Solar Grade-Silicon, Ingot, Wafer Technology and ... - Displaybank

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Solar Grade-Silicon, Ingot, Wafer Technology and Market Trend (2008~2012) Figure 3.25. EFG Growth Equipment and Substrate Manufactured in Octagonal Pilars .......................................... Figure 3.26. Substrate Manufactured by EFG (EFG-Cell 125 x 125 mm) ............................................................... Figure 3.27. Solar Cell Efficiency Using EFG Wafer ............................................................................................... Figure 3.5.7. SR Method Process Outline ................................................................................................................. Figure 3.5.8. SR Method Equipment ........................................................................................................................ Figure 3.5.9. Dendritic Web Equipment ................................................................................................................... Figure 3.5.10. Ribbon Solar Cell Efficiency by Technology (Lab scale) ................................................................. Figure 3.5.11. RGS Growth Equipment .................................................................................................................... Figure 3.5.11. Crystal Growth and Temperature Distribution in RGS Method ........................................................ Figure 3.5.12. Crystal Structure Comparison in RGS Method upon Growth Condition .......................................... Figure 3.5.12. RGS Wafer Thickness (a) and Growth Speed (b) upon Initial Substrate Temperature ................... Figure 3.5.13. Shunting Mechanisms in RGS Method ............................................................................................. Figure 3.5.14. RGS Substrate Efficiency .................................................................................................................. Figure 3.5.15. CDS Wafer Manufactured by Sharp (Substrate Size: 156 x 156 mm) ............................................... Figure 3.5.16. Silicon Wafer Manufacturing Process Using CDS ............................................................................ Figure 3.5.17. Wafer Size and Production Volume Variation through CDS Method ............................................. Figure 3.5.18. CDS Wafer’s Flat IPF Mapping Result ............................................................................................. Figure 3.5.19. Solar Cell Efficiency Using CDS Wafer ......................................................................................... Figure 3.5.20. Solar Cell Module Using CDS Wafer ................................................................................................ Figure 3.5.21. SSP Process Outline .......................................................................................................................... Figure 3.5.22. Silicon ribbon of 20 cm ..................................................................................................................... Figure 3.5.23. SSP Sheet Underwent Recrystalization Process ................................................................................ Figure 3.5.24. SSP Sheet’s Detailed Structure a.Top b. Section c. Bottom ............................................................ Figure 3.6.1. Thin Film Silicon Wafer Manufactured by DFT Technology .............................................................. Figure 3.6.2. DFT Wafering Technology Outline ..................................................................................................... Figure 3.6.3. Cleaving Stage Process Concept ......................................................................................................... SAMPLE Figure 3.6.4.Characteristics of DFT Wafer Manufactured by PolyMax and Solar Cell Manfactured by Conventional Wafer .................................................................................................................................................. Figure 3.6.5. Thin Film Wafer Manufacturing Technology Concept Using SLIM Method ...................................... Figure3.6.6. Solar Cell I-V Property Using Wafer Manufactured by SLIM Method ................................................ Figure 4.1.1. p-Si Manufacturing Process Used in HSC ........................................................................................... Figure4.1.2. Semiconductor and Solar Cell p-So Manufactured by HSC ................................................................. Figure 4.1.3. p-Si Production Plant Currently Being Constructed in Burghausen, Germany ................................. Figure4.1.4. p-Si Production Plan of Wacker Chemi ................................................................................................ Figure4.1.5. Vertically Integrated Solar Cell Business Structure of REC ................................................................. Figure4.1.6. Moses Lake Construction ..................................................................................................................... Figure4.1.7. Silicon Production system from Raw Materials to Final Products and Business Filed of Tokuyama ................................................................................................................................................................. All Contents of this report remain the property of Displaybank Jan’09
Solar Grade-Silicon, Ingot, Wafer Technology and Market Trend (2008~2012) Figure4.2.1. p-Si Factory Currently Being Constructed in Saint Aubin, France ....................................................... Figure4.9. Solar Cell p-Si Manufactured by LDK .................................................................................................... Figure 4.2.2. Monocrystalline Silicon Ingot Manufactured by Emei ........................................................................ Figure 4.3.1. UMG-Si Manufacturing Process of Elkem Solar ................................................................................ Figure 4.3.2. NEDO Melting Refinign Method Outline ........................................................................................... Figure 4.3.3. Electron Beam Melting and Plasma Melting Concept ......................................................................... Figure4.3.4. Electron Bean Melting Equipment Developed by NEDO .................................................................... Figure4.3.5. Solar Cell p-Si Manufacturing Process Used by Solarvalue AG .......................................................... Figure4.16. UMG-Si Sold by Dow Corning ............................................................................................................. Figure5.1. Monocrystalline Solar Cell Silicon Ingot Growth Using Czochralski Method ....................................... Figure5.3. Polycrystalline Silicon Block Manufactured by PV Crystalox ................................................................ Figure5.4. M. Setek’s Monocrystalline Silicon Ingot and Wafer Manufacturing Process ........................................ Figure5.5. Monocrystalline Ingot and Wafer Manufactured by M. Setek ................................................................. Figure5-6. Business Department at Glomfjord Plant ................................................................................................ Figure5-7. REC Scan Wafer’s Ingot Formation Equipment and Polycrystalline Wafer ............................................ Figure5.8. WACKER SCHOTT Solar’s Busienss Field ............................................................................................ Figure5.9. MEMC’s Silicon Solar Cell Business Field ............................................................................................. Figure 5.10. Swiss Wafers AG’s HEM Equipment and Manufactured Polycrystalline Ingot ................................... Figure 5.11. SolarWorld’s Business Field ................................................................................................................. Figure5.12. Solar Cell Panel Using 180μm Polycrystallin Silicon Wafer ................................................................. Figure5.13. Ersol’s Production Capacity .................................................................................................................. Figure 6.1. p-Si Production & Capacity by Section .................................................................................................. Figure6.2. Solar Cell p-Si Demand/Supply Forecast ................................................................................................ Figure6.3. p-Si Price Forecast ($/Kg) ........................................................................................................................ Figure6.4. poly-Silicon Revenue ............................................................................................................................... Figure6.5. Siemens Method Manufacturing Cost Ratio ............................................................................................. SAMPLE Figure6.6. Manufacturing Cost Raito by Method ($/Kg) .......................................................................................... Figure6.7. poly-Silicon Capacity by Region .............................................................................................................. Figure6.8. poly-Silicon Production Forecast by Region ............................................................................................ Figure6.9. poly-Silicon Production Forecast by Region (2008,2012) ...................................................................... Figure6.10. poly-Silicon Production by Technology ................................................................................................ Figure6.11. UMG-Si Capacity .................................................................................................................................. Figure6.12. Ingot/Wafer Production ......................................................................................................................... Figure6.132. Wafer Revenue .................................................................................................................................... - End of report – All Contents of this report remain the property of Displaybank Jan’09
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