Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
Discrete components<br />
Discrete components form by far the largest number of<br />
components in any electrical or electronic application.<br />
Despite the expansion of any number of integrated<br />
circuits, there is always a need for supporting discrete<br />
packages, especially where high power is needed. As<br />
with almost all semiconductor devices, environmental<br />
protection is mostly afforded by epoxy-based mold<br />
compounds with typical packages including TO, SOT,<br />
DAK, etc. Depending upon the component, internal<br />
die placement is generally with a solder or silver die<br />
attach material, with non-conductive pastes also being<br />
used in selected areas.<br />
Discrete Components<br />
Die Attach Adhesives<br />
Encapsulants<br />
Molding<br />
Compounds<br />
Conductive<br />
Non-Conductive<br />
HYSOL<br />
FP0087<br />
Green<br />
Non-Green<br />
ABLEBOND<br />
FS849-TI<br />
HYSOL<br />
QMI536HT<br />
HYSOL<br />
GR15F-1P<br />
HYSOL<br />
KL1000-3LX<br />
ABLECOAT<br />
8008HT (WBC)<br />
HYSOL<br />
QMI547<br />
HYSOL<br />
GR360A-F8<br />
HYSOL<br />
KL-5000HT<br />
ABLETHERM<br />
2600AT<br />
HYSOL<br />
GR750<br />
HYSOL<br />
MG15F<br />
HYSOL<br />
QMI529HT<br />
HYSOL<br />
KL-G100<br />
MULTICORE DA100<br />
(SOLDER)<br />
HYSOL<br />
KL-G200<br />
MULTICORE DA101<br />
(SOLDER)<br />
5
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