Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
QFP<br />
Quad Flat Pack (QFP) devices are leadframe-type<br />
packages in which leads protrude from the Molding<br />
Compound from all four sides. Though most<br />
QFP structures are similar, Die Attach material<br />
requirements for this type of package may vary based<br />
on the leadframe finish or Integrated Chip (IC) size.<br />
QFN device size may also dictate the use of different<br />
Die Attach formulations and Molding Compounds.<br />
QFP<br />
Die Attach Adhesives<br />
Molding<br />
Compounds<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Green<br />
Non-Green<br />
HYSOL<br />
QMI529HT-LV<br />
ABLEBOND<br />
3230<br />
ABLEBOND<br />
2025DSI<br />
HYSOL<br />
GR828D<br />
HYSOL<br />
KL-7000HA<br />
ABLESTIK<br />
C100 (Film)<br />
ABLEBOND<br />
8290<br />
ABLEBOND<br />
8900NC<br />
HYSOL<br />
GR869<br />
HYSOL<br />
QMI547<br />
HYSOL<br />
KL-G730<br />
7
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