Embedded Die - I-Micronews
Embedded Die - I-Micronews
Embedded Die - I-Micronews
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Table of Contents (1/2)<br />
• Scope of the Report & Definitions …...……. 3<br />
– Objectives of the report ………….……... 4<br />
• Executive Summary ………………………..… 9<br />
1) <strong>Embedded</strong> Packaging of active dies and<br />
passive components ………………….……. 10<br />
– Motivations and Drivers ………………... 18<br />
– Applications & End-markets: Status of<br />
commercialization …………………..…... 24<br />
• Cell-phone & Consumer applications<br />
• Automotive applications<br />
• Medical applications<br />
– 2009-2015 market forecasts for <strong>Embedded</strong><br />
packages ………………………………….... 32<br />
• In Package shipments (Munits)<br />
• In Packaging revenues ($M)<br />
– Supply chain emerging for embedded dies<br />
………………………………….…………….. 44<br />
• Players and positioning in the electronic value<br />
chain<br />
• Who is the most aggressive in the<br />
commercialization?<br />
• Who is doing what: partnership identified<br />
– Technology flavors for embedded package ... 51<br />
• Chip first versus chip last?<br />
• Single die embedding versus SiP module?<br />
• SiP multi-die integration<br />
• Discrete passive integration<br />
• Specific features integration (silicon interposers,<br />
holes, fluidic, hermetic cavities, etc…)<br />
• Challenges related to yield & supply chain<br />
– Equt & Material Tool-Box for <strong>Embedded</strong> die … 78<br />
– Cost structure for <strong>Embedded</strong> package<br />
manufacturing …………………………………..... 95<br />
• Comparison with competitive package alternative<br />
that <strong>Embedded</strong> die technology is looking for direct<br />
replacement (QFN, BGA, WLCSP, SOT, PoP…)<br />
• Cost structure target of <strong>Embedded</strong> die for different<br />
application case (RFID, IPD, Power MOSFET / IGBT,<br />
DC/DC converters, PMU, Wireless Connectivity ICs,<br />
Digital Baseband, Memories, etc …)<br />
– Conclusion on “sweets spots” for the<br />
introduction of <strong>Embedded</strong> die technology in the<br />
short / medium / long term ……………………. 102<br />
• Global Roadmap for <strong>Embedded</strong> die<br />
© 2010 • 2<br />
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