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Henkel Semiconductor Solutions

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<strong>Semiconductor</strong><br />

Market <strong>Solutions</strong><br />

Device miniaturization and the need for improved reliability continue to drive<br />

advances in semiconductor materials technology. The relentless push for smaller<br />

yet more powerful and less costly products requires semiconductor specialists to<br />

constantly push the envelope when it comes to device packaging.<br />

This is precisely why <strong>Henkel</strong>’s commitment to innovation and materials<br />

technology leadership is a critical component for packaging success. The<br />

never-ending demands imposed by today’s advanced products mean there<br />

is no room for error – materials have to perform as expected the first time.<br />

Because of <strong>Henkel</strong>’s inimitable materials development methodology, where<br />

complete packages are built and various materials combinations are tested for<br />

compatibility and in-field performance, we can ensure not only outstanding<br />

materials performance but also optimized package functionality. We take<br />

the guesswork out of the process and deliver tested, reliable and guaranteed<br />

compatible materials for the most demanding applications.<br />

Across the Board,<br />

Around the Globe.<br />

www.henkel.com/electronics<br />

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