Rectifier diodes Schottky barrier

Philips Semiconductors
Rectifier diodes
Schottky barrier
Product specification
BYV116, BYV116B series
FEATURES SYMBOL QUICK REFERENCE DATA
• Low forward volt drop
• Fast switching
• Reverse surge capability
• High thermal cycling performance
• Low thermal resistance
a1
a2
1 3
k 2
V R = 20 V/ 25 V
I O(AV) = 10 A
V F ≤ 0.54 V
GENERAL DESCRIPTION
Dual schottky rectifier diodes intended for use as output rectifiers in low voltage, high frequency switched mode power
supplies.
The BYV116 series is supplied in the SOT78 (TO220AB) conventional leaded package.
The BYV116B series is supplied in the SOT404 surface mounting package.
PINNING SOT78 (TO220AB) SOT404
PIN DESCRIPTION
1 anode 1 (a)
2 cathode (k) 1
3 anode 2 (a)
tab
tab
2
tab
cathode (k)
123
1 3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
BYV118- 20 25
BYV116B- 20 25
V RRM Peak repetitive reverse - 20 25 V
voltage
V RWM Working peak reverse - 20 25 V
voltage
V R Continuous reverse voltage T mb ≤ 124 ˚C - 20 25 V
I O(AV) Average rectified forward square wave; δ = 0.5; T mb ≤ 123 ˚C - 10 A
current (both diodes
conducting)
I FRM Repetitive peak forward square wave; δ = 0.5; T mb ≤ 123 ˚C - 10 A
current per diode
I FSM Non-repetitive peak forward t = 10 ms - 50 A
current per diode t = 8.3 ms - 55 A
sinusoidal; T j = 125 ˚C prior to
surge; with reapplied V RRM(max)
I RRM Peak repetitive reverse pulse width and repetition rate - 1 A
surge current per diode limited by T j max
T j Operating junction - 150 ˚C
temperature
T stg Storage temperature - 65 175 ˚C
1. It is not possible to make connection to pin 2 of the SOT404 package.
March 1998 1 Rev 1.000

Philips Semiconductors
Rectifier diodes
Schottky barrier
Product specification
BYV116, BYV116B series
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R th j-mb Thermal resistance junction per diode - - 4 K/W
to mounting base both diodes - - 3.5 K/W
R th j-a Thermal resistance junction SOT78 package, in free air - 60 - K/W
to ambient SOT404 package, pcb mounted, minimum - 50 - K/W
footprint, FR4 board
ELECTRICAL CHARACTERISTICS
All characteristics are per diode at T j = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V F Forward voltage I F = 5 A; T j = 125˚C - 0.47 0.54 V
I F = 10 A; T j = 125˚C - 0.66 0.77 V
I F = 5 A - 0.58 0.64 V
I R Reverse current V R = V RWM - 0.05 3 mA
V R = V RWM ; T j = 100˚C - 5 10 mA
C d Junction capacitance V R = 5 V; f = 1 MHz, T j = 25˚C to 125˚C - 160 - pF
March 1998 2 Rev 1.000

Philips Semiconductors
Rectifier diodes
Schottky barrier
Product specification
BYV116, BYV116B series
5
4
3
Forward dissipation, PF (W)
Vo = 0.31 V
Rs = 0.046 Ohms
0.1
0.2
BYV116
0.5
Tmb(max) / C
130
D = 1.0
134
138
IR / A
100mA
150 C
10mA
125 C
100 C
1mA
BYV116
2
1
I tp
D =
t
T
0
150
0 1 2 3 4 5 6 7 8
Average forward current, IF(AV) (A)
Fig.1. Maximum forward dissipation P F = f(I F(AV) ) per
diode; square current waveform where
I F(AV) =I F(RMS) x √D.
tp
T
142
146
100uA
10uA
75 C
50 C
Tj = 25 C
1uA
0 5 10 15 20 25
VR / V
Fig.4. Typical reverse leakage current per diode;
I R = f(V R ); parameter T j
5
4
3
Forward dissipation, PF (W)
Vo = 0.31 V
Rs = 0.046 Ohms
4
2.8
BYV116
2.2
Tmb(max) / C
130
1.9
a = 1.57 134
138
Cd / pF
1000
BYV116
100
2
142
1
146
0
150
0 1 2 3 4 5
Average forward current, IF(AV) (A)
Fig.2. Maximum forward dissipation P F = f(I F(AV) ) per
diode; sinusoidal current waveform where a = form
factor = I F(RMS) / I F(AV) .
10
1 10 100
VR / V
Fig.5. Typical junction capacitance per diode;
C d = f(V R ); f = 1 MHz; T j = 25˚C to 125 ˚C.
IF / A
10
Tj = 25 C
Tj = 125 C
8
BYV116
10
1
Transient thermal impedance, Zth j-mb (K/W)
6
typ
max
0.1
4
2
0.01
P
D
tp
D =
T
tp
0
0 0.2 0.4 0.6 0.8 1
VF / V
Fig.3. Typical and maximum forward characteristic
I F = f(V F ); parameter T j
t
T
0.001
1us 10us 100us 1ms 10ms 100ms 1s 10s
pulse width, tp (s) PBYR325CTD
Fig.6. Transient thermal impedance; per diode;
Z th j-mb = f(t p ).
March 1998 3 Rev 1.000

Philips Semiconductors
Rectifier diodes
Schottky barrier
Product specification
BYV116, BYV116B series
MECHANICAL DATA
Dimensions in mm
Net Mass: 1.4 g
10.3 max
4.5 max
1.4 max
11 max
15.4
2.5
2.54 (x2)
MOUNTING INSTRUCTIONS
0.85 max
(x2)
Fig.7. SOT404 : centre pin connected to mounting base.
0.5
Dimensions in mm
11.5
9.0
17.5
2.0
3.8
5.08
Fig.8. SOT404 : minimum pad sizes for surface mounting.
Notes
1. Plastic meets UL94 V0 at 1/8".
March 1998 4 Rev 1.000

Philips Semiconductors
Rectifier diodes
Schottky barrier
Product specification
BYV116, BYV116B series
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
4,5
max
10,3
max
3,7
1,3
2,8
5,9
min
15,8
max
3,0 max
not tinned
1,3
max
(2x)
1 2 3
2,54 2,54
3,0
13,5
min
0,9 max (3x)
0,6
2,4
Notes
1. Refer to mounting instructions for SOT78 (TO220) envelopes.
2. Epoxy meets UL94 V0 at 1/8".
Fig.9. SOT78 (TO220AB); pin 2 connected to mounting base.
March 1998 5 Rev 1.000

Philips Semiconductors
Rectifier diodes
Schottky barrier
Product specification
BYV116, BYV116B series
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
© Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
March 1998 6 Rev 1.000