Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
MATERIALS<br />
Molding<br />
CompoundS<br />
SiP<br />
SURFACE MOUNT / Laminates<br />
PRODUCT<br />
DESCRIPTION<br />
package<br />
size<br />
Warpage, m MSL GREEN<br />
FILLER<br />
CONTENT %<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR9810 series<br />
Advanced epoxy Molding Compounds designed for use<br />
as an overmold on a wide variety of BGA and CSP. The<br />
series’ flexible hardener technology enables ultra-low<br />
warpage. HYSOL GR9820-1 is a “green” (non Sb, Br, P)<br />
Molding Compound and is capable of achieving JEDEC<br />
Level 3, at 260ºC reflow temperature.<br />
PBGA 37.5 x 37.5<br />
mm<br />
CSP Panel 50 x<br />
60 mm<br />
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