COM.0 R2.1 Errata - picmg

COM.0 Re
COM.0 Rev 2.1 Errata
July 27, 2012
Errata for PICMG COM.0 Revision 2.1
July 27, 2012
Erratum 001
Section 6.1 “Module Size – Mini Module”:
The sentence just above Figure 6-1, that reads “An independent, implementation specific set of holes
and spacers shall be used to attach the heat spreader to the Module” is incorrect. The accompanying
figure is reproduced here for reference and for context.
The corrected version of the sentence is: “An independent, implementation specific set of holes and
spacers may be used to attach the heat spreader to the Module”.
Rationale:
a) The Mini form factor is too small to practically implement a set of holes for thermal attachment
separate from the corner mounting holes. Most vendors do not implement separate thermal
attachment holes on the Mini form factor.
b) There was a clear decision by the COM.0 Rev.2.1 Subcommittee to relax the “shall”
requirement to “may”, but an editing oversight led to this erratum.
Erratum 002
Section 5.4.7 “DDI Loss Budget”:
COM.0 Rev. 2.1 Errata Page 1 of 1 July 27, 2012

COM.0 Re
COM.0 Rev 2.1 Errata
July 27, 2012
The graphics and empty table at the end of the section should be deleted. The correct graphic appears
at the beginning of the section and the routing requirements are in the bulleted list.
END
COM.0 Rev. 2.1 Errata Page 2 of 1 July 27, 2012