with the goal of overall BOM 

cost reduction. The Kinetis X microcontroller 

series is an example at the top end of MCU 

families, announced in November, the X series 

will feature up to 512 Kbytes RAM, 4 Mbytes 

1 

flash , Dual Ethernet and graphics LCD driver 

functionality. Freescale has also announced a 

bridge concept between the MCU worlds and 

MPU world with an architecture featuring 

both a Linux-capable Cortex-A5 application 

core with a secondary Cortex-M4 real-time 

core. Architectures such as this can significantly 

reduce BOM costs by integrating two parts of 

a system that would traditionally be separate.” 

n Marc Osajda, Automotive Market Development 

Manager, Freescale, believes in the following 

MCU trends for the automotive market. 

“Automotive electronics is driven by four industry 

megatrends. Energy efficiency and emission 

reductions, the reduction of worldwide 

traffic-related deaths, the increased intercon- 


Marc Osajda, 

Automotive 

Market 

Development 

Manager, 

Freescale 

nection of the automotive electronics in itself, 

as well as the car with the environment, and 

the shift of demand for cars from developed 

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23 February 2012


countries to emerging ones. For suppliers of 

microcontrollers this means that they must 

offer increasingly strong processing performance 

and introduce multicore technologies, such as 

the Freescale Qorivva family, which offers single 

to multicore scalability across all application 

areas in Powertrain, Chassis & Safety as well as 

Body & Security.” Osjada highlights: “It is our 

opinion that the automotive electronic industry 

is at the beginning of a phase that is going to 

generate highly complex networked systems. 

Functional safety as it is standardized in 

ISO26262 makes additional challenges to systems 

and development processes. We are not 

only seeing increased connectivity within the 

automobile, we are also seeing networking with 

other vehicles as well as the environment. Today, 

Freescale stands behind systems like Ford Sync 

and GM ONstar, and besides promoting the 

i.MX product roadmap of single to quad-core 

processors, advocates cooperation within Genivi 

in order to manage these complexities. 

“Software standardization, e.g. through Autosar, 

is also going to drive increasingly complex 

and costly developments. The company has 

made significant investments, and one of the 

major milestones of 2011 was the first key customer 

certifying Freescale to meet the expec- 

tations of a development process according to 

Spice Level 3. New requirements for the software 

development process, which are a result 

of ISO26262, are also implemented as a component 

of the SafeAssure program.” 

Osjada concludes: “Freescale has been a market 

leader in the area of semiconductors for automotive 

applications for more than 30 years. 

With its broad portfolio of microcontrollers, 

processors, analog components, sensors, and 

professional software it delivered more than 

750 million integrated circuits to automotive 

customers globally in 2010. The uppermost priority 

of Freescale is the continuous development 

of technical innovations of the highest quality.” 

n Dr. Stephan Zizala, Senior Director, Microcontrollers, 

Industrial and Multimarket, Infineon 

Technologies, states: “New microcontrollers 

for industrial applications like electric 

drives, renewable energy systems or automation 

systems, must provide answers to three major 

trends: how to improve energy efficiency, how 

to improve connectivity and how to reduce 

software complexity. Energy saving is without 

doubt the quickest, most effective and most 

cost-efficient way of reducing greenhouse gas 

emissions, as well as improving air quality, 

Dr. Stephan 

Zizala, Senior 

Director, 

Microcontrollers, 

Industrial and 

Multimarket, 

Infineon 

Technologies 

particularly in densely populated areas (ABB 

‘Sustainability guide No. 1’, 2009). The same 

publication reports that 40% of the world,s 

energy is consumed by industry. Furthermore, 

The European Motor Challenge Program indicates 

that electric motors account for 70% 

of industrial electricity consumption and energy 

costs make up 98% of the total cost of 

ownership of an electric motor. Clearly improving 

the efficiency of electric motor control 

appears very worthwhile for both economic 

and environmental reasons.” For obvious reasons 

another big contributor to reducing greenhouse 

gas emissions is renewable energy. One 

of the key criteria to make this happen is a


high yield in converting renewable energy into 

electrical energy. Since the chain from the 

solar cell, through the inverter, transmission 

line, storage and another transmission line to 

the consumer can be very long, losses add up. 

An efficiency improvement of a solar inverter 

from 96% to 97% does not seem significant. 

However, this small efficiency improvement 

results in a reduction of losses by 25% - which 

indeed is significant. 

“There are several ways microcontrollers can 

contribute to efficient conversion. Higher computing 

performance allows faster control loops 

and more advanced algorithms, while optimized 

peripherals enable faster and more accurate 

measurement of analog signals and a faster 

and more adapted PWM generation. It is also 

important to make control more affordable. 

Microcontroller component cost is just one aspect. 

More important is reducing the development 

cost for such systems. A very good way to 

achieve this is enabling platform solutions, e.g. 

enabling an electric drive vendor to use the 

same control architecture for a very wide range 

of power classes or product families which 

differ in the safety level they have to offer. The 

requirement for the microcontroller in this 

case is scalability: different frequency, more or 

less PWM channels, more or less ADCs, etc. 

“Another characteristic that will become more 

important in the future is the flexibility of the 

microcontroller to combine different peripherals 

with each other to achieve a tailor-made solution 

based on a standard platform. The new 

XMC4000 microcontroller family is unique in 

the way it enables flexibility to combine different 

hardware peripherals. A central connection matrix 

allows connection of internal and external 

input and output trigger signals of different 

hardware modules by software. Thus hardware 

functionality is defined by software in a very 

flexible way. This allows tailor-made hardware 

based on a standard microcontroller platform. 

“Higher connectivity is the next logical step 

in industrial systems to achieve improved system 

interoperation, easier system integration, 

management and maintenance. There are two 

aspects to this: connectivity within the realtime 

critical domain and connectivity to the 

outside world. Within the real-time critical 

domain CAN, simple standards like UART, 

SPI, IO-Link or proprietary protocols are 

widespread, cost-efficient and reliable. For 

connectivity to the outside world there are 

two main use cases. For a manual update or 

download, high-speed interfaces like USB or 

SD/MMC are required. For remote process 


management, monitoring or maintenance, 

Ethernet is seen as the main trend. 

“The XMC4000 family fulfils these connectivity 

requirements. Besides SD/MMC, it offers USB 

as host and device. The integrated Ethernet 

contains the IEEE 1588 time-stamping functionality 

which also allows a real-time Ethernet 

software implementation. Connectivity within 

the embedded system can be established with 

up to 3 MultiCAN nodes and up to 6 universal 

serial interface channels. The universal serial 

interface channels can be freely defined by 

software to implement one of the following 

standards: UART, SPI, Quad-SPI, IIC and IIS. 

For highest speed connectivity, XMC4000 

offers a high-speed parallel external bus interface 

supporting a wide range of synchronous 

and asynchronous protocols like SDRAM, 

SRAM, Burst-flash, NAND-flash, NOR-flash 

or plain memory-mapped-IOs. 

“The third major trend affecting microcontroller 

choice is the reduction of software complexity. 

Several industry studies confirm that software 

complexity is one of the major problems for 

embedded system development. This is true especially 

for small and medium-sized companies 

with comparatively small development teams 

of some ten engineers. Key challenges include 

communications stacks, operating system integration 

and re-use of optimized algorithms. To 

cope with those challenges, Infineon offers 

DAVE 3, a free Eclipse-based integrated development 

environment (IDE). The DAVE 3 development 

environment includes a free tool 

chain and an extendable auto code generator to 

facilitate graphical component-based programming. 

In contrast to programming with libraries 

and code examples, it allows higher software 

abstraction, easier integration and maintenance. 

It is an open platform allowing easy extensions 

and adaptations by users and third parties. 

“Finally, I would like to reconfirm a key statement 

of my article in the November 2010 

issue of ECE: more and more powerful peripherals 

for analog to digital conversion, communication, 

connectivity etc. will be integrated 

into microcontrollers. But the key topic in the 

future will be to make the microcontroller 

hardware more flexible and configurable. This 

will enable platform solutions, which cover a 

much wider application range than currently, 

supported by most microcontroller vendors. 

On the other hand this will make microcontrollers 

much more complex. And this is why 

GUI-based configuration tools, auto-code generators 

and reference designs will become even 

more important than they are today.” 

www.embedded-control-europe.com 

The Online Information Source for Europe`s Embedded Engineers 

•


Steve Gaines, 

European 

Industrial MCU 


Manager, 

Industrial 

Business Group, 

Renesas 

Electronics 

Europe 

n Steve Gaines, European Industrial MCU 

Marketing Manager, Industrial Business Group, 

Renesas Electronics Europe looks at the reasons 

behind the development of future microcontrollers 

and says: “To identify the future trends 

in microcontrollers for the industrial market, 

a relevant point to consider is the current underlying 

worldwide megatrends, as these will 

drive the next generation of applications that 

utilize microcontrollers. The first of these is 

the well-documented and increasing scarcity 

of natural resources, which is creating a growing 

demand for environmental protection. In parallel, 

the second trend is that the world has an 

increasing population that is becoming more 

mobile as well as older, driving the demand 

for improved mobility concepts along with 

more healthcare and safety innovations. On 

top of the usual market requirements for applications 

to deliver better performance in a 

smaller space, the green requirement is now 

increasingly important. Companies are striving 

to develop new energy-saving concepts or improve 

existing applications to make them much 

more energy efficient. What does this mean in 

terms of the actual evolution of the microcontrollers 

themselves? 

“Firstly, as mentioned, the traditional requirements 

for more performance and integration in a smaller 

space will continue, largely due to the need for 

applications to be connected and to consume less 

power. At Renesas, we continue to address this 

demand by moving our established microcontroller 

families onto the next generation of processor 

technologies. For example, the next devices in 

the Renesas 100MHx RX 32-bit microcontroller 

family on 90nm technology, the RX63X, will 

move into mass production this year. 

The indication is that this level of performance 

and available peripheral and memory integration 

(2Mbyte flash with 128K RAM) will far 

exceed the requirements of the majority of 

embedded industrial applications utilizing microcontrollers. 

However, the Renesas design 

teams are already developing the next generation 

of RX products to utilize 45nm process 

technology, which will allow us to provide 

higher density memory, especially SRAM, and 

increased performance if required. “But un- 


doubtedly green is the biggest trend nowadays. 

This has several implications for microcontrollers. 

The most obvious is that future MCUs 

will continue to evolve to consume less power. 

This is an area where more can and will be 

done. For example, the first Renesas product 

family to be developed since the merger of 

NEC and Renesas Technology, the new RL78 

family, is aimed at energy-saving applications 

in the 8-16 bit controller market. As well as 

operating at lower voltages while still delivering 

up to 41 DMIPS, they are designed to use very 

little power in every mode of operation. In addition, 

they also support an innovative, energy-saving 

snooze mode that enables the designer 

to save further power by allowing peripheral 

functions, such as the serial channel 

and ADC, to run without activating the CPU. 

A less obvious green trend is that new evolutions 

in microcontroller technology will themselves 

make it possible to develop new green technologies. 

For example, new microcontrollers will 

support more efficient motor control algorithms 

by delivering higher performance. They will 

also be used as co-processors in consumer applications 

to control the power usage of televisions 

and kitchen appliances and underpin the 

next generation of smart meters by integrating 

support for features like power line communication 

technology. In short, green is here to stay. 

“Another recognized trend in microcontrollers 

is the standardization of peripherals and tools. 

What started as the odd request from the 

larger multi-site companies for Eclipse development 

platforms a couple of years ago has 

increased globally to such an extent that Renesas 

has accelerated the development of its own 

Eclipse development platforms. As a result, we 

will be introducing Eclipse solutions for the 

popular RX, SH, V80 and the new RL78 families 

in the first half of this year. 

“And the final trend is that of price. Over the 

last five years, we’ve seen a continuing drop in 

the average selling price for microcontrollers. 

In 2005, customers were buying microcontrollers 

in high volumes at a price that is 100% higher 

than the current low-volume price for an MCU. 

This is largely driven by suppliers competing 

by utilizing next-generation technology to 

achieve price and integration improvements. 

This shows that there is another large advantage 

in being a big player like Renesas. Only large 

suppliers have the budgets and the capacity to 

invest in new processes and technologies. 

Whether the market price really continues to 

fall will be more a question of whether the 

competition can keep up with Renesas in the 

future. Our conclusion is that microcontrollers 

will continue to get faster, cheaper and greener, 

driving an increase in the number of innovative 

applications that use them.” n



and test tools 


In this article two experts in the 

embedded tools industry express their 

opinions about the innovations and 

trends they see in this domain. 

Errol Simsek, 

Vice President 

Sales & 

Marketing, 

iSystems 

n Errol Simsek, Vice President Sales & Marketing, 

iSystem AG recognizes the following variety 

of future trends. “One day a traditional debug 

tool will just upload data … Well, this could be 

the dark side for an embedded systems tool 

manufacturer such as iSYSTEM. However, there 

is also a more realistic view telling us that 

future functionality of a development and test 

tool will be more software than hardware. Ok, 

this is nothing magic and it is a general trend 

for years now. Implicitly it tells us that even if a 

tool will just upload data, it has to upload and 

display a mass of data at high speed. Not only 

a challenge for tool but also for PC manufacturers. 

USB 3.0 may be an answer here. In addition 

to that, debugging tools have to support 

the new high-speed serial interfaces implemented 

on actual and future micro controllers 

(e.g., AURORA). What will be challenging will 

be the way the data is collected and pre-analysed 

as well as displayed in real time on the PC. 

“To build a professional debug tool today, it is 

not enough to know all about the details of a 

microcontroller. The core know-how of a tool 

vendor has to be extended towards process 

know-how within their customer base. Why? 

Because tools nowadays have to be seamlessly 

integrated in such processes and have to support 

automating big portions of the process 

steps. They also have to fit in the context of 

market specific standards, e.g., safety standards 

and have to come up with answers to model- 

based development and testing, requirements 

traceability, as well as connectivity to simulator 

software and hardware and other layers of the 

V diagram. These requirements do have an 

impact on the actual and future functionality 

set of debug tools already today. “Connectivity 

(open and public APIs): tool vendors like iSYS- 

TEM have to provide generic interfaces to integrate 

these tools in their customer development 

and test processes so that this functionality 

can be used in full. The interfaces have to 

support a wide range of tasks (development, 

test, verification and validation of software 

and hardware). The trend is towards supporting 

many different programming languages (C, 

C++, C#, JAVA, ...) and script languages 

(Python, Perl, Tcl,...) to remotely control the 

development tool from within another application 

(also customer-specific). In principle, 

specific process sequences can thus be automated 

both during development and test. 

“Software testing capabilities – real time unit 

test: testing is a requirement in several (safety) 

standards, e.g. ISO 26262, DO-178B, IEC 62304. 

Standards and standardization have a tremendous 

influence on the development cycle and 

especially on the amount of testing. Instead of 

purchasing an additional tool and in order to 

test as early and close as possible to the hardware, 

actual debuggers should offer an integrated 

testing functionality. This is what iSYSTEM 

implemented as real time unit testing. It does 

not require code instrumentation or any test 

driver. This enhancement to iSYSTEM debug 

and analyzer tools allows to generate and 

execute test cases from inside the development 

environment. No test driver is necessary. Without 

compiling/linking/downloading a test case 

again and again, the test is executed on the real 

hardware. Additionally features of our debug 

and trace tools e.g. tracing, profiling, code coverage 

can be integrated in the test processes. 

“Multi core processor support: multi core 

processors have found their way into a wide 

range of applications. Here as well, suitable 

development tools will offer solutions to support 

the development and test of dedicated 

multi core applications. There are still a lot of 

open questions for all parties including semi- 


conductor vendors, end customers, tool vendors, 

universities etc. On a long run real multi 

core based application development and testing 

will change not only tools but also the development 

and test process within a company. 

“Mini HIL” functionality and power measurement: 

future development tools will also provide 

so-named “mini HIL” functionality (hardware-in-the-loop, 

measurement and stimulus 

modules for testing and power measurement), 

to generate and record digital and analog 

signals and integrate them in testing at a very 

early stage. This makes it possible to develop 

software very close to reality and to test as 

early as necessary. It is important that this can 

be done from within the usual environment, 

and virtually on-the-fly.” 

Stefan Skarin, 

CEO of IAR 

Systems 

n For Stefan Skarin, CEO of IAR Systems, standardization 

is the major future trend in development 

of embedded systems. He states: “Standardization 

on one single embedded software 

development tool suite - this is the predominant 

trend for the tools market for the upcoming 

years. I believe from what we have learned 

that this is a sustainable trend, which is true 

for developers of any architecture from 8- to 

32- bit. The driving forces behind the standardization 

trend are of technological as well 

as of business nature. Actual devices demand 

a gradually growing number of embedded systems 

to fulfil customer needs. At the same 

time, embedded applications are becoming 

more and more complex and sophisticated. 

Some new end-product features have become 

compulsory, like low power consumption or 

increased user-friendliness. Furthermore,

OEMs are facing ever-fiercer competition. Getting 

a truly innovative product launched in a 

highly competitive market in the shortest possible 

time span is crucial, and of course a competitive 

price also strongly influences a product’s 

success. “To master the challenges from 

the market and to actually gain a safe return 

on investment, companies are reviewing and 

adjusting their internal processes. Their needs 

differ in many aspects, but we have learned 

from existing and new customers that they 

share some fundamental needs. They require 

a simplified, seamless development workflow, 

and reliable support at hand when and where 

they need it. They also seek to gain more flexibility 

in their development process, being able 

to use the same set of high-class tools for a 

wide array of architectures. At the same time, 

they have to cut down their overall costs, to 

safeguard their production processes, to streamline 

their product map, and to be well-prepared 

to fulfil certification standards. 

“We experience that companies have started reviewing 

and evaluating their processes. They 

are in need of tools that meet their strict requirements, 

and that are reliably delivered by a 

resourceful partner which can ensure a constant 

flow of high-class feature releases and service 

updates. Being an experienced and independent 

supplier of user-friendly embedded development 

tools with an extensive offer in training 

and support, we have been approached by 

many of these companies to accompany their 

decision processes. As far as I can tell, they 

have been the first of many companies acknowledging 

that standardization - as in many 

other industries before - paves the way for 

truly innovative products which can be marketed 

quickly and add to a company’s success.” 

Bill Graham, 

Product 


Manager, 

VxWorks, 

Wind River 

n Bill Graham, Product Marketing Manager 

for VxWorks at Wind River, defines the future 

trends for real-time operating systems as follows: 

“Real-time operating systems (RTOS) 

are having to become increasingly sophisticated 

–they must satisfy performance demands, offer 

hard real-time response and handle memory 

constraints, but increasingly they also need to 

deliver capabilities offered by a general-purpose 

OS, such as support for graphics, multimedia, 

networking and security, in addition to multi core 

processor handling capabilities. Perhaps the biggest 

emerging issue is security and new embedded systems 

must be designed with this in mind. While embedded 

systems have traditionally been isolated, devices are 

increasingly being connected to corporate networks 

or to the internet directly for consumer, M2M, cloud 

computing and medical applications, resulting in a 

substantially larger exposure to threats. Many existing 

embedded systems are ill-equipped to deal with 

these risks, so developers will be looking to retroactively 

improve security. However, many run on older 

hardware with limited OS/RTOS services and many 

devices were not designed for easy upgrading, or 

were built when security was not a priority, potentially 

making security updates very costly. 

“M2M control networks are becoming increasingly 

important, and although it is still early days, we have 

seen the explosion of cloud computing services for 

consumer devices, offering manufacturers a way to 

provide further value to their customers. Increased 

connectivity in M2M and cloud services has significant 

implications on security, so a key issue in RTOS this 

year will be the development of appropriate levels of 

network stack capability, networking security, data 

and communication encryption, and support for 

VPNs and both IPv4 and IPv6. The move to IPv6 in 

particular will mean updates for many existing systems, 

with a requirement for current and future RTOS to be 

IPv6 compliant. 

“Safety and security is increasingly being viewed as 

paramount and regulators are looking to stringent 

standards to ensure products meet requirements. Security 

certification is well established and will continue 

to be a priority in aerospace, defence, transportation 

and industrial control, but much less so in homebased 

systems such as smart grid devices, for example. 

However, standards specific to medical and other industrial 

systems are emerging, and manufacturers 

will increasingly look to standards to ensure RTOS 

vendors have the appropriate security level. Due to 

the requirement for hard real-time response or resource 

constraints in CPU and memory, RTOS will also continue 

to be a major part of many media-centric 

devices in consumer markets, but also others such as 

software-defined radio in aerospace and defence, in 

home healthcare products and in industrial systems. 

“Finally, while the adoption of multi core processing 

in embedded has been slower than in some other 

markets, it is becoming progressively more sophisticated. 

Embedded virtualization is emerging as a key 

ingredient that brings both flexibility and manageability: 

it enables multiple OSes and symmetric and 

asymmetric multi-processing (SMP and AMP) configurations, 

providing many possible solutions including 

an SMP OS running on all cores. While performance 

is seen as the key advantage, the consolidation 

of multiple systems onto one target board is 

highly attractive for manufacturers, leading to the 

reduction of cost and simplification of supply chains 

and maintenance.” n 


31 February 2012

EXHIBITORS LIST 

Exhibitors List – embedded world 2012 

Company Hall-Stand Company Hall-Stand 

3 D PLUS 1-129 

3S 4-608 

4D Systems 1-270 

7Layers 4-444a 

A.N. Solutions 4A-308f 

AAEON 1-224, 1-306 

ABS Jena 4-131 

AbsInt 4-327 

Acal Bfi 4-448 

Accutronics 2-502 

acontis 5-427b 

ACTRON 1-360 

AdaCore 4-544b 

ADDI-DATA 4-341 

Adeneo Embedded 5-340 

ADKOM Elektronik 1-264 

ADL Embedded Solutions 1-210 

ADLINK Technology 1-532 

admatec 1-268 

ads-tec 5-340 

AMD 4A-523 

Advantech 2-420, 2-110, 5-340 

af inventions 4A-124 

AFRA 4-324 

AFT Atlas Fahrzeugtechnik 4-119 

Agilent Technologies 4-208 

aicas 5-429 

Akasa 5-138 

All4Tec 4-544d 

Allegro 4A-122 

Alpha Display 1-167 

altec 4A-424 

Altera 4-334 

Altium 5-333 

Altran Technologies 5-430b 

AMBER wireless 4A-502 

Ambo Software 4A-414 

American Megatrends 1-638 

Amic Technology 1-450 

Ampire 1-424, 4A-507 

Analog Devices 4-234 

ANDUS 1-118 

Anovo 4A-515 

ANSEN QUARTZ 4-444h 

Antennentechnik 5-135 

APAC OPTO 4-240 

Apacer 1-112, 4-240 

APdate! 4-634 

APLEX 2-519 

APM / IEC 4-446 

Applied Green Light 1-506 

Applied Micro 4A-122 

apra-norm 2-323 

APRO Co. 1-127 

ARBOR Technology Corp. 2-409 

ARM 4-336 

AROBS 4A-414 

Arrow 5-405, 5-340 , 4A-206 

Art of Technology 2-328 

ASIX Electronics 1-424 


ASSYSTEM 5-326 

Astrodyne 4-240 

Atlantik Elektronik 2-206 

Atmel 1-450 

Atollic 4-108 

Atos 5-330 

ATP Electronics 1-306 

Austriamicrosystems 1-450 

Avnet Abacus 1-249 

Avnet Memec 4A-122 

AXIOMTEK 1-250 

Axotec 4-248 

AyDeeKay 4A-107 

b-plus 1-430 

Barix 2-420 

basyskom 5-323 

Bayer, A.R. DSP Systeme 4A-103 

bbv Software Services 5-415 

BeanAir 4-544c 

Beck 4-624 

Beck IPC 1-212 

Becker & Müller 1-301 

Beckhoff 5-340 

Befact Technologies 2-216 

Berner & Mattner 5-326 

Bicker Elektronik 2-117 

BIOTRONIK 4-611a 

Bitgear 4A-509 

BITKOM 5-308 

bitshift dynamics 5-340 

BitWise Group 5-340 

Bivar 4-240 

Biwin Technology 5-243 

Bluegiga 4-548 

Bolymin, 1-161 

Bopla 2-211 

Brandt-Data 4-519 

BRESSNER 1-374 

BRUSCH 4A-414 

bsquare 5-340 

Byte Paradigm 4-109 

Cactus 1-102 

CAD-UL 4-201 

CALAO 4-546b 

CalPlus 4-205 

Captec 5-340 

CETECOM 4-402 

Channel Microelectronic 1-219 

Cheng Fwa Industrial 1-260 

Chenmtech 1-372 

Christ-Elektronik 1-242 

Cinterion 4-443 

Cirrus Logic 4A-122 

Cluster Mikrosystemtechnik 1-430 

CMX Systems 4-204 

CN Resources 5-410 

Code Time 5-215 

CODICO 1-424 

Coilcraft 4A-122 

comemso 4A-308a

Company Hall-Stand 

coming 4-324 

COMMELL 1-609 

COMP-MALL 1-238 

CompoTRON 4-445 

CompuLab 2-405 

Comron 4-444g 

ComTrade 5-332 

Concept International 5-340 

Concurrent Technologies 1-124 

Conexant System 1-424 

congatec 1-350 

Connect Tech 2-310 

connectBlue 1-212 

ConnectOne 5-235 

Connfly Electronic 1-644 

CONTEC 4-541 

CONTRADATA 2-426 

Contrinex 1-131 

Corelis 4A-103 

CoreSolid Storage 2-401 

Cortus 5-143 

COSEL 1-424 

COSMIC SOFTWARE 4-304 

CoSynth 4A-308b 

Coverity 4-117 

CPi Digital 1-121 

Crank Software 4-127 

CS Romania 4A-414 

Cybercom Sweden 5-214 

Cymbet 1-223 

Cynapsys 4-106 

Cypress Semiconductor 4A-106 

D-Logic 4A-509 

Dacom West 1-660 

Dassault Systemes 4-305 

Data Modul 1-356 

Data Respons 1-218 

Datalight 4-108 

datasphere wireless 5-239c 

DataTech 2-503 

Daub CNC Technik 5-237 

DAVE 4-539 

Decode 4A-509 

Delkin Devices 1-116 

DELTA 4A-113 

DELTA COMPONENTS 1-418 

DELTATEC 4-109 

demmel products 1-256 

Densitron 4-240 

DENX 1-552 

Desarrollo 5-341 

Deutsches Patent- und Markenamt 1-406 

Deutschmann Automation 1-446 

DH electronics 2-108 

Diamond Flower Information 1-150 

Diamond Systems 1-307 

Digi International 1-432, 2-206 

Digilent 1-107 

Display Devices Elektronik 1-368 

Display Elektronik 1-463 

distronik 2-326 

DMB Technics 1-153 



DMP ELECTRONICS 1-123 

Dolphin Interconnect 4-611b 

Dream Chip Technologies 4A-308m 

dresden elektronik 4-528 

Dridger & Schwenke 4A-308l 

PNO 4A-405 

DSM Computer 1-254 

DSP Valley 4-109 

DSP-Weuffen 4A-308j 

dSPACE 4-316 

DSPECIALISTS 1-217 

E Ink 4-240 

E.E.P.D. 2-421 

Easics 4-109 

EASYCODE 4-322 

Eberspächer 4-526 

EBV Elektronik 4-535 

Echelon 4A-122 

eConais 5-136b 

eCosCentric 5-347 

ECR 4-541 

ED-V 4A-125 

Edacpower 4-240 

EDALab 5-427 

EDT Emerging Display Technology 1-306 

egnite 4A-410 

Eikon 1-270 

Eink Holdings 2-206 

EKF Elektronik 4-337 

EKH - EyeKnowHow 1-509 

Elatec 4-444c 

Elbacom 5-340 

Electric Cloud 4-610 

ELECTRONIC ASSEMBLY 1-375 

Electronic Gerätebau Ast 1-430 

Electronic Specifier 4-612 

Elekonta Marek 4-139 

Elektrobit Automotive 4-206 

Elektronik i Norden 4A-525 

Elektronik-Kontor 4-205 

Elektronix 2-426 

ELMA Electronic 4A-304 

ELMOS 4-240 

Elproma Elektronika 4-647 

ELTAN 1-232 

ELTEC Elektronik 2-427 

embedded brains 5-311 

Embedded Office 5-227 

EMBEDDED SIGMA 5-340 

Embedded Technologies 4A-410 

Embedded Tools 4-127 

embedded wireless 4-444b 

embedded-logic 2-305 

Embedded4You e.V. 4-324, 4-328 

embenatics 4A-308c 

embeX 1-419 

embit 4-431 

embitel 2-430 

EMC 1-234 

Emenda 4-504 

EMERSON/Astec 1-424 

Emerson Network Power 1-624, 5-405 

33 February 2012



EMKO Case 4A-402 

emlix 5-229 

EMS 1-632 

emsys 4-301 

emtrion 1-133 

EMTrust 2-421 

Emweb 4-109 

Enclustra 4A-104 

enders Ingenieure 1-430 

ENEA Services 4A-414 

Enea Software 5-218 

Energy Micro 1-523, 1-424, 4A-122 

Enpirion 4-429 

EOS Power 4-240 

EPSON 1-450 

ept 4-349 

Eremex 5-424 

Ericsson Power Modules 4-240 

ERNI Electronics 4-244 

esd electronic system design 4-129 

Essensium-Mind 4-109 

Esterel Technologies 4-114 

ETAS 4-524 

EtherCAT Technology Group 4A-303 

Ethernet Powerlink 4A-524 

euro engineering 4-512 

Eurocircuits 4A-412 

European Business Press 5-216 

EuropTec 1-367 

EUROS Embedded Systems 5-318 

Eurostandard Press 2000 5-130 

Eurotech 5-141 

Everspin Technologies 1-428 

eVision Systems 5-142 

EVOC 2-521 

Exar 4-240, 4A-108 

EXPLORE SEMICONN UG 1-450 

Express Logic 5-320 

Extension Media 5-427a 

F & S Elektronik Systeme 4-136 

F+S Fleckner und Simon 4-518 

F1 2-317 

Farnell 5-236 

Fastwel Group 1-517 

Felicitas 4-137 

FERCHAU 4-412 

Fircom 1-465 

Firecomms 4-240 

Fischer Elektronik 4A-408 

Flaircomm 4-444f 

Flat Display 1-222 

Flexera Software 5-444 

FlowCAD 5-404 

TU Dresden 5-335 

FORTEC Elektronik 2-222 

FORTech Software 5-416 

ForTISS 4-324 

FRANZIS Verlag 5-422 

Fraunhofer Gesellschaft 5-228 

Fraunhofer AISEC 5-228 

Fraunhofer ESK 5-228 

Fraunhofer FIRST 5-228 



Fraunhofer HHI 5-228 

Fraunhofer IESE 5-228 

Fraunhofer IIS 4-128 

Fraunhofer IPT 5-228 

Fraunhofer Embedded Systems 5-228 

Freescale 1-434, 4A-309 

frenzel + berg 1-130 

Fröhlich + Walter 5-136a 

froglogic 4-501 

Frontline Test Equipment 4-519 

FSP TECHNOLOGY 2-210 

FTDI 4A-322 

FTI 4-324 

Fujitsu Semiconductor 1-306, 1-450, 4-228 

Fujitsu Technology Solutions 4-228 

FUTURE 4A-108 

G-ALANTIC 1-405 

GainSpan 2-216 

GAIO TECHNOLOGY 4-426 

Garz & Fricke 1-631 

GCD Hard- & Software 1-416 

GCD Printlayout 1-416 

GE Power Electronics 4-240 

GeeseWare 4-628 

Get‘IT 4-106 

Giada SHENZHEN 1-235 

Ginzinger electronic 1-225 

Gleichmann 2-219 

Gliwa 4-327 

GLYN 1-306 

GÖPEL electronic 4-302 

GrammaTech 4-613 

Green Hills Software 4-325 

GreenBase 1-154 

Greenliant Systems 4-347 

Halo Electronics 2-216 

HAMEG Instruments 4-112 

Handheld Group 4-630 

HanRun Electronics 4-240 

Carl Hanser Verlag 5-247 

Hantronix 1-450 

Hartmann 4A-324 

Hays 4-404 

HCC-Embedded 5-226 

HCP 4A-509 

HEB Electronic 1-455 

Heise 5-428a 

HEITEC 1-408 

Helion 5-142 

Helios Bilisim Reklam 5-340 

Henrich Publikationen 5-247 

Hewlett-Packard 4-126, 5-405 

HEYFRA 1-636 

HighTec EDV-Systeme 4-312 

HILF! 5-342 

hilscher 2-414 

Hirschmann 4A-111 

Hitachi CTA 5-408a 

Hitachi Europe 1-306 

Hitex 4-204 

Hittite Microwave 4-240 

HMS 4A-405


Hochschule Augsburg 5-335 

Hochschule Harz 5-335 

Hochschule Pforzheim 4-345 

HPI DISTRIBUTION 4A-203 

HSM Zamecki 1-568 

HTWK 5-335 

HUBER 2-302 

Hüthig 4A-503 

HW Group 4A-410 

HY-LINE 1-160 

Hyperstone 1-516 

IAR Systems 4-212 

IBASE Technology 2-410 

IBIS Solutions 4-615 

IBM Deutschland 4-321 

IBV 4-107 

IC Plus 2-216 

ic-design 1-430 

ICC Media 5-219 

ICOP Technology 1-530 

ICP 2-422 

ICS 4-507 

ICSense 4-109 

IDT 4A-302 

IEI Technology Corp. 2-422 , 2-426 

ies 1-652 

ILFA 4-640 

IMACS 4-324 

IMMS 5-341 

IMPT 4A-509 

IMST 4A-225 

INCHRON 4-308 

INCOstartec 2-121 

Industrial Computer Source 1-246 

Ineltek 1-450 

Infineon Technologies 4-142 

Ing. Buero Gardiner 5-142 

Ingenieurbüro Dübon 4A-308i 

InnoDisk Corporation 1-119 

InnoRoute 4A-308k 

Inova Semiconductors 1-450, 4-641 

inpotron Schaltnetzteile 2-223 

Inspired Energy 2-319 

Insyde Software 4-108 

INSYS MICROELECTRONICS 4-438 

Intecs 4-111 

Intel 1-324 

Interface Concept 4-546 

Intersil 4A-122 

IntervalZero 5-340 

Intland Software 4-105 

Intrepid 4-502 

IPC2U 1-201 

ipcas 1-323 

IQD Frequency Products 1-152 

Ircona 1-329 

Ironwood Electronics 1-234 

IS2T 5-445 

IST Group 2-318 

ISYS RTS 4-307 

iSyst Intelligente Systeme 4-324 

iSYSTEM 4-505 



itemis 4-408 

ITI 4-422 

ITPower Solutions 4-303 

iWave 1-125 

IXXAT Automation 1-538 

Janz Tec 2-304 

Jauch Quartz 1-622 

jjPlus 4-240 

JM elektronik 2-426 

JS Automation 2-403 

JTAG Technologies B.V. 4-619 

K&A 4-324 

K2L 4-540 

Ka-Ro Electronics 1-306, 4A-224 

Keil, Tools by ARM 4-336 

Keith & Koep 5-340 

Kingdy Technology 1-649 

Kingston Technology 1-327 

Kinsun Industries 4-240 

KIRRON 4-442 

Klar Automation 5-314 

Klarälvdalens 4-626 

Klocwork 4-108 , 4-610 

koenig-pa 5-425 

Kontron 1-460, 5-340 

KUNBUS 4-246 

KUNSHAN 1-306 

Kurz Industrie-Elektronik 1-438 

KW-Software 4A-405, 5-420 

Lachmann & Rink 5-325 

Laird Technologies 1-434 

Lanner Electronics 2-420 

Lantronix 1-309 , 2-206, 2-420 

Lattice 5-142 

Lattix 4-108 

Lauterbach 4-210 

LCD-Mikroelektronik 1-170 

LDRA 4-410 

LEAD YEAR 1-403 

LeCroy 4-407 

Ledato 1-303 

LedEngin 4-240 

Ledman 1-450 

lesswire 4-137a 

Lexcom 1-630 

LieberLieber 4-517 

Linotype 5-223 

LinTech 2-317 

Linutronix 5-341 

LIPPERT 1-542 

Litemax Electronics 1-363 

Littelfuse 1-113 

livetec 2-514 

logi.cals 4-328 

Logic Technology 4-108 

LPKF 1-508 

Luperco 4-109 

Lynuxworks 5-321 

M-Sys 1-430 

M-Tronic 1-264 

macio 5-327 

Macronix 1-450 

35 February 2012



Magillem 5-212a 

Mansi Research 2-400 

Marvell 4A-122 

MathWorks 4-110 

MATRIX ORBITAL 1-149 

MAXIM 4A-122 

MAZeT 4-236 

MC Technologies 4-436 

McObject 4-108 

Meilhaus Electronic 4-605 

Memoright 2-411 

Memphis Electronic 1-442 

MEN Mikro Elektronik 2-220 

mentec 4-245 

Mentor Graphics 5-324 

merath metallsysteme 4A-324 

MES Electronic 4A-109 

metraTec 5-239a 

MEV Elektronik Service 4-240 

Micrium 5-227 

Micro Analog System 1-450 

Micro Computer Control 1-468 

Micro Crystal 1-450 

Microchip Technology 1-524 

MicroConsult 4-322 

MicroControl 1-305 

MicroMax 2-515 

Micronas 1-306, 4-542 

Microsemi 4A-122 

Microsoft Deutschland 5-340, 5-405 

MicroSys 4-328 

microTOOL 4-121 

Midi-Pyrenees 4-546c 

Mikrap 4-541 

MikroElektronika 4A-509 

Milandr 1-607 

Missing Link 4-201 

Mitsubishi Electric 1-163 

Mitsubishi International 1-610 

MOLEX 4-609a 


Monotype 5-223 

MOS Electronic 4A-123 

MOST I & T 1-117 

MOStron Elektronik 2-510 

Mouser Electronics 1-434 

Moxa 2-415 

MPS 1-424 

MRC Components 5-239e 

MSC Vertriebs 2-219 

MSI 1-646 

MURATA 1-424 

Nabto 4-344 

National Instruments 4-422 

Navman 1-424 

NEOUSYS 2-324 

NetModule 4-441 

New Japan Radio 4-240 

next system 2-313 

Nijkerk 2-426 

NLT Technologies 1-306 

Nolam 1-612 

Shenzhen Norco 1-230 

Novatronic 4A-509 

Nuvoton 1-618 

NVIDIA 4A-404 

NXP Semiconductors 4A-222 

Octagon Systems 1-151 

OFFIS 4-203 

OmniVision 2-216 

ON Semiconductor 1-434 

OSADL 5-341 

OpenSynergy 5-234 

OpenSystems Media 5-414b 

OPTEC Factory 1-529 

Option 4A-512 

Optogan 2-206 

ORACLE 5-313 

Orient Display North America 1-424 

OWITA 4A-308h 

Panasonic Industrial Devices 4A-423 



Papa Lima 4A-308g 

Parasoft 4-416 

PC/104 Consortium 2-515 

PEAK-System Technik 1-616 

Pengutronix 5-341 

PENTALOG 4A-414 

Percepio 4-503 

PERFECTRON 1-517 

Pervasive Displays 1-450 

Phoenix 5-237 

Phytec Messtechnik 1-206 

Pico Technology 4-509 

PikeTec 4-514 

Pixcir Microelectronics 1-219 

pk components 4-538 

PLDA 1-229 

PLS 4-310 

PLUG-IN 2-425 

PLX Technology 4A-122 

POHL Electronic 1-159 

POLARION Software 4-202 

port 1-636 

Portwell 2-506 

Power Integrations 4-240 

PPM 4-632 

PRAGMADEV 4-127 

Premo 1-450 

PRETEC/C-ONE 1-109 

ProAnt 4-444d 

PROEMION 1-128 

PROFIBUS & PROFINET 4A-405 

profichip 1-137 

Programming Research 4-126 

Projektron 4-508 

ProLight Opto 4-240 

Prosign 4-511 

Protech 4-239 

Protecode 4-127 

PTC 4-520 

pure-systems 4-420


QA Systems 4-126 

QNX Software Systems 5-134 

Qt Commercial, Digia 4-405 

QUAD 1-211 

Quadros Systems 4-207 

Qualcomm Atheros 1-424 

QuartzCom 4-343 

RaidSonic 2-225 

Raima 5-417 

RAISONANCE 4-103 

REAL-TIME EXPERTS 4-327 

Real-Time Systems 5-434 

Realtek Semiconductor 4-240 

Recom Electronic 4-242 

Redpine Signals 1-450 

Reed Business Information 4-638 

Reed Electronics Group 5-132 

Renesas Electronics 1-336/306, 4A-122/405 

Renice Technology 2-517 

RIGOL Technologies 4-516 

RM Components 4-440 

RM MICHAELIDES 1-128 

Rohde & Schwarz 4-112 

Round Solutions 4-444e 

RRC power solutions 1-155 

RS Components 1-156 

RST Industrie Automation 4-324 

The RTC Group 4-648 

RTD Embedded 1-134 

RUTRONIK 1-318 

S-TEC electronics 2-111 

S.E.A. Datentechnik 4-422 

SafeTRANS 4-102 

Sage 4-108 

SAGEMCOM 1-424 

Samtec 1-544, 2-515 

Samway 4A-414 

San Jose Technology 4-339 

Scan Engineering 2-221 

Scantec 2-216 

Schleißheimer 4-518 

Schmid Elektronik 4-422 

Schroff 4-335 

SE Spezial-Electronic 5-235 

SECO 2-314 

SEGGER 4-226 

Seiko Instruments 1-306 

Sembatec 5-340 

Semi South 4-240 

Semitech 1-424 

Semtech Germany 4A-108 

senTec Elektronik 4-123 

sepp.med 4-324 

Serma 4A-505 

setron 4-538 

SEVENSTAX 5-316 

Sharp Microelectronics 5-405 

Siemens 5-341 

SIEPA 4A-509 

Sierra Wireless 1-306, 4A-122 

Sigasi 4-109 

Signum Systems 4-127 



Silica - An Avnet Company 1-334 , 5-340 

Silicon Laboratories 4A-122, 4A-211 

Silicon Microstructures 4-240 

SILVER ATENA 5-442 

SIMOS 4-536 

Simple Solutions 1-509 

Simplify Technologies 1-471 

SINTRONES 2-420 

SINUS Electronic 1-113 

Smart Modular Technologies 2-216 

SMSC 4-540, 4A-122 

SOFTING 1-352 

Software Quality Lab 5-438 

solvimus 4A-205 

Sontheim 2-322 

SOQUS 5-217 

SORCUS Computer 1-143 

Spansion 4-642 

SparkLAN Communications 2-206 

Sparxsystems 4-517 

Spectracom 4-544a 

SPHINX 2-420 

SPIKENET 4-546c 

spo-comm 1-122 

SQuORING 4-546c 

SST-Microchip 5-143 

SSV Software Systems 4-444i 

STAND EXPO 4A-414 

STEC 4-240 

STM Products 4-324 

STMicroelectronics 4-243 

Stollmann 2-531 

Stretch 2-216 

STZ 4-345 

SÜTRON 2-308 

Summit 4-240 

Sundance 2-515 

Sunny Electronics 1-450 

Sunrich Technology 4-636 

Swissbit 1-306, 1-516 

Symtavision 4-327 

Synopsys 4-101 

SYS TEC 4-513 

SYSGO 5-234 

Syslogic 1-550 

SystemBase Co. 1-270 

Systemum 5-432 

SYSTERRA 1-134 

Tag-Connect 4-115 

TAGOR 4A-509 

Tameq 4-407 

TASKING by Altium 4-204 

taskit 1-303 

TDK-Lambda 4-238 

TechConnect 4-609 

TU Dresden 5-335 

TU Ilmenau 5-335 

TECHWAY 4-546a 

tecnotron 4-104 

TecSys 1-357 

Teka Interconnection 2-515 

tekmodul 2-320 

37 February 2012



Tektronix 4-205 

Telit Wireless Solutions 5-241 

TELNET 4-546d 

TenAsys 5-418 

Texas Instruments 4-342, 5-341 

Texim 1-325 

The IET Services 2-504 

Thesycon 5-316 

Tibbo Technology 4-240 

Tieto 4-328 

TIGAL 1-270 

TIGRIS 2-423 

Timing-Architects 4A-308d 


TOPAS electronic 2-216 

Toradex 4-135 

Torex Semiconductor 1-424 

Toshiba Electronics 1-306 , 4A-314 

Total Phase 4-510 

TouchNetix 4-141 

TQ Group 1-560 

Transcend 1-216 

Transilvania Software 4A-414 

Transim Technology 4A-206 

Trenz Electronic 1-107 

TRIAS Mikroelektronik 5-324 

TRINAMIC 4-240 



TTTech 4-401 

TÜV SÜD 4-204 

TUL 5-139 

u-blox 4A-325 

U.S. Sensor 4-240 

UBIFRANCE 4-546 

UI Centric 5-340 

Ultra-X 1-105 

ULTRATRONIK 4-138 

Unicoi Systems 5-440 

Unified Automation 5-418 

Unitronic 4-444b 

User Interface Design 5-426 

Vector Fabrics 4-607 

Vector Informatik 4-122 

Vector Software 4-216 

Verifysoft Technology 4-603 

Verocel 5-328 

Verum Software 5-436 

VIA Technologies 1-650 

Viewpointsystem 5-340 

Viking Technology 1-640 

Vision Components 5-304 

Vision Systems 1-505 

Visure Solutions 4-418 

voice INTER connect 4-330 

VOIPAC 1-611 

Vox Power 4-240 

Vrije Universiteit 5-349 

W+P Products 1-455 

WAGO Kontakttechnik 2-413 

Walter-M2M 4-444j 

WDI 4-435 

WEKA 4-134 

Welotec 1-347 

Western Digital 4A-424 

WEWA 5-136a 

WIBU-Systems 5-340 

Willert Software Tools 4-322 

Wind River 5-334 

Winmate 4-639 

WiseChip 1-424 

WITTENSTEIN 5-406 

WIZnet 2-419 

Wolfson Microelectronic 2-216 

WÜRTH Elektronik 2-520 

WynMax 1-260 

X-SPEX 1-469 

X2E 2-516 

Xilinx 1-205 

XiSys Software 4-324 

XJTAG 4-140 

XKrug 4-526 

XMOS 2-216 

Yokogawa 4-306 

YUAN 5-137 

ZEROPLUS 1-270 

Zettler electronics 4-143 

Zilog 1-428 

Zippy Technology 2-526 

Zitzmann 5-324 

Zühlke Engineering 5-242 

ZVEI 5-319



of Embedded World 

Celebrating the 10th anniversary - Nuremberg, February 28th to March 1st 

This year Embedded World Exhibition&Conference brings the embedded 

community together in Nürnberg for the tenth time. After last year’s 

record number of exhibitors and visitors, the exhibition is moving to 

the larger halls 1, 2, 4, 4A and 5. Embedded World has developed outstandingly 

since it started in 2003 and the number of exhibiting companies 

and the display space have more than doubled since then. More 

than 800 exhibitors (+130 % over 2003) presented their products and 

Hall-Stand 4-422 

NI: low-speed CAN and LIN Interfaces 

for NI CompactDAQ 

National Instruments introduced the C Series 

NI 9861 CAN interface and NI 9866 LIN interface, 

the newest modules in the NI-XNET 

family of products and the first low-speed 

CAN and LIN modules that integrate with the 

entire NI CompactDAQ platform. As part of 

the NI-XNET family, the new modules provide 

engineers with productivity advantages such 

as hardware-accelerated messaging and onboard 

processing. The single-port, low-speed 

C Series NI 9861 CAN interface module features 

integrated CAN database support for 

importing, editing and using signals from 

FIBEX, .DBC and .NCD files. It is capable of 

100 percent bus load communication up to 

services on a gross area of some 34,000 m2 (+127 %) in 2011 and attracted 

more than 19,000 visitors (+116 %) to Nürnberg. The current 

figure for exhibitors in 2012 already exceeds the comparable figure for 

last year by 23 per cent, and the display space is already up 19 per cent. 

On the following pages we have put together for you an overview 

about product highlights which will be shown in Nuremberg form 

28th to March 1st. 

125 kbit/s without dropping any frames. The 

NI 9866 LIN module is also a single-port interface 

with integrated support for importing 

and using signals from LDF databases along 

with master/slave support and hardware-timed 

scheduling for master tasks. It is capable of 

100 percent bus load communication up to 20 

kbit/s without dropping any frames. 

News ID 14798



Rutronik presents complete solutions for vertical markets 

at embedded world 

Rutronik will be presenting itself at embedded world as a provider of 

complete application-specific solutions for the lighting, medical, 

energy, automotive, industrial and home appliance focal markets. 

With a full portfolio that covers all electronic components, Rutronik 

is able to present complete solutions in full detail and is therefore 

able to tune them to precise technical and commercial needs. Innovative, 

functional example applications for each focal market will be 

among the highlights on the fair stand. These include an electric car 

from Tesla and an LED “Arquicity” street lamp with automatic brightness 

adjustment, developed by Rutronik in collaboration with Osram 

Opto Semiconductors and the solid state lighting specialists Arquiled. 

As an example for the industrial field, Rutronik will be demonstrating 

the intelligent energy controlling system from econ solutions, in 

which the distributor also contributed to the development. It provides 

industrial companies with transparency about every point of energy 

consumption, thereby providing a basis for a comprehensive system 

of energy management. Product and application engineers from the 

six vertical market teams and from all of the product divisions stand 

ready to provide fair visitors with expert advice. 

News ID 14887 


Atlantik Elektronik at embedded world 2012 

Atlantik Elektronik takes off into for the 35th anniversary with its presence 

at the embedded world 2012 with its motto: We love technology! 

Atlantik presents a revolutionary concept of LED modules, making it 

finally possible to realise tailored lighting solutions for the first time. 

That concept enables freely configurable sizes and design of light 

sources. In addition, visitors can immerse into the world of wireless 

communications with the Embedded RANGER development kit. This 

development kit provides an ideal base for developments with 

GSM/GPRS, WLAN, ZigBee and Bluetooth. Qualified and pre-certified 

radio modules allow an efficient design and thus shorten the development 

time significantly. At Atlantik Elektronik, the car is now becoming a 

rolling Wi-Fi hotspot - thanks to CSR’s wireless technology with Wi-Fi 

access point, Wi-Fi direct and Wi-Fi client as well as Bluetooth 3.0+HS 

for high-performance wireless solutions! Another exhibition highlight 

is the live demonstration of how the mobile phone can be turned into 

the key to a house. In addition, Atlantik Elektronik strengthens its 

efforts with the development of apps for specific applications. Visitors 

can gather knowledge about the world of apps on a new industrial 

i.MX53 1GHz -based module with Android. The topic „Strong ARM 

with industry-leading specifications,“ continues to enjoy the highest 

popularity. Atlantik Elektronik presents the most comprehensive 32bit 

microcontroller family „NuMicro“ with more than 60 derivates 

now, equipped with a Cortex-M0 kernel from ARM. As a solution 

provider Atlantik Elektronik is capable of offering complete solutions 

to the customers on the basis of the above mentioned products, and 

advise them with the development of new applications. 

News ID 15019 

Hall-Stand 5-405, 5-340 , 4A-206 

Arrow: engineering and embedded computing integration 

services 

Arrow Electronics will showcase its engineering and embedded computing 

integration services at the Embedded World trade show. 

Arrow will feature engineering offerings that support developers 

throughout all design process steps, from the identification of new 

applications to the concept phase and through the development of 

41 February 2012 

V-1_2012-WOEI-5903 

COM Express 

MSC CXB-6S 

The new flagship with 

up to four cores 

Based on the 2nd generation of Intel ® Core processors in 32 

nm lithography, the MSC CXB-6S is available with different Core 

i5, i7 and Celeron ® CPU types. It offers outstanding performance 

and scalability for demanding embedded solutions – from the 

cost-efficient Celeron up to the high-end quad core. 

■ Multiple i5, i7 and Celeron processor 

options available 

■ Single, dual and quad core solutions 

■ Intel ® HD Graphics 2000 / 3000 

■ Intel ® QM67 or HM65 Platform Controller Hub 

■ Up to 16GB DDR3 SDRAM, dual channel 

■ Four SATA-300 interfaces 

■ One PATA interface 

■ LVDS (24 Bit, dual channel) and VGA 

■ Resolution up to 2560 x 1600 

■ Five PCI Express x1 lanes 

■ Eight USB 2.0 interfaces 

■ UEFI Firmware 

■ COM Express Type 2 

■ 125 mm x 95 mm 

■ Intel ® vPro (AMT, TXT, virtualization), 

Intel ® Turbo Boost 2.0 

Please visit us at the 

embedded world 2012 

�� 

Embedded 

NEW 

Nuremberg · 28. 2.- 1. 3. 2012 

MSC Vertriebs GmbH 

+49 8165 906-122 · boards@msc-ge.com 

www.msc-ge.com


the solution. Arrow offers numerous engineering 

programmes, tools and solutions to 

developers during each phase, including Testdrive, 

a reference board evaluation programme, 

online design tools and industry-specific technology 

solutions. In particular, Arrow’s engineering 

booth will emphasize areas such as 

the functional safety in industrial automation, 

motion control, LED lighting and memory 

solutions. Several manufacturers will present 

their newest technologies, and boards that 

Arrow has designed in collaboration with 

manufacturers and development partners, such 

as BeMicro Real Time Ethernet and a new 

version of the web server, CUBE, will be exhibited. 

Demonstrating its commitment 

of ”bringing it all together,“ Arrow will also 

showcase its embedded computing integration 

services for original equipment manufacturers. 

Those services include end-to-end solutions, 

design engineering, supply-chain management, 

global logistics and postmanufacturing solutions. 

Arrow provides numerous system-integration 

options, and its product range for 

OEMs includes displays, industrial computing 

platforms, storage and software solutions with 

comprehensive server solutions, standard and 

custom board designs and system solutions, 

among others. Arrow maintains seven inte- 

gration and fulfillment facilities for OEM solutions 

worldwide. 

News ID 15005 


Visure: field-proven requirements 

engineering solution for embedded systems 

Visure Solutions has released the IRQA Systems 

Engineering Template, an IRQA extension designed 

to address the challenges of increasingly 

complex embedded software systems. As a 

field-proven requirements engineering tool, 

IRQA improves the quality and tracking of 

embedded system requirements through automated 

requirements specification and change 

management. 

News ID 15008 


ERNI: ARM-based mezzanine modules 

ERNI Electronics announces its entry into the 

growth market of computer-on-modules. At 

Embedded World, the company is presenting 

the first products of the new WHITEspeed 

family. The implementation of the new 

WHITEspeed interface standard benefits from 

the high speed and reliability of the MicroSpeed 

connectors. With this, the company is in particular 

addressing applications in harsh and 

demanding industrial environments such as 

in the field of transport, heavy engineering 

and automation exposed to high shock and 

vibration loads. The portfolio comprises a 

family of pin-compatible ARM-based mezzanine 

modules, which differentiate in terms of 

the CPU performance (clock rate, number of 

cores, coprocessors) and I/Os and memory 

capacity. In addition, a fully equipped, adaptable 

baseboard is available, which can be 

supplied also with an optional display. 

News ID 15031 


Lauterbach: TRACE32 tools support 

Beyond BA22 family of microprocessor 

Beyond Semiconductor and Lauterbach announce 

that the TRACE32 debuggers from 

Lauterbach fully support the Beyond BA22 

family of processor cores. The TRACE32 tools 

provide quick, effective BA22 processor debugging 

through a standard JTAG interface 

for the entire debug process, including code 

download, flash programming and source code 

debugging. 

News ID 15011

WINDOWS EMBEDDED SPECIAL 

Developing Advanced Multimedia Graphical Devices 

Using Windows Embedded Technologies 

n Adeneo Embedded assists device makers in 

software development through training, support 

and engineering services using Windows Embedded, 

Windows Phone and Silverlight for 

Windows Embedded. By partnering with Microsoft 

and major Silicon Vendors, Adeneo Embedded 

combines unique expertise of Windows 

Embedded technologies with in-depth knowledge 

on ARM Cortex-A8/A9/A15 processors 

like Freescale i.MX, Texas Instruments 

OMAP/DaVinci/Sitara as well as Intel ATOM 

MIO-2260 Powered by Intel ® Atom 

N455 Processor 

n Advantech, a global embedded computing 

leader providing smart solutions across multiple 

vertical markets, today announced the arrival 

of MIO-2260. MIO-2260 is designed with 

the Intel ® Atom N455 single core processor 

and DDR3 memory support. It is an all-inone 

ultra small size embedded Single Board 

processors. The Adeneo Embedded engineering 

team provides direct support to many OEMs 

worldwide designing rich multimedia and connected 

devices for Automotive, Consumer, Industrial, 

Medical or Mobile markets. 

For the 5th year in a row in 2011, Adeneo Embedded 

received the Windows Embedded Excellence 

award from Microsoft, in both the 

Americas and Europe. This award acknowledges 

our exceptional commitment to technical 

excellence, superior customer support, and 

outstanding engineering services. 

Adeneo Embedded’s award winning team of 

engineers are skilled in implementing the connectivity 

and multimedia features of Windows 

Embedded based devices, such as advanced 

user interface using Silverlight for Windows 

Embedded and embedded device integration 

within the Cloud as “intelligent systems”. Superior 

knowledge of Adeneo Embedded for 

Windows Embedded technologies and in-depth 

understanding of ARM and x86 processors ar- 

Advantech Ultra Small SBC with 

High Extension Flexibility 

Computer (SBC) measuring only 100 x 72 

mm (same dimension as 2.5” Hard Disk) 

which is easy to embed into space-limited systems, 

making it a perfect fit for power saving 

environments. 

MIO-2260 not only features low power consumption 

and small footprint, but it is also 

equipped with flexible multiple I/O expansion 

and interfaces. This small all-in-one module 

helps deliver more efficient scheduling using 

less development resources and helps customers 

retain their specialist domain knowhow. MIO- 

2260’s integrated LVDS display and touch 

panel transmission interfaces achieve highspeed 

data processing and excellent graphics 

capabilities – making MIO-2260 SBC perfect 

for small HMI and high performance industrial 

control machine applications. MIO-2260’s 

compact size also makes it suitable for embedded 

handheld devices, industrial equipment, 

medical, and intelligent home automation. 


chitecture ensure device makers obtain the 

optimum design, support and maintenance 

efficiency for the development of their embedded 

product 

Through its collaboration with major Silicon 

Vendors, Adeneo Embedded develops, distributes 

and supports Board Support Packages for 

many ARM- and x86-based architectures, providing 

robust and high performing reference 

solutions to OEMs developing advanced multimedia 

devices with high demanding performance 

requirements for graphical rendering, 

power consumption, and wireless connectivity. 

Our embedded system integration expertise 

enables us to provide solutions and advise 

OEM’s engineers regarding the best OS/processor 

compromise to meet their project requirements. 

Adeneo Embedded also provides customized 

options from training and support to 

complete system integration services permitting 

us to have a progressive engagement with 

OEMs and to provide the most appropriate 

service at each stage of development. n 

MI/O Extension Provides Flexible 

Efficient Development 

Advertorial 

MIO-2260 provides flexible modular design 

capability for customers through its innovative 

MIOe interface. Advantech also provides a reference 

design guide and test evaluation board 

for the customer who wants to design modules 

in simpler way. By connecting with MIOe unified 

connector through high speed sockets, 

customers get additional flexible I/O choices

Advertorial 

to fulfill different vertical applications. MIO- 

2260 integrates several interfaces on the MIOe 

connector which include compatibility for 4 x 

PCIe x1, 3 x USB 2.0, Audio Line-out ,SMbus 

and LPC, as well as 5Vsb , 12Vsb and power 

control signal. MIOe modules can be completely 

customized to meet customers’ requirements 

as well as saving their investment cost 

and shortening development schedules. 

Innovative Mechanical Design for Easy 

Integration and Cost Savings 

The mechanical design of MIO-2260 has the 

heat-generating parts and active components 

placed on the top side of the board, and the 

onboard I/O and rear I/O placed on the bottom 

side to make it easier to design a more efficient 

thermal spread result. In addition, MIO-2260 

has an optional heat spreader to make thermal 

design easier and more efficient. Using a heat 

spreader to conduct the heat to the chassis 

cover makes more compact and low-profile designs 

possible than using a traditional heatsink, 

as well as giving better thermal dissipation. 

The MI/O Extension design means less wiring 

in systems, further reducing manual installation 

cost, and reducing the size of the final product. 

Advantech Reliability Enhancement 

Design 

MIO-2260 features a single 12V DC power 

input design which makes it easier for power 

integration. MIO-2260 also supports a DC 

power hot-plug protection design which can 

protect it from current fluctuations damaging 

the board when using DC power directly. To 

be more reliable and able to endure extreme 

environments, Advantech’s MIO-2260 was designed 

with a high level industrial grade ESD 

COM port driver IC (15KV air protection/8KV 

contact protection for RS-232), 100% solid capacitors 

with better MTBF compared with 

electrolytic capacitors, and TG-150 PCB type 

that allows the PCB to endure higher temperatures. 

MIO-2260 is a reliable single board com- 

n Founded 2011 bitshift dynamics GmbH located 

in Munich, Germany presents itself on 

the 2012 Embedded World Exhibition in 

Nuremberg as a new member of the Microsoft 

Embedded family. 

Our customers receive in many aspects support 

in their daily business or as partner from our 

side. Throughout several years of Knowledge 

in IT-Projects, Development, or Support-Tasks 

for SMB to Industry-Levels have finally estab- 

puter solution that is well designed, using high 

quality materials—all backed up by advanced 

customization and integration services. 

Cloud Computing Client Device with 

SUSIAccess and Emb’Store 

MIO-2260 is directly supported from Advantech’s 

new cloud-based service—Emb’Store, 

which delivers on-demand services for embedded 

computing customers. Emb’Store offers 

the latest embedded hardware device drivers, 

BIOS updates and API’s, as well as 3rd party 

applications and specific embedded software. 

One such value added application is SUSIAccess 

which is used to monitor and manage multiple 

terminal devices as well as configure, maintain 

and recover them. It not only actively detects 

embedded devices, but also saves related data 

on the server for subsequent evaluation. SUSI- 

Access can remotely recover a system by simply 

clicking a restore button to recover the whole 

system. These remote operations can significantly 

reduce the maintenance and manpower 

costs arising from on-site visits. 

Features: 

n Embedded Intel® Atom N455 Single Core 

+ ICH8M, DDR3 memory support 

n Intel Gen 3.5 DX9, MPEG2 Decode in HW, 

Dual Independent display: 18-bit LVDS + VGA 

n Supports 12 V +/- 10% input power and 

DC power hot plug design 

n One Intel GbE, Rich I/O interface with 2 x 

COM, 1 x SATA, 2 x USB 2.0, 8-bit GPIO, 

Audio Line-in/out, SMBus, I2C, CF, halfsize 

mini-PCIe 

n Extended Interface support from MIOe: 4 x 

PCIe x1, LPC, SMBus, 3 x USB 2.0, audio 

line-out 

n 15KV Air ESD protection COM port design 

n Supports Advantech’s SUSIAccess and embedded 

Software API and Utility. 

n WinCE6.0, Windows XP/XP Embedded, 

Windows 7, WES7, QNX, and Vxwork OS 

Support 

lished us as a young startup-company. We 

carry this on with our Portfolio e.g. in the 

Branches Medical or Banking/Automation and 

of course not limited to these. 

State-of-the-Art Know-How coupled with a 

Portfolio with its core C#, .NET, C/C++ QT3/4 

and Industrynetworks enables us as well to solve 

tasks for dedicated devices such as Embedded 

Solutions for you. Even complete Systems including 

Hardware up to the finished product 


n MI/O Extension- Ultra series: 100 x 72 mm 

(3.9“ x 2.8“) 

n Thermal Solutions: Fanless design MIO- 

2260, with optional heat spreader solution 

for bundling which makes whole system 

more compact. 

Please contact a local sales office, or visit us on 

the web at 

http://www.advantech.com.tw/embcore/. 

You can visit us at: 

Embedded World|28.Feb- 01.Mar.2012, 

Nürnberg Germany|Hall 2 Booth 110 

About Embedded Core Service 

Advantech Embedded Core Services offers design-in 

oriented services. These streamlined 

solutions broadly integrate embedded boards, 

peripheral modules and software. This dedicated 

focus on Embedded Design-in services 

fulfills electronic engineering demands at their 

design-in phase, and brings benefits that shorten 

the design and integration cycle, minimizing 

uncertainty and risk. www.advantech.com/EmbCore 

About Advantech 

Founded in 1983, Advantech is a leader in providing 

trusted, innovative products, services, 

and solutions. Advantech offers comprehensive 

system integration, hardware, software, customer-centric 

design services, embedded systems, 

automation products, and global logistics 

support. We cooperate closely with our partners 

to help provide complete solutions for a wide 

array of applications across a diverse range of 

industries. Our mission is to enable an intelligent 

planet with Automation and Embedded 

Computing products and solutions that empower 

the development of smarter working 

and living. With Advantech, there is no limit 

to the applications and innovations our products 

make possible. (Corporate Website: 

www.advantech.com) n 

Bitshift dynamics new Windows Embedded partner 

can be setup. Additionally we also offer consulting 

services and the placement of IT-Professionals. 

The new bitshiftSDK: A comprehensive development 

kit based on .NET 4.0 - bundles the 

most needed and useful components for developing 

powerful applications and reduce the 

Time-To-Market. One of the handiest components 

is a WPF and WindowsForms independant 

EventAggregator with integrated 

Dispatcher and extensive debugging and 

remoting capabilities. n 

45 February 2012


Free entry tickets for embedded world 2012 

Complimentary entry tickets are available at www.windowsembedded.de/ew2012. Simply click on the orange 

registration box and follow the instructions. 

Free Hands-on sessions 

On every show day you Microsoft and some selected partners are offering free hands-on session for our latest 

Windows Embedded products. The sessions focus on a different topic. That lets you select the subject that 

you are interested in most. In case you can’t attend a session, no worries. Some workshops are held twice. 

More details about the sessions are available at www.windowsembedded.de/ew2012. 

Dates: 

Tuesday 

10:00 – 12:00: 

Introduction to Windows Embedded Standard 7 SP1 

13:00 – 14:00: 

Roadmap on Microsoft’s latest operating systems 

14:00 – 16:00: 

Next generation UX with Silverlight for Windows Embedded 

Wednesday 

10:00 – 12:00: 

Introduction to Windows Embedded Compact 7 

14:00 – 16:00: 

Discover Windows Embedded Standard 7 

Thursday 

10:00 – 12:00: 

Discover Windows Embedded Standard 7 

14:00 – 15:00: 

Roadmap on Microsoft’s latest operating systems 

As seats are limited please register at www.windows - 

embedded.de/ew2012 to secure your seat for the session 

(registration for multiple sessions is possible). 

Please meet 5-15 minutes before the session starts at 

the Microsoft booth in hall 5. 

Forum Presentations 

Tuesday 

14:00 – 14:30: 

How embedded devices evolve to become Intelligent 

Systems, Microsoft & Intel – exhibitor forum hall 5 

15:00 – 15:30: 

From controller into the cloud: Windows Embedded 

Industrial Automation Solutions, Beckhoff – exhibitor 

forum hall 5 


16:30 – 17:00: 

Windows Embedded Product Portfolio, Microsoft – 

exhibitor forum hall 5 

Wednesday 

12:00 – 12:30: 

The computer on module rule in the Internet of 

Things, Advantech Europe BV – exhibitor forum hall 2 

14:30 – 15:00: 

Developing advanced multimedia products using 

ARM multicore processors with Windows Embedded 

Compact 7, Adeneo Embedded – exhibitor forum 

hall 5 

16:00 – 16:30: 

How embedded devices evolve to become Intelligent 

Systems, Microsoft – exhibitor forum hall 2 

Thursday 

10:00 – 10:30: 

Hardware partitioning and Windows Embedded – 

take advantage of multi-core architectures, Real-Time 

Systems – exhibitor forum hall 5 

11:30 – 12:00: 

Introducing Conformity Explorer®, Hilf! GmbH – exhibitor 

forum hall 5 

12:00 – 12:30: 

Managing Security Threats in a connected embedded 

environment, Captec – exhibitor forum hall 5 

More details about the presentations are available at 

www.windowsembedded.de/ew2012. 

In addition to the exhibitor forum presentations, 

Microsoft and its partners run additional presentation 

on the Windows Embedded stand in hall 5, 

stand 340.


Green Hills launches end-to-end security 

solutions 

Green Hills Software announces its new endto-end 

ISS Security Solutions consisting of 

Suite B-Compliant Security Protocol Toolkits 

and Device Lifecycle Management system, delivered 

by its INTEGRITY Security Services 

business unit. INTEGRITY operating systems 

with an ISS Security Protocol Toolkit will add 

an additional level of reliability and authenticated 

security that ensures all embedded devices 

powered by ISS Solutions are secure. 


News ID 15034 

element14: PIC18 Flowcode developers 

kit eases graphical programming 

element14, Microchip and Matrix introduce 

the new PIC18 Flowcode Developers Kit. This 

development and demonstration kit is designed 

to offer a hands-on, easy approach to electronics 

design using Flowcode, one of the 

world’s most advanced graphical programming 

languages for microcontrollers. The development 

platform is based on a Microchip 

PIC18F26J50 low power, 8-bit PIC18F26J50 

microcontroller, and is integrated with temperature 

sensor, capacitor touch sensor and 

potentiometer to help developers verify programs 

designed using Flowcode. 

News ID 15037 


Agilent: add-in extensions for 

compliance application software 

Agilent Technologies announced a product 

enhancement designed to help engineers extend 

the capabilities of compliance applications on 

the company’s Infiniium real-time oscilloscopes. 

The enhancement to Agilent’s N5467A 

user-defined application software gives engineers 

the ability to develop extensions that 

they can plug into existing compliance applications 

for USB, PCIe, DDR, SATA, HDMI, 

MIPI, Ethernet and other technologies. This 

add-in capability allows engineers to rapidly 

automate custom measurements on Infiniium 

oscilloscopes, which saves time and effort. 

News ID 15030 

Hall-Stand 4A-122 

Microsemi acquires timing, synchronization 

and synthesis business from Maxim 

Microsemi has acquired the telecom clock 

generation, synchronization, packet timing 

and synthesis business from Maxim Integrated 

Products. The acquired product lines and technology 

are vital to the effective and efficient 

delivery of time-sensitive voice, data and multimedia 

traffic over wireless and wired net- 

works, and will further provide Microsemi’s 

customers with the critical synchronization 

components required to harmonize system 

and network clocks, as well as the synthesis 

products required to distribute timing clocks 

throughout each system. 

News ID 15028 


MSC: Atmel expands low power AVR 

UC3L MCU series 

MSC presents five new members of Atmel s 

32-bit AVR UC3L Series of microcontrollers. 

The AVR UC3 L is part of Atmel’s picoPower 


32-bit microcontroller series. This series is 

ideal for portable consumer and battery-powered 

applications, board controllers, game 

pads, remote controls, and human interface 

devices. The AVR UC3 L Series consumes 

down to 165 µA/MHz in active mode, down 

to 600 nA with RTC running, and down to 9 

nA in deep-sleep mode. picoPower devices 

offer true 1.62V operation, allowing all analog 

modules, oscillators and Flash to be fully functional 

without compromise at 1.62V. The 

AT32UC3L’s built-in capacitive touch peripheral 

unit makes capacitive touch as easy as 

using just another peripheral. 

News ID 14998 

47 February 2012



Eurotech: ruggedized Cisco Catalyst 

4948E data center switch for 

military/aerospace 

Eurotech subsidiary Parvus announces the 

DuraNET 4948, a ruggedized version of Cisco 

Systems’ high performance Catalyst 4948E 

data center switch with 48 downlink and 4 

uplink ports in a hardened 2U chassis qualified 

to meet MIL-STD-810G environmental and 

MIL-STD-461F EMI requirements. 

News ID 14999 


pls: debug tools for new XMC4000 

microcontroller family of Infineon 

Synchronized with the market launch of the 

new XMC4000 MCU family of Infineon Technologies 

which is based on ARM Cortex-M4 

processor, PLS Programmierbare Logik & Systeme 

presents its Universal Debug Engine 

3.2.1, optimized test and debug tools for the 

high performance and also energy efficient 

SoC devices. Both the UDE 3.2.1 and PLS’ 

Universal Access Device 2 fully support the 

debug resources and peripherals of the new 

XMC4000 MCU family. The integrated 

FLASH/OTP programming function of the 

UDE guarantees maximum speeds in the entire 

erase-download-program-verify cycle. 

News ID 15012 


Atlantik presents Holtek s new enhanced 

Flash MCUs 

Atlantik Elektronik presents the HT68F60 and 

HT66F60 MCUs, Holtek s new 12K word program 

memory devices. They expand further 

the HT68Fxx and HT66Fxx enhanced flash 

MCU device range. The complete series meets 

with the industrial specification requirements 

of -40 ~ +85°C operating temperature and 

high noise immunity. By integrating Holtek s 

in-circuit programming technology solution, 

users can conveniently upgrade their application 

programs. 

News ID 15041 


Delkin: ruggedized 32GB and 64GB high 

extended temperature CompactFlash 

Delkin Devices releases 32GB and 64GB high 

performance, extended temperature Compact- 

Flash cards. Delkin offers 64GB CF cards 

with an operating temperature range of -40 to 

+85°C, through the use of single-level cell 

NAND flash. Complementing their industrial-grade 

ruggedness, the Delkin 32GB and 

64GB CF cards also deliver high speed performance, 

reading up to 105 MB/second and 

writing up to 95 MB/second in UDMA 6 


mode. Delkin has engineered these cards to 

deliver the maximum capacity, speed, endurance 

and temperature tolerance to meet 

the demands of industrial applications in harsh 

environments. 

News ID 14981 


IAR supports Infineon XMC4500 

microcontrollers 

IAR Systems announced that its embedded 

software development toolchain IAR Embedded 

Workbench now provides support for the 

new XMC4500 microcontrollers from Infineon 

Technologies, including examples for the modular 

Hexagon Development Kit. The XMC4500 

series of microcontrollers is dedicated to enable 

highly energy-efficient products with industrial 

interconnection capabilities. It features a configurable 

peripheral set, which allows setting 

up the controller according to the specific use 

cases in the various parts of an application. 

News ID 15009 


MSC presents further ARM based Qseven 

module family 

With the compact MSC Q7-TI8168 module 

the MSC Vertriebs GmbH expands its offering 

of ARM based embedded boards in compliance 

with the Qseven standard 1.20. The powerful 

platform integrates the Integra C6A8168 

processor from Texas Instruments with an 

ARM Cortex-A8 core with up to 3000 DMIPS 

and a digital signal processor. The 10 GMACS 

/ 7,2 GFLPOS DSP @1.25 GHz C674x supports 

32/64-bit single/double precision floating point. 

The MSC Q7-TI8168 Qseven module is special 

designed for demanding image processing 

functions e.g. in industrial automation, medicine, 

transportation and security systems. 

News ID 15006 

CES announces Freescale QorIQ 

SBC family 

The new CES RIO Single Board Computer 

family features Freescale QorIQ processors, 

PMC/XMC sites, optional userprogrammable 

FPGAs, integrated in various form-factors, 

such as OpenVPX, VME, CompactPCI and 

PrPMC/XMC. The multi-core processor design 

is well suited for applications, which are highly 

compute-intensive, I/O intensive, or both. The 

Crosspoint switch or FlexIO permit flexibility 

and configuration of the payload profile or 

backplane configuration in accordance to the 

form-factor. A Board Management Controller 

is also integrated, providing system status 

monitoring, logging and dynamic reload 

(processor and FPGA) functions in real-time. 

News ID 15022


F&S: ARM SBC in PicoITX form factor 

armStoneA8 is a small, powerful and cost-effective 

SBC, offered by F&S. Its PicoITX form 

factor with CortexA8-1GHz is suited for developing 

small but high-performance applications. 

It comes with 512 Mbyte RAM and 

128 Mbyte NAND Flash, which is sufficient 

to boot WCE or Linux directly from Flash. A 

micro SD-Card can be added optionally. The 

board offers interfaces such as USB Host/ 

Device, 2x LAN, RS232, CAN, SPI, I2C, and 

Audio (IN/ OUT). Furthermore, a LVDS interface 

(max. resolution up to XGA/WXGA), 

a HDMI/ DVI interface up to 1920 x 1080 

and a touch panel interface are available, so 

it is possible to control two displays/ screens 

independently. 

News ID 14997 


Mouser offers Qi solutions for wireless 

charging 

Mouser Electronics is stocking components in 

support of the Wireless Power Consortium’s 

Qi (pronounced “chee”) global standards for 

interoperability between wireless power transmitters 

and wireless power receivers. The Wireless 

Power Consortium (WPC) is dedicated to 

promoting wireless charging stations that are 

compatible across different companies and 

countries. 

News ID 14996 

Hall-Stand 4A-308b 

CoSynth: simply create fast hardware 

from software 

At embedded world 2012 CoSynth will present 

their newest product, the CoSynth Synthesizer, 

a tool for the creation of FPGA-accelerated 

systems directly from existing software 

algorithms. Once Embedded PCs do 

not have enough performance anymore, 

there are two options: An expensive and energy-consuming 

fast CPU as replacement, 

or integration of coprocessors such as DSP, 

GPU, or FPGA. Since these special processors 

require a special programming, high costs 

for experts or ready-made solutions were 

required until now. 

News ID 14986 


ADLINK: i7 -based 6U CompactPCI blade 

with remote management 

ADLINK introduces the PICMG 2.0 compliant 

cPCI-6210 Series, a 6U CompactPCI processor 

blade based on the latest quad- and dual-core 

2nd Generation Intel Core i7 and Intel Core i5 

processors and up to 16 GB DDR3-1600 memory 

support. The cPCI-6210 is a performance 

computing solution with enhanced management 

features such as PICMG 2.9 compliant 

IPMI, remote management based on Intel vPro 

technology and optional Trusted Platform 

Module for security management, and is suitable 

for applications in Military, Communication 

and Industrial Control segments. 

News ID 14950 


Infineon: 32-bit XMC4000 MCUs with 

ARM Cortex-M4 processor 

Infineon Technologies has introduced its new 

XMC4000 32-bit microcontroller family, 


which uses the Cortex-M4 processor from 

ARM. The XMC4000 family supports three 

main trends in industrial applications: It 

helps to improve energy efficiency, supports 

a large number of communication standards 

and reduces software complexity during development. 

XMC stands for “Cross-Market 

Microcontroller” and means that, due to its 

configurability, the XMC4000 family is suitable 

for a wide range of industrial applications. 

Infineon is using this product to close the 

performance gap between the 16-bit XE166 

family and the 32-bit TriCore family. 

News ID 14988 

49 February 2012



SYSGO: Samsung SDS selects PikeOS for 

SIL4 railway project 

SYSGO’s flagship product PikeOS has been 

chosen for the next generation Communications-Based 

Train Control railway system by a 

South Korean consortium led by Samsung. 

The complete system complies with safety 

standard EN 50128 SIL4 and PikeOS is the 

certified RTOS platform for both ground and 

on-board components. 

News ID 14962 

Hall-Stand 4-342, 5-341 

TI: new Piccolo MCU digital AC LED 

lighting kit 

Texas Instruments has announced its new 32bit 

TMS320C2000 Piccolo microcontroller 

AC LED Lighting and Communications Developer’s 

Kit. Leveraging the performance of 

low-cost Piccolo MCUs, the LED Lighting 

and Communications Developer’s Kit is a 

complete mains-powered LED lighting solution 

with software that allows designers to 

create lighting products featuring full dimming, 

remote connectivity and efficient power 

stage design perfect for street, outdoor, commercial, 

industrial, and entertainment lighting 

applications. 

News ID 14966 


Lanner: fanless Industrial system with 

Intel Core i5/i7 

Lanner Electronics is releasing a fanless Intel 

Core i5/i7 based industrial computer. The LEC- 

7920 is designed with a Mini-PCIe slot with a 

SIM card reader for 3G connectivity, Intel 

GMA HD graphics for full high-definition output 

and a dust proof design for longevity. The 

LEC-7920 incorporates a Mini-PCIe slot with 

an attached SIM card reader. When equipped 

with a module this appliance can be connected 

through GPS or 3G networks, allowing for 

GPS tracking or content updates via 3G. 

News ID 14968 


Avnet Abacus will be demonstrating 

embedded power solutions 

Avnet Abacus will make its debut at Embedded 

World in 2012, demonstrating embedded 

power solutions for diverse applications as 

Smart metering, LED lighting, energy harvesting, 

Information systems, digital imaging 

and wireless LAN systems. The company will 

also have CAN-bus interface and sensor products 

on display for the first time. The emerging 

markets mentioned above require much more 

than single component approach. In solid state 

lighting, for example, it is important to support 


the LEDs with the latest, high reliability driver 

IC circuitry, passives and connectors in order 

to maximize the benefits of moving away from 

older, inefficient filament & fluorescent technology. 

Applications for energy harvesting, are 

so new that many approaches are currently 

under evaluation and designers need to see a 

complete systems picture before deciding on 

which technology is most appropriate. 

News ID 14956 


MicroSys: new SBC family based on 

Freescales QorIQ 

MicroSys announces a versatile family of 

Freescale QorIQ based Single Board Computers. 

The systems are available as development 

kits including adapted operating systems for 

rapid prototyping and are applicable for production 

use as well. Based on the miriac „MPX 

System on Module“-concept, custom designs 

offering flexible feature/performance configurations 

can be turned into production rapidly. 

With the P2020, P1022, P1013 and P1011 

CPUs, a variety of performance levels, from 

dual to single core functionality and graphics 

support are available. 

News ID 14959 


Concurrent: high performance 6U 

CompactPCI SBC 

Concurrent Technologies announces their latest 

high performance 6U CompactPCI Single 

Board Computer. The PP 81x/x9x is a single 

slot air-cooled Single Board Computer utilizing 

the 2nd generation Intel Core microarchitecture, 

based on 32nm process technology with 

the new Intel memory/graphics controller architecture 

integrated into the processor. The 

PP 81x/x9x supports the Intel Core i7-2715QE 

processor and the enhanced features of the 

Intel Series 6 Express chipset, along with up to 

8 Gbytes of DDR3-1333 ECC SDRAM. 

News ID 14957 

Hall-Stand 1-224, 1-306 

AAEON: slim, compact fanless controller 

with Atom D525 

AAEON has released a new fanless controller 

with the Intel Atom D525 processor: AEC- 

6612 Rev.B. This embedded controller has a 

storage temperature of -20~70°C and an operating 

temperature of -20~60°C for the ability 

to thrive in diverse environments. The AEC- 

6612 Rev.B encompasses the Intel ICH8M 

chipset and features up to six USB 2.0 ports, 

six COM ports, one power switch, one SYS 

LED, one HDD LED and one CompactFlash 

slot for copious connectivity options. 

News ID 14946


Hall-Stand 1-460, 5-340 

Kontron: 10-core out-of-the-box DPI AMC module with 

Cavium OCTEON II 

Kontron announces that the second generation of the Kontron AMC 

Packet Processor module AM4211 for MicroTCA platforms is now 

available with the Cavium 10-core OCTEON II cn6645 series. For 

telecom equipment manufacturers, this AMC module represents a 40 

percent increase in performance for any new designs of security and 

Deep Packet Inspection, network applications for SNOW 3G and KA- 

SUMI, TCP/IP packet processing acceleration and QoS that are integrated 

into eNodeB base stations and other types of network security and test 

and measurement applications for LTE networks. 

News ID 14941 


PEAK-System: CAN for PCI Express Mini 

For especially compact computers with PCI Express Mini slots, like 

notebooks or small-scale industrial PCs, PEAK-System introduces the 

suitable CAN interface PCAN-miniPCIe at embedded world 2012 in 

Nuremberg. The small-sized card of about three by five centimeters 

contains one or two High-speed CAN channels (ISO 11898-2) each 

galvanically isolated against the PC electronics. The 9-pin D-Sub plugs 

for CAN are connected to the card by space-saving cables. Like all CAN 

interfaces of the PCAN series, the PCAN-miniPCIe comes with the 

CAN monitor PCAN-View for Windows and the programming interface 

PCAN-Basic. Device drivers are available for Windows 7/Vista/XP and 

Linux, each in 32-bit and 64-bit editions. 

News ID 14939 



Softing: CAN interface with USB access 

For the first time Softing is presenting its product “CANpro USB embedded” 

at the exhibition embedded world 2012. This powerful interface 

for accessing CAN and CANopen networks uses USB High Speed and 

provides high data throughput and very short reaction times. The 

CANpro USB embedded is specifically designed for embedded applications 

and therefore does not require a housing. 

News ID 14947 


Advanced Digital Logic changes name to ADL 

Embedded Solutions 

Today Advanced Digital Logic are changing company name to ADL 

Embedded Solutions. This name change is due to a significant expansion 

in the product lines, System Design and Integration Service capabilities, 

including enclosures, cabling and thermal solution design and our 

value-added services to our embedded customers. ADL Embedded Solutions 

will continue to operate in its current structure, contact email 

addresses and the website will remain the same. The name change will 

also be extended to the German Subsidiary, which will be named ADL 

Embedded Solutions. 

News ID 14932 

Hall-Stand 4-342, 5-341 

TI: ultra-low power MCU with integrated LCD controller 

Texas Instruments introduced its lowest cost microcontroller with an 

integrated LCD controller. Based on TI’s MSP430 ultra-low power 

MCU core, the AFE4110 delivers 16-bit processing power, built-in LCD 

driver, low power and low cost, while operating on a single 1.5-V 

battery. Along with cost-effectiveness and ultra-low power, the AFE4110 

features 16-kB ROM, 512-B RAM, a 4- x 12-segment LCD driver with 

charge pump, a high-accuracy oscillator, and additional features designed 

for digital thermometers, pedometers, thermostats and portable single 

alkaline battery devices. 

News ID 14931 


MSC: cost and power-efficient COM Express modules with 

Celeron 

The MSC has expanded its CXB-6S COM Express module family based 

on second generation Intel Core processors with two cost-efficient 

Intel Celeron CPU variants. The new boards almost reach the pricing 

level of Intel Atom and ARM based solutions. The new embedded 

modules integrate the Intel HM65 PCH chipset and the Intel Celeron 

processor 827E with one core (1.4GHz) or the dual-core Intel Celeron 

processor 847E with 1.1GHz clock frequency. 

News ID 14923 

Hall-Stand 1-112, 4-240 

Apacer: industrial-grade MicroSDHC memory card with 

up to 16GB 

Apacer launches the first industrial-grade MicroSDHC memory card 

featuring the capacity of up to 16GB. One of the highlights is its 

firmware and major components that can be fixed right after customer’s 

recognition and validation. This reduces the risk of out-of-stock and 

compatibility issues by providing customers stable supply and high reliability. 

Apacer’s industrial-grade MicroSDHC memory card is compliant 

with SD 3.0 Specification and supports Class 10 high-speed transmission. 

News ID 14922

Hall-Stand 1-306, 1-516 

Swissbit presents storage solutions for 

Industrial applications at embedded 

world 

At embedded world, Swissbit will present its 

industrial DRAM memory modules in COB 

and SMT, available in DRAM, SDRAM, DDR, 

DDR2 und DDR3 technology. The Flash industrial 

products include CompactFlash, CFast 

Serial Flash, MultiMedia Cards, Secure Digital 

Cards, Solid State Drives and USB products. 

Customized for the industrial market, the 

Swissbit memory solutions combine a long 

life time, high reliability, excellent vibration 

and shock tolerance, extended temperature 

range and long life cycle with a controlled Bill 

of Material. 

News ID 14913 


Axiomtek: DIN-rail fanless embedded 

system with 2-port isolated CAN bus 

Axiomtek will be releasing a brand new 

rBOX103 DIN-rail fanless embedded system 

with CAN Bus connections utilizing the lowpower 

Intel Atom processors Z510PT (1.1 

GHz) and Z520PT (1.33 GHz), Intel 

US15WPT chipset and 2 GB DDR2 system 

memory. Designed with two CAN 2.0 A/B 

interfaces, the rBOX103 is ideal for CANbased 

applications that need high-speed 

transmission and efficient error detection 

mechanisms. The rugged rBOX103 comes 

packaged in a robust IP30 housing and is 

designed to withstand temperatures ranging 

from -40 to +70°C for use in extremely cold 

or hot environments. 

News ID 14920 


Vector: model-based E/E development 

from concept to production readiness 

Vector Informatik and aquintos have extended 

PREEvision to an integrated development platform 

for the entire E/E product development 

process. To further increase efficiency in automotive 

E/E development, the current Version 

5.0 implements such aspects as requirements 

management, hazard and risk analysis (ISO 

26262), AUTOSAR support, Simulink integration, 

life cycle management and file management. 

News ID 14912 


Green Hills: major new release of 

INTEGRITY real-time operating system 

Green Hills Software has announced a major 

new release of its flagship INTEGRITY realtime 

operating system. INTEGRITY 11 provides 

a new, highly optimized communications mechanism 

called GIPC (Green Hills IPC). GIPC is 


five times faster than Linux AF_LOCAL sockets. 

Native INTEGRITY, as well as Linux processes, 

executing in virtual machines, can take advantage 

of the super fast GIPC. Together with its 

support for POSIX APIs and higher-level middleware 

such as DDS and CORBA, INTEGRITY 

provides a wide variety of high performance 

communications mechanisms for developers. 

News ID 14926 

Hall-Stand 1-306 , 4A-314 

Toshiba: Super Speed USB 3.0-compliant 

USB Flash memory 

At CES 2012, Toshiba will be demonstrating 

the latest additions to its lineup of flash memory 

offerings – the TransMemory-EX series of 

USB flash memory products. The new drives 

are compliant with the new USB 3.0 standards. 

Initial storage capacities include a 32GB model 

and a 64GB model. Utilizing Toshiba’s Double 

Data Rate NAND, the new products offer maximum 

data transfer rates of 220 MB/sec for 

reading and 94 MB/sec for writing- or 22 

times and 18 times faster transfer rates, 

respectively, when compared with Toshiba’s 

previous models. 

News ID 14927 


Microchip: PIC24F MCUs feature 150 

µA/MHz active current 

Microchip announces the expansion of its eXtreme 

Low Power microcontrollers with the 

PIC24F ‘GA3’ family. The ‘GA3’ devices feature 

150 microamperes/MHz active current, as well 

as six DMA channels, which allow a routine to 

be executed with less power consumption and 

increased throughput. The family demonstrates 

the continual advancement of Microchip’s 

XLP technology and adds a new low-power 

sleep mode with RAM retention down to 330 

nA. Additionally, these are the first PIC MCUs 

with VBAT for battery backup of the on-chip 

Real-Time Clock Calendar. 

News ID 14917 


Softing: wireless module for process 

automation 

Softing’s WirelessHART Module WD-H is an 

ideal choice for integrating wireless data transmission 

into existing field devices allowing 

manufacturers to develop a new WirelessHART 

field device that covers all requirements of 

today’s process automation market. The WD- 

H teams proven hardware, based on standard 

components, with a fully tested protocol stack. 

The small form-factor enables device vendors 

to integrate this module into the majority of 

field devices available today. 

News ID 14944 

55 February 2012


Hall-Stand 1-434, 4A-309 

Freescale extends i.MX 6 series with eReader product 

and dual-core device 

Freescale’s extends its flagship i.MX 6 series with two new products. 

The new i.MX 6SoloLite processor is designed specifically for nextgeneration 

eReaders and is the follow-on to Freescale’s i.MX508 

device. The new dual-core i.MX 6DualLite product delivers multiprocessing 

performance at cost-effective price points, targeting a 

broad array of smart devices and products including tablets, IPTVs, 

IP phones, medical patient monitoring systems and home energy 

management solutions. 


News ID 14911 

DFI: fanless embedded computer features dual 

independent 1080p HD display support 

DFI launches a new compact design system, DS910-CD, offering low 

power consumption and fanless cooling for digital signage applications. 

This embedded system is powered by the 1.60GHz dual-core Intel 

Atom processor N2600 and Intel NM10 I/O Express chipset with 5W 

system TDP. The low-profile chassis is constructed of heavy duty 

steel with an extruded aluminum top cover providing silent passive 

cooling. A single 12VDC power input reduces power supply cost and 

complexity for both stationary AC powered applications and mobile 

battery powered applications. 

News ID 14907 


IBASE: compact fanless system supports wide-range 

temperature 

IBASE Technology announces its RSB200-884T ruggedized fanless 

solution designed for thermally constrained environments in outdoors, 

automation and industrial sectors. The compact rugged embedded 

computer comes with a 3.5-inch SBC supporting the low-power Intel 

Atom Z520PT 1.33GHz processor with an extended temperature 

range of -30 to +70°C for use in extreme operating environments. 

News ID 14895 


Lattice: transfer of its SMD product portfolio to 

Arrow Electronics 

Lattice Semiconductor announced the transfer of its Standard Military 

Drawing (SMD) product portfolio to Arrow Electronics, effective immediately. 

Lattice’s SMD products include the GAL family (GAL16V8, 

GAL20V8 and GAL22V10) of simple PLDs and the ispLSI1000 family 

(ispLSI 1016, ispLSI 1024, ispLSI 1032 and ispLSI 1048) of complex 

PLDs. Lattice’s SMD products were formally discontinued by Lattice 

via its Product Change Notification (PCN) process in 2011. 

News ID 14898 


Agilent: handheld oscilloscopes for industrial applications 

Agilent Technologies announces the addition of two new oscilloscopes 

to its portfolio of handheld instruments. The 100-MHz U1610A and 

200-MHz U1620A – the first handheld units to include a color VGA 

display – will be available for ordering on Feb. 1. With up to three 

viewing modes (indoor, outdoor and night vision), these instruments 

enable engineers to view signal waveforms by zooming in to capture 

glitches under all lighting conditions. 

News ID 14903 

February 2012 56


VIA: Mini-ITX Embedded platform for 

POS and kiosks 

VIA Technologies announces the VIA VB7009 

embedded Mini-ITX board. Measuring only 

17 x 17cm, the VIA VB7009 Mini-ITX is an 

extremely flexible embedded board with top 

class functionality and performance for POS 

and kiosks. The VB7009 is a cost effective solution 

offering a broad range of power efficient 

VIA CPU choices, including the dual core VIA 

NanoTM X2 processor, providing superior 

flexibility to match customers’ embedded computing 

needs. Paired with the VIA VX900 unified 

all-in-one media system processor, the 

VIA VB7009 Mini-ITX embedded board delivers 

a highly optimized platform that boasts 

stunning HD video performance of the most 

demanding video formats at resolutions of up 

to 1080p. 

News ID 14897 

Hall-Stand 2-422 , 2-426 

IEI: 3.5” embedded SBC with Atom 

N2600 and D2700 

IEI Technology announces the launch of the 

WAFER-CV-N2600x/D2700x. This 3.5” embedded 

computer board is based on new options 

for the Intel Atom processor N2600 and 

D2700 series. The WAFER-CV-N26001/D27001 

supports resolutions up to 2560 x 1600 with 

the Chrontel CH7511 DP to LVDS converter. 

It has an operating temperature range of - 

20 ~ 70 . IEI’s WAFER-CV-N26001/D27001 

embedded computer board includes an Intel 

Atom processor N2600 or D2700 with the 

Intel NM10 Express chipset. It features low 

power consumption, UEFI speedy boot-up, 

SO-DIMM DDR3 support, high resolution 

via VGA & DP, 12 V only power supply and 

mSATA SSD storage. 

News ID 14894 


LDRA has integrated its tool suite with 

NI LabVIEW 

LDRA has integrated its tool suite with NI 

LabVIEW Virtual Instruments. The LDRA-NI 

solution offers HIL simulation, a technique 

used to develop and test the complex realtime 

embedded systems commonly found in 

military and aerospace designs. The integration 

with the LDRA tool suite ensures that full 

software analysis is applied to the systems 

under test on the simulated target hardware. 

With the ability to test software systems up to 

DO-178 Level A, LDRA includes code standards 

enforcement, structural coverage analysis including 

modified condition/decision (MC/DC), 

object code coverage, unit testing, data and 

control coupling, and requirements traceability. 

News ID 14891 



Rutronik: LED from Osram with 

80 percent higher output 

The new Power Topled with lens (SFH 

4258S/4259S) from OSRAM Opto Semiconductors 

has an 80 percent higher optical output 

than the standard version of the infrared LED 

– despite the same surface area and the same 

current. This boost comes from a special thinfilm 

chip which, thanks to Nanostack technology, 

has not just one but two p-n junctions 

that are grown one on top of the other. The 

resultant increased range will above all benefit 

applications in the security sector and in 

gesture recognition. The new Power Topled is 

now available at distributor Rutronik. 

News ID 14904 


MEN: ESMexpress COM with PowerPC 

QorIQ 

MEN’s latest computer-on-module complying 

with ANSI-VITA 59 (standard in preparation) 

excels by its extremely high performance in 

addition to the usual ruggedness and flexibility 

of the ESMexpress standard. The XM51 is 

equipped with processors of the Freescale 

PowerPC QorIQ family, with up to 8 processor 

cores featuring up to 1.5 GHz being accommodated 

on the space-saving form factor. 

Based on the QorIQ P4080, P4040 or P3041 

at clock frequencies between 1.2 and 1.5 GHz, 

the XM51 takes the performance and speed 

of common computer-on-modules to a new 

level. Paired with the robust and space-saving 

design of ESMexpress modules from MEN, 

this powerful CPU is the perfect basis for 

safety-critical and demanding applications, 

especially in avionics, railways and medical 

engineering. 

News ID 14885 


NORCO: Mini-ITX motherboard with 

Atom N2800 and D2700 

NORCO announced an ultra low power mini- 

ITX motherboard named “MITX-6930” for 

industrial and embedded applications. This 

MITX-6930 brings the newly released Intel 

Atom processors to the Mini-ITX motherboard 

using either the 1.86GHz dual-core Intel Atom 

processor N2800 or the 2.13 GHz dual-core 

Intel Atom processor D2700. Those two new 

processors not only feature an improved graphics 

core but also feature Intel’s 32nm process 

technology, 2×512KB L2 cache and DDR3 

system memory with up to 4GB support. Both 

processors are dual-core with Intel Hyper- 

Threading Technology support up to four 

threads, resulting in greatly improved system 

performance. 

News ID 14901 

57 February 2012

Hall-Stand 2-420, 2-110, 5-340 

Advantech to present industrial grade 

digital signage solutions 

Advantech delivers industrial-grade reliability 

which is ideal for mission-critical digital signage 

deployment where 24x7x365 availability is the 

key. The standard life-cycle of Advantech’s industrial 

grade digital signage systems is five 

years hence offering predictability and ease for 

managing network operations. Advantech is 

also flexible in terms of product configurations, 

pre-installing images and operating systems 

support such as Linux and Windows Embedded. 

News ID 14872 


Cypress: PSoC Creator 2.0 design 

environment available to all users 

Cypress Semiconductor announced that Version 

2.0 of its PSoC Creator Design Environment 

for the PSoC 3 and PSoC 5 programmable 

system-on-chip families is available for 

free download for all users. Among the hundreds 

of feature enhancements, PSoC Creator 

2.0 introduces support for the production 

PSoC 5 ARM architecture and devices as well 

as enabling customers to interoperate with 

the popular and powerful Keil µVision 4 IDE. 

News ID 14869 


ADLINK commits to ARM development 

by joining new COM initiative 

ADLINK announces it will support the new 

Computer-on-Module standard from Kontron 

for ultra low-power embedded architecture 

platforms with a whole new line of products. 

Building on our design experience with 

ARM/RISC in OEM and Intelligent Display 

projects, this marks ADLINK’s first endeavor 

outside x86 boundaries for a standard form 

factor product offering. 

News ID 14864 


Microsemi announces Libero SoC v10.0 

integrated design environment 

Microsemi announced the release of Libero 

SoC v10.0. The new version of the Libero IDE 

offers system-on-chip designers several new 

features, including improved ease-of-use, increased 

integration of the embedded design 

flow and a “pushbutton” design capability. 

Libero SoC v10.0 builds upon Microsemi’s 

expertise in embedding ARM microcontrollers 

with flash-based FPGAs, enabling a fully integrated 

embedded design flow for SmartFusion 

customizable SoC customers. The new IDE 

also supports Microsemi’s IGLOO, ProASIC 3 

and Fusion product families. 

News ID 14865 



Axiomtek rolls out AMD G-Series APU 

powered Pico-ITX SBC 

Axiomtek released PICO100, a new supercompact, 

low-power Pico-ITX SBC powered 

by either a single core AMD G-Series APU 

T40R at 1.0GHz or a dual core T40E at 1.0 

GHz paired with the Fusion Controller Hub 

A50M chipset. One onboard SO-DIMM socket 

supports up to 4GB of DDR3 1066 memory. 

Integrated with Radeon HD 6250 graphics 

controller with DirectX 11 support, the 

PICO100 offers advanced 3D graphics and 

supports multiple displays via DisplayPort or 

VGA and 18-bit single channel LVDS panel. 

News ID 14863 


Green Hills and SafeNet: security 

technology collaboration agreement 

Green Hills Software and SafeNet announce a 

new alliance focused on the creation of trusted 

platform solutions for the embedded and mobile 

markets. The integrations include the support 

and integration of SafeNet portable smart 

card-based devices with Green Hills Software’s 

INTEGRITY Multivisor technology, and the 

use of SafeNet Hardware Security Modules 

with Green Hills Software’s managed security 

services offerings. The integrations enable secure 

communications, data protection, and 

authentication on embedded and mobile devices, 

such as smartphones. The integration of 

SafeNet’s and Green Hills Software’s solutions 

provides a flexible and powerful technology 

solution for some of the world’s most challenging 

security problems such as Bring Your 

Own Device: a consumer handheld that can 

be used in the enterprise, guaranteeing both 

enterprise data protection as well as consumer 

privacy. 

News ID 14859 


Atollic achieves full Energy Micro EFM32 

family support 

Atollic announces its TrueSTUDIO for ARM 

C/C++ development tool now supports the 

Giant Gecko and Leopard Gecko series of 

ARM-based microcontroller devices from Energy 

Micro. Atollic TrueSTUDIO now supports 

all currently available Energy Micro EFM32 

Cortex-M3 families, including 160 devices in 

the Tiny Gecko, Gecko, Giant Gecko and Leopard 

Gecko families. The Atollic TrueSTUDIO 

project wizard can auto-generate example projects 

for Energy Micro EFM32 evaluation 

boards, providing a true “out-of-the-box” experience 

that enables developers to quickly 

get up-and-running with new C/C++ projects 

on Energy Micro EFM32 boards. 

News ID 14849 

59 February 2012



Microchip: 3-phase BLDC fan motor 

driver 

Microchip announces the expansion of its sinusoidal, 

sensorless, 3-phase BLDC fan motor 

driver portfolio with the MTD6505, the industry’s 

first and only standalone, resistorprogrammable 

driver that enables the selection 

of multiple back-EMF coefficient ranges. This 

unique feature allows engineers to design for 

a wide variety of 3-phase BLDC fan characteristics 

with a single cost-effective and flexible 

device, thus saving time and money by standardising 

multiple product lines on one driver 

and very few external components. 

News ID 14856 


PLS: complete debug and test solution 

for Development Device 

PLS Programmierbare Logik & Systeme now 

introduces its Universal Debug Engine 3.1.7. 

The UDE version 3.1.7 provides an effective 

debug and test solution for the first implementation 

of the multicore architecture, the 

Development Device, which is available to selected 

customers for evaluation and prototyping. 

The tool enables the control and monitoring 

of the three 32-bit TriCore cores within 

a single user interface. 

News ID 14851 


Sharp expands its line-up of memory 

LCDs 

Sharp is getting ready to start the new year 

with three new models from its range of Memory 

LCDs. This means the portfolio of ultralow 

power displays will now include 13 different 

types with diagonals of 2.97 cm to 15.3 cm. 

The new 11.09 cm LS044Q7DH01 Memory 

LCD has a QVGA resolution of 320 x 240 

pixels. The high level of reflectivity of 17.5% 

and the viewing angle of 120° in all directions 

ensure good readability, even with very low 

ambient lighting. 

News ID 14848 


Bayer: Corelis adds JET support for 

TI Sitara ARM MCUs 

Corelis announces ScanExpress JET support 

for Texas Instruments Sitara ARM Cortex-A8 

and ARM9 microprocessors, specifically the 

AM37x, DM37x, and AM18x families. ScanExpress 

JTAG Embedded Test (JET) is a test 

methodology providing at-speed testing of 

embedded processor-based electronic printed 

circuit boards and systems to detect, isolate, 

and diagnose structural and functional defects 

while minimizing test development time and 

resource investment. ScanExpress JET utilizes 

a processor’s JTAG debug port to download 

and command execution of microprocessor 

coded test steps which enable at-speed functional 

testing of the processor and all major 

peripheral interfaces. 

News ID 14846 


VIA announces Android support for 

embedded x86 boards 

VIA Technologies announces Android support 

for VIA x86 embedded platforms, starting with 

support for the VIA EITX-3002 Em-ITX board. 

Running Android on an x86 platform offers 

increased flexibility, great multimedia support 

and cost saving advantages for embedded applications 

such as in-vehicle entertainment and 

interactive kiosks. Key advantages for Android 

on x86 include leverage of Android development 

resources and existing apps, rich I/O flexibility, 

greater CPU performance as well as higher 

display resolutions of up to 1920 x 1080. 

News ID 14873 


CMX: Embedded SSL/TLS for TCP/IP 

networking 

CMX Systems offers the small footprint 

SSL/TLS Add-On option for CMX’s deployed 

CMX-MicroNet and CMX-TCP/IP stacks. The 

SSL/TLS option provides server and client 

support, crypto and hash functions including 

RSA, 3DES, AES, ARC4, SHA1, SHA2, MD2, 

MD4 and MD5, X.509 certification processing, 

signing and verification, as well as self-test 

support for integration, test and compatibility 

verification. The SSL/TLS Add On option also 

provides the designer with the ability to use a 

subset of the above protocols to reduce memory 

if necessary. 

News ID 14840 


SEGGER: embedded software suite supports 

Energy Micro’s Cortex-M3 Gecko MCUs 

SEGGER Microcontroller and Energy Micro 

announce that SEGGER’s embedded middleware 

suite now supports Energy Micro’s range 

of ultra low energy ARM Cortex-M3 based 

EFM32 Gecko microcontrollers. The comprehensive 

feature-rich software suite from SEG- 

GER delivers an easy-to-use environment for 

embedded systems development, offering exceptionally 

low memory requirements, which 

minimizes Bill-of-Materials costs and enables 

significantly reduced power consumption overall. 

The middleware’s high performance also 

enables lower clock speed to further reduce 

system power consumption. 

News ID 14834 


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Hall-Stand 4A-122, 4A-211 

SiLabs: new MCUs extend battery life in 

wireless embedded systems 

Silicon Laboratories introduced the new 

C8051F96x MCU and Si102x and Si103x wireless 

MCU families, based on patented lowpower 

technology that enables 40 percent less 

system current draw and up to 65 percent 

longer battery life than competing MCU solutions. 

Silicon Labs has designed the new F96x 

8-bit MCUs with ultra-low power and wireless 

connectivity requirements in mind. 


News ID 14838 

Xilinx ships Zynq-7000 FPGAs with 

ARM dual-core Cortex-A9 

Xilinx announced its first Zynq-7000 Extensible 

Processing Platform shipments to customers. 

For systems that need to support applications 

which require high, real-time performance, 

the Zynq-7000 EPP delivers levels of performance 

that go beyond what traditional processing 

solutions can implement. Emulation platforms, 

hardware development tools, Open Source 

Linux support and the recently announced 

Extensible Virtual Platform developed jointly 

with Cadence Design Systems, Inc. all help to 

make developing and implementing Zynq- 

7000 EPP systems possible. A growing list of 

OS support is adding to an expanding ecosystem 

offering embedded tool and software development 

solutions. 

News ID 14843 


Atmel broadens portfolio with 13 new 

32-bit MCUs in 3 different product series 

Atmel releases 13 new devices in 3 different 

product series in its 32-bit AVR UC3 product 

portfolio. The AVR UC3 microcontrollers feature 

high performance, DSP instructions, USB 

connectivity, secure encryption and capacitive 

touch support. In addition to new devices in 

the existing UC3 L and UC3 A Series, a new 

UC3 D Series of MCUs is now available. 

News ID 14837 


Express Logic: ThreadX RTOS adds 

support for Xilinx Zynq-7000 EPP 

Express Logic announced that its ThreadX 

RTOS now supports Xilinx’s Zynq-7000 Extensible 

Processing Platform. ThreadX is a 

small-footprint, high-performance, royaltyfree 

RTOS with efficient real-time responsiveness. 

With sub-microsecond context switching, 

and service times of 100-200 cycles, ThreadX 

easily supports the demands of embedded system 

devices. ThreadX also offers a rich ecosystem 

of complementary development tools, 


including the Xilinx ISE Design Suite for the 

Zynq-7000 EPP. ThreadX also supports other 

Xilinx embedded processing solutions, including 

the MicroBlaze soft processor and Virtexclass 

FPGA devices with embedded PowerPC 

processors, using this same tool suite. 

News ID 14841 


dresden elektronik: USB radio stick as 

smart wireless solution 

dresden elektronik presents its compact radio 

module with USB interface and FCC certification 

for 2.4 GHz frequency which is usable 

worldwide. The USB radio stick easily connects 

a computer with a IEEE 802.15.4 based wireless 

sensor network. For instance as a virtual serial 

interface the radio stick allows the computeraided 

control of a wireless network. Individual 

nodes can be easily activated, parameterized 

and the complete network communication 

coordinated. 

News ID 14807 

Hall-Stand 4-342, 5-341 

TI: qualification of MSP430 MCUs for 

automotive applications 

Texas Instruments announces the qualification 

of MSP430 16-bit microcontrollers for automotive 

applications. The AEC-Q100 certification 

allows developers to integrate higher performance, 

power efficiency and scalability into 

their designs without sacrificing on price. Automotive 

systems designers now have access 

to more than 50 MSP430 Value Line microcontrollers 

for use in applications including 

interior cabin motors, capacitive touch, infotainment 

systems and remote keyless entry. 

News ID 14803 


MSC: ruggedized TFT displays suitable for 

challenging applications 

Hitachi has announced the introduction of 

a new line-up of Rugged+ TFT LCD display 

modules specifically intended for use in extreme 

environment applications. These robust 

displays have been designed and developed 

to operate in demanding industrial and harsh 

environmental conditions. Hitachi’s Rugged+ 

TFT displays are designed for high reliability 

medical, marine, aerospace, automotive and 

industrial applications. Some of the new 

modules feature Hitachi’s IPS-Pro TFT technology 

which provides outstanding image 

quality when viewed at any viewing angle. 

IPS-Pro also provides exceptional color saturation, 

color stability, contrast and black 

levels with a 175° wide vertical and horizontal 

viewing angle. 

News ID 14802 

61 February 2012



Altera: FPGAs optimised for wireless, 

broadcast and military applications 

Altera Europe has started shipping its 28-nm 

ArriaV FPGAs. The Arria V devices are low 

power midrange FPGAs available with 10.3125- 

Gbps transceiver technology. The family’s innovative 

features allow designers to tailor their 

low power, high bandwidth , and low cost requirements 

for next-generation systems in the 

wireless, broadcast and military markets. The 

Arria V family is developed on TSMC’s 28nm 

Low Power process and offers the lowest 

total power, lowest static power, and lowest 

transceiver power of any midrange FPGA family, 

consuming up to 40% less power compared 

to previous generation devices 

News ID 14801 

Hall-Stand 2-422 , 2-426 

IEI: fanless embedded system with 

i7/i5/i3 processor 

IEI Technology releases a high performance 

fanless embedded system with 2nd generation 

Intel Core i7/i5/i3 processor, the TANK-700- 

QM67, featuring on-board 2GB DDR3 memory 

and one DDR3 SO-DIMM slot supporting 

up to 4 GB memory. The TANK-700-QM67 

possesses the Intel HD graphics engine supporting 

H.264/AVC-MPEG2/VC1, DirectX 10.1 

and OpenGL 3.0. The TANK-700-QM67 is 

characterized by its 8-channel audio/video 

capturing capability which is suitable for surveillance 

systems and transportation intelligent 

scheduling systems. 

News ID 14799 


NI: PXI Express system expansion 

modules 

National Instruments introduced two system 

expansion options for creating multichassis PXI 

Express systems. The NI PXIe-8364 and NI 

PXIe-8374 are the first NI PXI Express remote 

control modules that make it possible for engi- 

neers to directly interface multiple PXI Express 

chassis to a single host computer using any expansion 

topology, without requiring complex 

custom solutions. The modules’ simplified interconnectivity 

and industry-standard PXIbased 

architecture help increase system design 

efficiency and overall system performance in a 

variety of high-channel-count data acquisition 

and high-speed automated test applications 

including RF and semiconductor test. 

News ID 14795 


Altium collaborates with Altera on 

component resources and software support 

Altium announces new devices and updates 

to the board-level components from Altera’s 

Stratix IV FPGA and MAX V CPLD device 

families available in its online content delivery 

ecosystem. Developed in collaboration with 

Altera, the updated collection of FPGA and 

CPLD components add to the extensive range 

of Altera design content already available 

through AltiumLive. The new components 

are available through the AltiumLive portal 

from within Altium Designer, providing designers 

with access to current, high quality 

board-level components during the design 

process. 

News ID 15036 

Hall-Stand 4-342, 5-341 

TI: signal conditioners drive high-speed 

interface standards 

Texas Instruments introduced 10 signal conditioners 

designed to drive high-speed interface 

standards such as 10G/40G/100G Ethernet, 

10G-KR (802.3ap), InfiniBand, Fibre Channel 

and CPRI. The new integrated circuits join a 

comprehensive family of repeaters and retimers 

that combat signal impairments caused by insertion 

loss, jitter, reflections and crosstalk in 

high-speed enterprise servers, routers and 

switches. 

News ID 15033 

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