Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
<strong>Semiconductor</strong><br />
MATERIALS<br />
Molding<br />
CompoundS<br />
SURFACE MOUNT / LEADFRAMEs<br />
QFP, T/LQFP, TSSOP<br />
PRODUCT DESCRIPTION SURFACE FINISH PACKAGE SIZE MSL GREEN % FILLER<br />
SPIRAL<br />
FLOW, cm<br />
CTEa1,<br />
ppm/°C<br />
Tg, °C<br />
HYSOL<br />
GR869<br />
HYSOL<br />
KL-7000HA<br />
HYSOL<br />
KL-G730<br />
Green, ultra low stress and high adhesion Molding<br />
Compound designed for QFP packages with Pb-free<br />
finishing. HYSOL GR869 provides wide molding process<br />
window and robust reliability performance.<br />
High adhesion and high strength Molding<br />
Compound suitable for SOT, SSOP and QFP<br />
packages. Provides ultra low stress, low moisture<br />
absorption, high purity and high reliability. Its low<br />
viscosity properties enable low wire sweep.<br />
High adhesion, ultra low stress and green Molding<br />
Compound suitable for SOIC, TSOP, D/D2PAK, QFP, L/TQFP.<br />
Its low viscosity properties enable low wire sweep molding<br />
with a large operating window. It has no flame retardants but<br />
offers a 1/8 inch flammability rating.<br />
Ag, Cu, Ni all T/LQFP L3/260°C Y 86.5 102 9 124<br />
all QFP<br />
< 14 x 14 mm T/<br />
LQFP<br />
L3/260°C N 84 110 9 130<br />
PPF, Ag all SOIC L1/260°C Y 87 129 7 130<br />
38
Change language