Solar Grade-Silicon, Ingot, Wafer Technology and ... - Displaybank
Solar Grade-Silicon, Ingot, Wafer Technology and ... - Displaybank
Solar Grade-Silicon, Ingot, Wafer Technology and ... - Displaybank
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<strong>Solar</strong> <strong>Grade</strong>-<strong>Silicon</strong>, <strong>Ingot</strong>, <strong>Wafer</strong> <strong>Technology</strong> <strong>and</strong> Market Trend (2008~2012)<br />
<br />
1. Introduction ....................................................................................................................................<br />
1.1 Renewable Energy <strong>and</strong> Photovoltaic .................................................................................................................<br />
1.2 Low-cost Strategy for <strong>Solar</strong> cell .........................................................................................................................<br />
1.3. Poly-<strong>Silicon</strong> Process ...........................................................................................................................................<br />
2. Poly-<strong>Silicon</strong> Technologies ..............................................................................................................<br />
2.1. Metallurgical <strong>Grade</strong>-<strong>Silicon</strong> (MG-Si) Process .................................................................................................<br />
2.2. <strong>Solar</strong> <strong>Grade</strong>-<strong>Silicon</strong> (SoG-Si) Process ..............................................................................................................<br />
2.3. Current Technologies (Simens Process) ...........................................................................................................<br />
2.3.1 Siemens Process Using TCS (TrichloroSilane)..........................................................................................<br />
2.3.2 Simens Process Using MS (Monosilane).................................................................................................<br />
2.3.3. Hydrogen Reduction Process Using Tetrachlorosilane ...........................................................................<br />
2.4. Alternative Technologies 1 (FBR, VLD, FSR Process) ...............................................................................<br />
2.4.1 Fluidized Bed Reactor (FBR) : MEMC, Wacker, REC etc. .....................................................................<br />
2.4.2 Vapor to Liquid Deposition (VLD) : Tokuyama ......................................................................................<br />
2.4.3 Free Space Reactor (FSR) : Joint <strong>Solar</strong> <strong>Silicon</strong> .......................................................................................<br />
2.5 Alternative Technologies 2 (Metallugical Process) .........................................................................................<br />
2.5.1 Acid Leaching ..........................................................................................................................................<br />
2.5.3 SOLSILC Process (Netherl<strong>and</strong>s, Norway) ..............................................................................................<br />
SAMPLE<br />
2.5.4 UMG-Si Process (Elkem, Norway) .........................................................................................................<br />
2.5.5 Vaccum Refining Process (Kawasaki Steel Corporation, Japan) .............................................................<br />
2.5.6 Dow Corning´s Route - NREL..............................................................................................................<br />
3. <strong>Ingot</strong>/ <strong>Wafer</strong> Process ....................................................................................................................<br />
3.1. <strong>Ingot</strong> Process ....................................................................................................................................................<br />
3.2.1 Czochralski Mehod (CZ) .........................................................................................................................<br />
3.2.2 Floating Zone Method (FZ) .....................................................................................................................<br />
3.3 Multicrystalline <strong>Ingot</strong> .......................................................................................................................................<br />
3.3.1 Block Casting Method ...........................................................................................................................<br />
3.3.2 Electromanetic Casting Process ...............................................................................................................<br />
All Contents of this report remain the property of <strong>Displaybank</strong><br />
Jan’09
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