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Some more slides extracted from the Report … © 2010 • 16 Copyrights © Yole Développement SARL. All rights reserved.
About the Authors of this Report • Jean-Marc Yannou – Jean-Marc recently joined Yole Développement as technology and market expert in the fields of advanced packaging and Integrated Passive Devices. He has 15-years of experience in the semiconductor industry. He worked for Texas Instruments and Philips (then NXP semiconductors) where he served as “Innovation Manager” for System-in-Package technologies Contact: yannou@yole.fr • Jerome Baron – Jerome is leading the MEMS & Advanced Packaging market research at Yole Developpement. He is leading the MEMS and Advanced Packaging market research at Yole. He has been involved in the technology analysis of the 3D packaging market evolution at device, equipment and material supplier levels. He was granted a Master of Science degree in Nanotechnologies from the National Institute of Applied Sciences in Lyon, France Contact: baron@yole.fr © 2010 • 17 Copyrights © Yole Développement SARL. All rights reserved.
Page 1 and 2: Embedded Wafer-Level-Packaging Fan-
Page 3 and 4: Table of Contents (2/2) 2) Fan-Out
Page 5 and 6: Objectives of the Report • This i
Page 7 and 8: Companies cited in this Report 3D-P
Page 9 and 10: Fan-out WLP Concept • A new SiP-f
Page 11 and 12: Fan-Out WLP technology is emerging
Page 13 and 14: FOWLP versus Chip Embedding: Compet
Page 15: Embedded Wafer-Level-Package techno
Page 19: What about on-site workshops? • O

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