Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
MATERIALS<br />
Molding<br />
CompoundS<br />
SURFACE MOUNT / LEADFRAMEs<br />
SOT/SMX<br />
PRODUCT<br />
DESCRIPTION<br />
surface<br />
finish<br />
MSL<br />
GREEN<br />
MAX FILLER<br />
SIZE, µm<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR640HV-L1<br />
Low stress Molding Compound suitable for SOT, SOD packages,<br />
GR640HV-L1 provides good workability and high reliability.<br />
Ag, Cu L1/260°C Y 75 69 15 160<br />
HYSOL<br />
KL-6500S<br />
Low stress molding compound suitable for SOT, SOD and SOIC<br />
packages, HYSOL KL6500S provides good workability and high reliability.<br />
Ag, Cu L1/260°C N 75 110 14 150<br />
HYSOL<br />
KL-G200S<br />
Green, super moldability for SMX packages. Ag, Cu L1/260°C Y 125 20 20 175<br />
HYSOL<br />
KL-G450S<br />
High adhesion, low stress green EMC. Ag, Cu L1/260°C Y 75 100 11 112<br />
HYSOL<br />
KL-G800H<br />
High adhesion, ultra-low stress, low viscosity. Ag, Cu L2/260°C Y 75 115 7.5 125<br />
HIGH POWER PACKAGES, POWER SOIC, POWER SSOP<br />
PRODUCT<br />
DESCRIPTION<br />
surface<br />
finish<br />
MSL<br />
GREEN<br />
FILLER<br />
CONTENT %<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, C<br />
HYSOL<br />
GR725LV-LS<br />
Green Molding Compound. Designed for power SO and surface mount<br />
discrete packages.<br />
Ag, Cu, Ni L1/260°C Y 84 130 11 150<br />
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