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Surface and bulk passivation of multicrystalline silicon solar cells by ...

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82<br />

characteristics <strong>of</strong> each local device using its local properties, <strong>and</strong> then calculate the<br />

influence <strong>of</strong> each local device on the entire device. This approach permits the calculation<br />

<strong>of</strong> the influence <strong>of</strong> any defect distribution on the total device performance, <strong>and</strong> can be<br />

applied to calculate the performance <strong>of</strong> the device without any defects, to determine<br />

losses introduced <strong>by</strong> various defect distributions. This formalism can be easily<br />

incorporated into the Network Model developed for an inhomogeneous <strong>solar</strong> cell [114].<br />

The network model builds a large-area <strong>solar</strong> cell from an array (40x40) <strong>of</strong> small-area,<br />

local <strong>cells</strong> that are interconnected through a common junction <strong>and</strong> a bus. Each small-area<br />

cell is assigned a defect density corresponding to that in the actual wafer for the<br />

corresponding location. Figure 5.4(a) illustrates this model.<br />

In the present analysis, a defect cluster is considered as a localized, large defect<br />

that propagates through the entire cell (crossing both the base <strong>and</strong> the emitter regions <strong>of</strong><br />

the cell), as illustrated in figure 5.4(b). Because <strong>of</strong> very high recombination <strong>and</strong> large<br />

size, one can ignore internal carrier transport <strong>and</strong> b<strong>and</strong> bending associated with each<br />

defect cluster. The defect region acts as a "poor" device in the spatial distribution <strong>of</strong> the<br />

total cell.<br />

The modeling requires two steps. First, each device is represented in terms <strong>of</strong> the<br />

recombination properties associated with its defect density, which yields values <strong>of</strong> photogenerated<br />

current density (J ph), a minority-carrier lifetime (τ), <strong>and</strong> dark saturation-current<br />

components J01 <strong>and</strong> J02, corresponding to the <strong>bulk</strong> <strong>and</strong> the junction recombination,<br />

respectively. Next, the diode array is interconnected using resistive components<br />

corresponding to the sheet resistance <strong>of</strong> the junction <strong>and</strong> the metallization pattern. The<br />

network is solved to yield the terminal characteristics <strong>of</strong> the device, as well as

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