Films minces à base de Si nanostructuré pour des cellules ...
Films minces à base de Si nanostructuré pour des cellules ... Films minces à base de Si nanostructuré pour des cellules ...
(a) Absorption coecient curves. (b) PL spectra. Figure 4.7: The absorption coecient and photoluminescence spectra obtained from SRSN samples, with regard to refractive index and annealing. tel-00916300, version 1 - 10 Dec 2013 grown samples (80-100 nm thick) with three dierent compositions (refractive indices 2.012, 2.44 and 3.3 that are close to Si 3 N 4 , SRSN and Si respectively). The left part of gure 4.7a shows that the absorption increases with increasing Si excess, which can be attributed to the higher density of Si-np formed in the material. Figure 4.8: Optical investigations on SiN x monolayers with n 1.95eV between 2.01 and 2.13. seen from gure 4.7b. Comparing the SRSN samples with same refractive index in the left and right part of this graph, it is interesting to note that with increasing thickness the absorption coecient of the material is lower, whatever be the annealing treatment. This dierence cannot be explained at the moment. However the absorption does not vary with annealing for energies higher than 3 eV. In the case of PL properties, both the thin and thick SRSN samples (n 1.95eV =2.44) do not exhibit any emission in their as grown or annealed state whatever the temperature or time of annealing as can be 98
tel-00916300, version 1 - 10 Dec 2013 A detailed analysis by a fellow researcher in our team, Dr. O. Debieu revealed that emission is obtained only from samples that possess refractive indices between 2.0-2.13 when annealed at temperatures lower than CA. Figure 4.8 shows consolidated results of his optical investigations. These results also conrmed the absence of PL for n 1.95eV >2.4 whatever the annealing treatment. The maximum PL was obtained after annealing at 900°C, and an increase in absorption coecient with refractive indices is noticed. For the Si 3 N 4 sample (n 1.95ev = 2.01), a drop of α in the absorption spectra is noticed between 2.5-3.5 eV at the PL excitation energy which may explain the low emission intensity of this sample. For the other cases, the emission intensity increases with refractive indices till 2.12 and then begins to fall. This decrease is attributed to the increase in the non-radiative recombination rates with increasing disorder in the matrix brought by incorporating higher Si excess [Debieu 12]. 4.3 Cosputtering of Si 3 N 4 and Si cathodes The SiN x layers were grown at 3 mTorr and T d =500°C by using Si 3 N 4 and Si cathodes in pure Ar plasma. One sample of N-rich silicon nitride (NRSN) was also grown by sputtering the stochiometric target in N 2 +Ar plasma to compare with Si 3 N 4 and SRSN samples. The RF power density applied on Si 3 N 4 cathode was maintained at 7.4 W/cm 2 while that on Si cathode was varied between 1.77 and 2.96 W/cm 2 . 4.3.1 Refractive index (n 1.95eV ) and Deposition rates (r d ) Figure 4.9 shows the variation of refractive index (left axis) and deposition rate (right axis) with respect to P Si . The refractive index increases from 2.3 to 2.82 with increasing P Si . This is a signature of increasing the Si incorporation in the matrix with P Si . A direct sputtering from Si 3 N 4 cathode in pure Ar plasma results in n 1.95eV ∼ 2.30. This indicates that at our chosen conditions, the sputtering does not yield a stochiometric material. Hence a couple of samples were grown by sputtering Si 3 N 4 cathode in N 2 -rich plasma to obtain refractive indices relating to Si 3 N 4 and N-rich SiN x (pink and brown circles in the gure). Their values of n 1.95eV are also indicated in the gure at P Si =0W/cm 2 , signifying only the Si 3 N 4 cathode is sputtered for the growth of these layers. The deposition rate increases with P Si which can be explained by the increase in the number of reacting species. 99
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tel-00916300, version 1 - 10 Dec 2013<br />
A <strong>de</strong>tailed analysis by a fellow researcher in our team, Dr. O. Debieu revealed<br />
that emission is obtained only from samples that possess refractive indices between<br />
2.0-2.13 when annealed at temperatures lower than CA. Figure 4.8 shows consolidated<br />
results of his optical investigations. These results also conrmed the absence<br />
of PL for n 1.95eV >2.4 whatever the annealing treatment.<br />
The maximum PL was obtained after annealing at 900°C, and an increase in absorption<br />
coecient with refractive indices is noticed. For the <strong>Si</strong> 3 N 4 sample (n 1.95ev =<br />
2.01), a drop of α in the absorption spectra is noticed between 2.5-3.5 eV at the PL<br />
excitation energy which may explain the low emission intensity of this sample. For<br />
the other cases, the emission intensity increases with refractive indices till 2.12 and<br />
then begins to fall. This <strong>de</strong>crease is attributed to the increase in the non-radiative<br />
recombination rates with increasing disor<strong>de</strong>r in the matrix brought by incorporating<br />
higher <strong>Si</strong> excess [Debieu 12].<br />
4.3 Cosputtering of <strong>Si</strong> 3 N 4 and <strong>Si</strong> catho<strong>de</strong>s<br />
The <strong>Si</strong>N x layers were grown at 3 mTorr and T d =500°C by using <strong>Si</strong> 3 N 4 and <strong>Si</strong> catho<strong>de</strong>s<br />
in pure Ar plasma. One sample of N-rich silicon nitri<strong>de</strong> (NRSN) was also grown by<br />
sputtering the stochiometric target in N 2 +Ar plasma to compare with <strong>Si</strong> 3 N 4 and<br />
SRSN samples. The RF power <strong>de</strong>nsity applied on <strong>Si</strong> 3 N 4 catho<strong>de</strong> was maintained at<br />
7.4 W/cm 2 while that on <strong>Si</strong> catho<strong>de</strong> was varied between 1.77 and 2.96 W/cm 2 .<br />
4.3.1 Refractive in<strong>de</strong>x (n 1.95eV ) and Deposition rates (r d )<br />
Figure 4.9 shows the variation of refractive in<strong>de</strong>x (left axis) and <strong>de</strong>position rate<br />
(right axis) with respect to P <strong>Si</strong> . The refractive in<strong>de</strong>x increases from 2.3 to 2.82 with<br />
increasing P <strong>Si</strong> . This is a signature of increasing the <strong>Si</strong> incorporation in the matrix<br />
with P <strong>Si</strong> .<br />
A direct sputtering from <strong>Si</strong> 3 N 4 catho<strong>de</strong> in pure Ar plasma results in n 1.95eV ∼ 2.30.<br />
This indicates that at our chosen conditions, the sputtering does not yield a stochiometric<br />
material. Hence a couple of samples were grown by sputtering <strong>Si</strong> 3 N 4 catho<strong>de</strong><br />
in N 2 -rich plasma to obtain refractive indices relating to <strong>Si</strong> 3 N 4 and N-rich <strong>Si</strong>N x (pink<br />
and brown circles in the gure). Their values of n 1.95eV are also indicated in the<br />
gure at P <strong>Si</strong> =0W/cm 2 , signifying only the <strong>Si</strong> 3 N 4 catho<strong>de</strong> is sputtered for the growth<br />
of these layers. The <strong>de</strong>position rate increases with P <strong>Si</strong> which can be explained by<br />
the increase in the number of reacting species.<br />
99