CORROSION RESISTANCE OF HASTEllOY®AllOYS - Haynes ...

Type
316
Concen- Temperature HASTELlOY~ alloy Staintration,
less
Corrosive Media percent deg. F deg. C 8/8-2 C/C-276 G/G-3 Steel Conditions
Phosphoric Acid, Pro· - 130 54 G S - B silicon tetrafluoride approx. 0.31·0.44 Ib./ 1000 cu. ft.; carbon dioxide
duction gases and vapors approx. 0.47·0.68 Ib./1000 cu. ft.; P20 S equivalent 0.00033·0.00048
Ib./100 cu. ft. Possibly very small amount Hl04 as spray, moderate
aeration
Phosphoric Acid Slurry 20 170·200 77-93 U G - - in digester during production of wet process H J P0 4 • Plus CaS04, 40
percent H20, 2 percent H2S0 4 , 1 percent fluorine. Alloy C= 7.9 mpy
Phosphoric Acid 0.1 122·248 50·120 E E E E Duration of test - 64 days (56 in H J P0 4 , 8 in H2SO4)
and Sulfuric Aeration - air free
Acid (0.4%) Agitation - extensive
Type of test - field
Process involved - syntheses of tertiary and secondary amyl phenols
Remarks - unwashed
Phosphoric Acid 0.1 122·347 50·175 E E E E Duration of test - 43 days (25 in H J P04, 18 in H2SO 4 )
and Sulfuric Aeration - air free
Acid (0.3%) Agitation - extensive
Type of test - field
Process involved - syntheses of tertiary and secondary amylphenols
Remarks - unwashed
Phosphoric Acid, 14.5 158 70 - E - - plus 0.381 percent, HNO J in acid. Alloy C = 0.1 mpy
Wet Process
Phosphoric Acid, 28 180·230 82·110 U G - U 42 days, 20·22% H2S04, 1·1.5% f1uosilicic acid, aeration moderate.
Wet Process
Phosphoric Acid, 28 180·230 82·110 - G - U P20 S 20%, sulfuric acid 20·22%, f1uroride about 1-1.5%, probably as
Wet Process
f1uosilicic acid, moderate aeration
Phosphoric Acid, 30t 185 85 - - G - 2 percent F, 4.5 percent H2S0 4 (110 hours exposure), liquid
Wet Process
Phosphoric Acid, 30t 250 121 - - G - 2 percent F, 4.5 percent H2S04 (110 hours exposure). hot wall
Wet Process
Phosphoric Acid, 30t 185 85 - - G - 2.4 percent F, 3 percent H2S04, 1.2 percent ferrous oxides. 1.1 percent
Wet Process
solids (96 hours exposure), liquid
Phosphoric Acid, 30t 250 121 - - G - 2.4 percent F, 3 percent H2S0 4 , 1.2 percent ferrous oxides. 1.1 percent
Wet Process
solids (96 hours exposure). hot wall
Phosphoric Acid, 36 104 40 - G E B P20 S equivalent 26%, sulfuric acid 2.9%, chloride 350 ppm,
Wet Process
hydrofluosilicic acid trace, aluminum phosphate trace, ferric phosphate
trace, moderate aeration
Phosphoric Acid, 36 172 78 - G E U P20 S equivalent 26%, sulfuric acid 2.9%, chloride 350 ppm, hydrofluoric
Wet Process
acid, trace water. Suspended matter: calcium sulfate dihydrate 30% of
suspension weight, calcium phosphate 0.1%, moderate aeration
Phosphoric Acid, 39 170-183 77-84 - - E - 2 percent H2S04, total fluorides 1.2 percent, gypsum 30 percent
Wet Process
Phosphoric Acid, 39 170-183 77-84 U G E U 96 days, liquid phase, 2% H2S0 4 , HF and H2SiF 6 trace, aeration moderate,
Wet Process
agitation strong
Phosphoric Acid, 39 183 84 U G E U 28% P20 S ' sulfuric acid 2%, hydrofluosilicic and hydrofluoric about 1.2%.
Wet Process
Suspended gypsum 30% of suspension weight, aeration
Phosphoric Acid, 53.8 121-149 49·65 - E - - in evaporation of H2P04 plus 1.62·1.70 F2, 1.5·2.5 H2S04, 2 percent
Wet Process
CaS04 in thickener. Alloy C= 1.7 mpy
Phosphoric Acid, 55 180 82 - G G U H J P04 (40% P20 S ). containing combined fluorine, calcium sulfate,
Wet Process
hydrofluosilicic acid.
Phosphoric Acid, 55 232 111 U U - U 40% P20 S equivalent, containing 3% sulfuric acid and suspended calcium
Wet Process
sulfate; slurry. Gases containing water and fluorine compounds are
evolved at the exposure area.
Phosphoric Acid, 56t 190·230 88-110 - - E - 2 percent H2S04, 1percent F, 1.5 percent ferrous and aluminum oxides, 4
Wet Process
percent solids (48 hours exposure), liquid
Phosphoric Acid, 56t 225-245 107·118 - - G - 2percent H2S04, 1percent F, 1.5 percent ferrous and aluminum oxides, 4
Wet Process
percent solids (48 hours exposure), hot wall
Phosphoric Acid, 56t 300 149 - - B - 2 percent H2S0 4, 1percent F, 1.5 percent ferrous and aluminum oxides, 4
Wet Process
percent solids (48 hours exposure), hot wall
Phosphoric Acid, 56t 330 166 - - U - small amounts of Co, MgO, Fe, AI20 J , Si02, Na20, CI. No fluorides or H2SO4
Wet Process 66t 325 163 - - B - present (48 hours exposure), hot wall
66t 340 171 - - U -
Phosphoric Acid, 69 490 to 550 254 to 287 B B - - highly concentrated, aerated acid, 69% P20 S , static and agitated
Wet Process
E- Less than 2 mpy (0.05 mm/y)
G- 2 mpy (0.05 mm/y) to 10 mpy (0.25 mm/y)
S - Over 10 mpy (0.25 mm/y) to 20 mpy (0.51 mm/y)
B - Over 20 mpy (0.51 mm/y) to 50 mpy (1.27 mm/y)
, U - More than 50 mpy (1.27 mm/y)
36