3M & SUSS announce agreement on temporary wafer ... - I-Micronews
3M & SUSS announce agreement on temporary wafer ... - I-Micronews
3M & SUSS announce agreement on temporary wafer ... - I-Micronews
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J U L Y 2 0 0 9 i s s u e n ° 1 1<br />
N e w s l e t t e r o n 3 D I C , T S V , W L P & E m b e d d e d T e c h n o l o g i e s<br />
C O M P A N Y P R O F I L E<br />
SET: Die/Flip chip B<strong>on</strong>ders able to align and b<strong>on</strong>d<br />
fragile comp<strong>on</strong>ents at 0.5 μm post b<strong>on</strong>d accuracy<br />
SET, Smart Equipment Technology, based in Saint-Jeoire, France, is a world leading<br />
supplier of High Accuracy Die-to-Die and Die-to-Wafer B<strong>on</strong>ders and versatile Nanoimprint Lithography (NIL) soluti<strong>on</strong>s.<br />
Company backgrounder<br />
In the early 1980s, SET has pi<strong>on</strong>eered in<br />
the development of flip chip b<strong>on</strong>ders for the<br />
hybridizati<strong>on</strong> of infrared imagers and the assembly<br />
of optoelectr<strong>on</strong>ics devices, by delivering the first<br />
commercially available Flip Chip B<strong>on</strong>der <strong>on</strong> the<br />
market and introducing an image superimposing<br />
microscope which established<br />
SET as the industry leader for high accuracy<br />
placement. Supplier of semic<strong>on</strong>ductor equipment<br />
dedicated to highend applicati<strong>on</strong>s for over 30 years<br />
and with around 300 Device B<strong>on</strong>ders installed<br />
worldwide, SET is globally renowned for the<br />
unsurpassed accuracy and the flexibility of its flip<br />
chip b<strong>on</strong>ders. SET encompasses a structure in<br />
North America and offers a comprehensive product<br />
portfolio of die/flip chip b<strong>on</strong>ders for fast growing<br />
markets, serving clients through a global network<br />
of representatives and in-depth customer trainings.<br />
Since 2008, SET is a wholly owned subsidiary of<br />
Replisaurus Technologies.<br />
Product lines & technologies<br />
SET, employing 57 pers<strong>on</strong>s in France, has a l<strong>on</strong>g<br />
history in the development and producti<strong>on</strong> of high<br />
precisi<strong>on</strong> tools. This includes Chip-to-Chip or<br />
Chip-to-Wafer die b<strong>on</strong>ders for 3D-IC integrati<strong>on</strong>,<br />
versatile Nanoimprinting Lithography Steppers and<br />
the Process Module for the innovative Replisaurus'<br />
ECPR technology.<br />
- Device B<strong>on</strong>ding<br />
SET develops and manufactures pieces of equipment<br />
addressing future challenges and fine pitch<br />
applicati<strong>on</strong>s for high density integrati<strong>on</strong>. Primarily<br />
targeting low-volume and R&D applicati<strong>on</strong>s, the<br />
current SET b<strong>on</strong>der portfolio covers a wide range<br />
of b<strong>on</strong>ding applicati<strong>on</strong>s with the ability to handle<br />
and b<strong>on</strong>d fragile and small comp<strong>on</strong>ents <strong>on</strong>to large<br />
substrate or <strong>wafer</strong>. As the industry is poised to move<br />
3D packaging technology from labs to producti<strong>on</strong>,<br />
SET is actively engaged in European Programs<br />
including the development of High Accuracy,<br />
High Precisi<strong>on</strong> placement tools addressing the<br />
3D-IC integrati<strong>on</strong> with Through Silic<strong>on</strong> Via (TSV)<br />
technology.<br />
The recent introducti<strong>on</strong> <strong>on</strong> the market of their<br />
SETFC300 has offered a timely resp<strong>on</strong>se to the<br />
current research activities in this area.<br />
Products developpements & Current<br />
R&D projects<br />
Interview with Gilbert Lecarpentier,<br />
Business Development Manager at SET<br />
Yole Développement: What is historically the<br />
key b<strong>on</strong>ding applicati<strong>on</strong> for SET b<strong>on</strong>ders?<br />
Gilbert Lecarpentier: SET b<strong>on</strong>ders have been<br />
used successfully for over three decades to<br />
hybridize Infrared Imagers which c<strong>on</strong>sists of<br />
b<strong>on</strong>ding a compound semic<strong>on</strong>ductor <strong>on</strong> silic<strong>on</strong><br />
CMOS readout. Thanks to their unrivalled<br />
accuracy and versatility, SET tools are now used<br />
by all major IR-FPA providers.<br />
YD: What represents 3D applicati<strong>on</strong>s for SET<br />
in its short, medium and l<strong>on</strong>g term strategy?<br />
GL: High-end IR-FPA and 3D applicati<strong>on</strong>s is the<br />
current market for our FC300, mainly because<br />
3D-IC is still in R&D. In l<strong>on</strong>ger term, 3D-IC is the<br />
opportunity for SET to enter into the producti<strong>on</strong><br />
market; it is the driver for the development of<br />
a High Accuracy, High Speed platform. 3D-IC<br />
with its increasing demand of High Accuracy<br />
producti<strong>on</strong> C2W b<strong>on</strong>der is likely to become the<br />
main market for SET b<strong>on</strong>ders.<br />
YD: Wafer-to-<strong>wafer</strong> is perceived as a cost<br />
effective technology for some 3D applicati<strong>on</strong>s;<br />
what are the 3D applicati<strong>on</strong>s likely to require<br />
die-to-die or die-to<strong>wafer</strong> assembly?<br />
GL: Except for the memory market which can be<br />
addressed by <strong>wafer</strong> to <strong>wafer</strong> b<strong>on</strong>ding because of<br />
the high yield and the same die size, most of the<br />
other 3D applicati<strong>on</strong>s such as Memory <strong>on</strong> Logic or<br />
heterogeneous integrati<strong>on</strong> are candidates for the<br />
Chip to Wafer approach. SET b<strong>on</strong>ders are wellsuited<br />
for heterogeneous integrati<strong>on</strong>; the b<strong>on</strong>ding<br />
of GaAs epitaxial layer to Silic<strong>on</strong> substrate has<br />
been successfully dem<strong>on</strong>strated for a LED printer<br />
applicati<strong>on</strong>. SET b<strong>on</strong>ders have already been used<br />
for memory stack; the SAMSUNG memory stack<br />
shown by everybody in every 3D c<strong>on</strong>ference<br />
was performed <strong>on</strong> the SET-FC250 platform and<br />
the LETI has performed memory stack <strong>on</strong> SET-<br />
FC150 as early as 1997.<br />
YD: What is SET involvement in research<br />
programs for 3D integrati<strong>on</strong>?<br />
GL: SET has recently joined the IMEC’s Industrial<br />
Affiliati<strong>on</strong> Program (IIAP) <strong>on</strong> 3D integrati<strong>on</strong>. The<br />
High Accuracy (0.5μm), High Force (400kgf) Die<br />
B<strong>on</strong>der SET-FC300 is installed at IMEC and<br />
is used for developing processes with scaling<br />
capability for high throughput machine. In this<br />
3-Year JDP, SET supports the tool and the<br />
eventual modificati<strong>on</strong>s required for achieving the<br />
program, and collaborates with IMEC to develop<br />
high alignment accuracy pick-and-place as well as<br />
low Temperature b<strong>on</strong>ding processes as required<br />
by advanced 3D integrati<strong>on</strong> schemes. SET and its<br />
mother company Replisaurus are partners of the<br />
European Project JEMSiP_3D. SET c<strong>on</strong>tributes<br />
in this 3-Year program with the development and<br />
the validati<strong>on</strong> of a High Speed, High Accuracy Die<br />
B<strong>on</strong>der required for the high volume producti<strong>on</strong> of<br />
3D devices using the TSV technology.<br />
Some other R&D projects, focusing <strong>on</strong> the<br />
development of alternative b<strong>on</strong>ding methods<br />
enabling higher throughput are also in discussi<strong>on</strong>.<br />
YD: SET also proposes Nanoimprinting<br />
Tools; what do you foresee as the main<br />
market drivers for this technology; is SET<br />
involved in research programs dedicated to<br />
Nanoimprinting Lithography?<br />
GL: After a big push few years ago of the<br />
semic<strong>on</strong>ductor market, it seems that the main<br />
markets short and mid terms are the pattern media<br />
and the optoelectr<strong>on</strong>ics or optics; phot<strong>on</strong>ic crystal,<br />
light extracti<strong>on</strong> enhancement, antireflective layer,<br />
etc.<br />
The SET-NPS300, a versatile Nanoimprinting<br />
tool using a step and repeat approach has been<br />
developed in the frame of the completed 4-Year<br />
European program NaPa. SET is currently partner<br />
of another 4-Year European project NaPANIL,<br />
targeting scalable nanomanufacturing processes<br />
for arbitrary 3-dimensi<strong>on</strong>al surfaces in the fields<br />
of optical comp<strong>on</strong>ents and life sciences. For SET,<br />
the key outcome of this framework is an alignment<br />
capability below 50nm.<br />
12<br />
Printed <strong>on</strong> recycled paper<br />
- Nano Imprinting<br />
Its experience in high accuracy placement has<br />
enabled SET to bring to the market the cuttingedge<br />
Nanoimprinting Stepper (NPS300) at proven<br />
submicr<strong>on</strong> alignment capabilities combined with<br />
superior flexibility. Nanoimprinting lithography<br />
c<strong>on</strong>sists of transferring the pattern of a stamp into a<br />
thermoplastic or UV-Cured material. This innovative<br />
technology is a very promising soluti<strong>on</strong> for replacing<br />
standard UVlithography systems at nano scale<br />
and reas<strong>on</strong>able cost. Applicati<strong>on</strong>s include phot<strong>on</strong>ic<br />
crystal, antireflective or functi<strong>on</strong>alized layer as well<br />
as 3-dimensi<strong>on</strong>al replicati<strong>on</strong>.<br />
Gilbert Lecarpentier, Business Development Manager<br />
After studying electr<strong>on</strong>ics in Caen, Calvados (France), Gilbert worked at Philips<br />
for 4 years designing special equipment for use in semic<strong>on</strong>ductor producti<strong>on</strong> lines.<br />
In 1977, he joined Sulzer Electro Technique (S.E.T.) for developing equipment for<br />
semic<strong>on</strong>ductor processing, such as Mask Aligner, Spinner, Prober, Laser Marker,<br />
Laser Scriber and Flip Chip B<strong>on</strong>der. When <str<strong>on</strong>g>SUSS</str<strong>on</strong>g> MicroTec acquired SET in 1993,<br />
Gilbert took the product management resp<strong>on</strong>sibility of the device b<strong>on</strong>der product<br />
line. After the Management Buy Out of the <str<strong>on</strong>g>SUSS</str<strong>on</strong>g> MicroTec Device B<strong>on</strong>der Divisi<strong>on</strong><br />
in July 2007, he assumes the role of business development manager for this product line and the<br />
newly developed Nano imprinting Stepper within the new company renamed SET, Smart Equipment<br />
Technology.