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Important bond types for grinding tools.<br />
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Sintered<br />
bonds<br />
Metal Ceramic Organic<br />
Galvanic<br />
bonds<br />
Sintered<br />
bonds<br />
(porcelain<br />
W\ SH<br />
Main groups<br />
Melted<br />
bonds<br />
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Magnesite,<br />
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silicate<br />
bonds (cold<br />
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3KHQRO<br />
resins<br />
+ LJ K<br />
temperature<br />
resins,<br />
polyimides<br />
Natural<br />
substances,<br />
VKHODF<br />
glue<br />
Epoxides<br />
Polyamides,<br />
Rubber<br />
polyester,<br />
acrylic<br />
resins<br />
Poly-<br />
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Metal<br />
Ceramic<br />
3KHQRO<br />
resins<br />
+ LJ K<br />
temperature<br />
resins,<br />
polyimides<br />
Organic<br />
Epoxides,<br />
polyamides,<br />
polyester<br />
Rubber<br />
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+<br />
+<br />
+ +<br />
+<br />
+<br />
LJ K Hardness Low<br />
LJ K Stiffness/dimensional stability Low<br />
LJ K Low Toughness LJ K<br />
Low Damping LJ K<br />
LJ K Resistance to temperature, coolant,<br />
environment<br />
Low<br />
Poor Good Profilability Good<br />
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contourfollowing<br />
Low <br />
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impact effect of grinding forces during<br />
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WKH grains remain in place and oscillate;<br />
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are displaced.<br />
Extreme case 1<br />
Hard<br />
bond<br />
Rigid<br />
Brittle<br />
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+ LJ K WHP SHUDWXUH UHVLVWDQFH<br />
Bond<br />
Effect of surge-type grinding<br />
forces<br />
Extreme case 2<br />
bond<br />
Soft<br />
Elastic<br />
7RXJ K<br />
+ LJ K GDP SLQJ<br />
Low temperature resistance<br />
cracks<br />
Fatigue cracks in<br />
bond web<br />
Low<br />
Damping<br />
Loosening of<br />
WKH SDUWLFOH<br />
+ LJ K<br />
Displacement<br />
+<br />
+ J J J<br />
1 RQH P LQ Particle displacement<br />
Relatively big<br />
Less<br />
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LJ KHU<br />
LJ K 6KDSH LYLQJ ULQGLQJ<br />
6KDSH DFFXUDF\ Low: VKDSH IRORZLQJ ULQGLQJ<br />
Examples:<br />
Ceramic Metal 3KHQRO UHVLQ<br />
Special resins<br />
Rubber<br />
HSR[ \ SRO\ HVWHU<br />
"Elastic"<br />
PU<br />
20