Embedded Die - I-Micronews
Embedded Die - I-Micronews
Embedded Die - I-Micronews
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Scope of the Report<br />
Wafer-Scale-Packaging Platforms<br />
Wafer-Level<br />
Electrical Redistribution<br />
Wafer-Level<br />
Interface / Encapsulation<br />
Flip-chip & Wafer-Level<br />
Stacking / Integration<br />
WL-CSP<br />
‘Fan-in’<br />
FO-WLP<br />
‘Fan-Out’<br />
MEMS &<br />
Sensors<br />
Capping<br />
LED &<br />
Sensors<br />
Optics<br />
Systems<br />
with<br />
Fluidic<br />
<strong>Embedded</strong> IC<br />
in PCB / laminate<br />
3D IC<br />
& TSV<br />
Si on Si<br />
flip-chip<br />
Flip-chip<br />
BGA<br />
Courtesy of DALSA<br />
FOCUS of this<br />
new research report!<br />
FOCUS of this<br />
new research report!<br />
© 2010 • 4<br />
Copyrights © Yole Développement SARL. All rights reserved.
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