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Cadence OrCAD PCB Designer

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Figure 24. Padstack editor settings with a pastemask to act as a dummy hole.<br />

2. You will probably see the Parameters tab first. There’s probably no need to touch this<br />

unless you want to adjust the diameter of the hole.<br />

3. The Layers tab needs the work. See figure 24. I’m not sure what the Thermal Relief and<br />

Anti Pad should be, but these settings avoid complaints.<br />

• The TOP and BOTTOM layers should have the dimensions of the copper under<br />

Regular Pad. It is best to set the Thermal Relief and Anti Pad to null.<br />

• The DEFAULT INTERNAL layer has the same dimensions in all three categories.<br />

• SOLDERMASK_TOP and SOLDERMASK_BOTTOM have the same size Regular<br />

Pad as the others.<br />

• I have edited the PASTEMASK_TOP and PASTEMASK_BOTTOM to have a circular<br />

Regular Pad with diameter 20 mil. This will become the guide hole in the<br />

final plot.<br />

There are further commands to replace padstacks and to purge unused padstacks from a design.<br />

B.4 Pours or fills<br />

It is easy to fill the unused areas of an etch layer with conductor to provide screening. This<br />

is called a dynamic etch shape in Allegro and the procedures are described in Preparing for<br />

Layout, although it doesn’t seem entirely consistent with <strong>OrCAD</strong> <strong>PCB</strong> Editor. A dynamic<br />

51

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