Henkel Semiconductor Solutions

Semiconductor
MaTERIALS
Solder MATERIALS
PoP Tacky Fluxes
As Package-on-Package (PoP) devices have
gained favor in recent years, it has become
increasingly evident that the requirements of
the technology are certainly unique. This is
true for many materials used to manufacture
and assemble PoPs, but particularly for the
tacky fluxes needed for both ball attach and for
device stacking. That’s why Henkel, the leader
in solder innovation, has formulated a series of
Tacky Flux systems to address the demands of
PoP production.
PoP Epoxy Flux
Combining both flux functionality and underfill
protection into a single formulation, Hysol
FF6000 takes PoP manufacturing flexibility
to a whole new level. Traditional underfill
application methodologies simply don’t work
for top package assembly, but Hysol FF6000
has solved this problem by incorporating a flux
component that provides the action necessary
for solder joint formation and an epoxy that
encapsulates each solder sphere, delivering
added support and protection. This streamlined
approach effectively eliminates the need for
dispensing equipment and the time required
for underfill application and cure. But that’s
not all: Hysol FF6000 has also been proven to
provide improved protection – as compared to
traditional flux materials – for solder sphere
attach during package production as well.
PoP Solder Paste
When either the top or bottom package of
a PoP is warped, co-planarity of the stacked
packages becomes a challenge. One method
used to overcome co-planarity challenges is
solder paste dipping, where the top package
is dipped into solder paste. Not only does the
extra metallization reduce the possibility of
non- co-planar induced solder joints, but it
improves the joint reliability by increasing the
component stand-off. The metal loading and
particle size distribution of Henkel’s Multicore
LF730 Solder Paste have been optimized for
package stacking.
Die Attach Solder Paste
Multicore DA100 and Multicore DA101
have been designed to provide the thermal
management necessary for today’s smaller
outline, higher-functioning semiconductor
power devices, while also delivering the
processability and versatility associated with
solder paste materials. These products offer
robust options for application-specific thermal
requirements and overcome many of the
issues historically associated with alternative
products such as silver (Ag)-based Die Attach
Adhesives and solder wire, neither of which is
ideal for modern semiconductor power device
production. The robust nature of the flux
formulas provides customers the flexibility to
alter alloys based on process requirements.
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