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Copyright Warning & Restrictions Th
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ABSTRACT SURFACE AND BULK PASSIVATI
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SURFACE AND BULK PASSIVATION OF MUL
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APPROVAL PAGE SURFACE AND BULK PASS
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Chuan Li, B.L. Sopori, P. Rupnowski
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ACKNOWLEDGEMENT The work presented
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TABLE OF CONTENTS (Continued) Chapt
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LIST OF TABLES Table Page 2.1 Posit
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LIST OF FIGURES (Continued) Figure
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LIST OF FIGURES (Continued) Figure
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2 percent; however, soon, more adva
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4 Figure 1.1 World solar module pro
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6 bond is called a hole. It too can
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8 Figure 1.4 The I-V characteristic
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10 First generation cells consist o
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12 Basically, materials for manufac
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14 Defects are generally categorize
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16 copper, or nickel in concentrati
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18 the SiNx:H layer during the ther
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CHAPTER 2 SILICON NITRIDE LAYER FOR
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22 reflectance of polished Si can b
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24 information is application-orien
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26 film fed growth (EFG) ribbon sil
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28 Figure 2.5 Deposition of SiΝ :
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30 Figure 2.6 shows the dependence
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32 atoms, the interface states are
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34 2.5 Bulk Passivation of Si by Si
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36 It was found that the bulk lifet
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CHAPTER 3 MODELING OF SURFACE RECOM
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40 Figure 3.2 Schematic diagram of
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42 σ and σp are the capture cross
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44 Qsi — charge density induced i
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47 Figure 3.5 The calculated depend
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- Page 70 and 71: 51 Na, sigma_n, sigma_p: enter x.xx
- Page 72 and 73: 53 Figure 3.7 Measured Seff(Δn) de
- Page 74 and 75: 55 curves converge to a single valu
- Page 76 and 77: 57 seen that, initially Ss decrease
- Page 78 and 79: 59 carrier recombination within the
- Page 80 and 81: 61 recombination in the SCR influen
- Page 82 and 83: 63 Figure 3.13 shows that: 1) after
- Page 84 and 85: CHAPTER 4 MINORITY-CARRIER LIFETIME
- Page 86 and 87: 67 Figure 4.1 Α photograph of QSSP
- Page 88 and 89: 69 work. The most convenient is 1 m
- Page 90 and 91: 7Ι dependence of the minority carr
- Page 92 and 93: 73 It was tempting to assume that l
- Page 94 and 95: 75 resistivities and lifetime) do n
- Page 96 and 97: 77 5.2 Objective An electronic mode
- Page 98 and 99: 79 Figure 5.2 is a photograph of a
- Page 100 and 101: 81 impurity-gettering methods which
- Page 102 and 103: 83 distribution of local currents a
- Page 104 and 105: 85 modeling. Wafers were selected f
- Page 106 and 107: 87 Figure 5.5 A comparison of (a) d
- Page 108 and 109: 89 alloying results in metallizatio
- Page 110 and 111: 91 (i) Defect clusters are the prim
- Page 112 and 113: 93 SiNX induced charge density on t
- Page 114 and 115: APPENDIX I PROGRAMS TO CALCULATE SR
- Page 116 and 117: 97 phin = -ΕΙ - 1 / beta * log(nd
- Page 120 and 121: 101 input "output file name {XXXXXX
- Page 122 and 123: 103 F (i) = (exp (beta * (phip - ph
- Page 124 and 125: APPENDIX III COMPUTATIONAL METHOD F
- Page 126 and 127: 107 where, dscr is the width of the
- Page 128 and 129: REFERENCES 1. E. Becquerel , C. R.
- Page 130 and 131: 44. L.L. Alt, S.W. Ing. Jr. and K.W
- Page 132 and 133: 90. B.L. Sopori, Y. Zhang, and N.M.