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of plasma in the chamber. Figure 2.1 illustrates the various processes that occur<br />

during a magnetron sputtering using a schematic diagram of the process.<br />

tel-00916300, version 1 - 10 Dec 2013<br />

Figure 2.1: Photo of the AJA Sputter chamber with glowing plasma and the diagrammatic<br />

representation of various processes during sputtering.<br />

Two halogen lamps provi<strong>de</strong> heat to the rear si<strong>de</strong> of the sample hol<strong>de</strong>r and helps<br />

to maintain the temperatures between ambient and 850°C. Therefore the samples<br />

can be <strong>de</strong>posited at any of these temperatures.<br />

2.1.2 Sample preparation<br />

All the samples were <strong>de</strong>posited on a 2 inch boron doped <strong>Si</strong> wafer with 5-15 Ω.cm<br />

resistivity provi<strong>de</strong>d by SILTRONIX [<strong>Si</strong>ltronix 1]. Few samples were also grown on<br />

a fused silica substrate to facilitate characterization through optical spectroscopy.<br />

The three methods of <strong>de</strong>position techniques used in this thesis (reactive sputtering,<br />

co-sputtering and reactive co-sputtering) are illustrated in gure 2.2.<br />

32

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