Henkel Semiconductor Solutions

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Semiconductor MaTERIALS molding compounds From through-hole discrete components to the most advanced surface mount devices, Henkel’s Hysol brand Molding Compounds deliver the outstanding performance and ease of use you’d expect from a world leader in materials technology. Combining low stress and low moisture absorption with high physical strength, all of Henkel’s Molding Compounds ensure an optimized process at high yields even in the most demanding Pb-free environments. Formulated for the varying requirements of today’s discrete components, Hysol products’ high performance Molding Compounds offer the ultimate in manufacturing value for general discretes. With fast cycle times, a robust process window and the ability to run in excess of 700 cycles prior to mold cleaning, these materials deliver exceptional results. For more demanding high voltage applications, Hysol materials have been formulated to provide low dielectric properties at high temperatures. Henkel has also developed Molding Compounds for thermally conductive discretes that provide excellent thermal characteristics, offering up to 2.1 W/mK with the ability to go as high as 3 W/mK. The low moisture absorption and low stress properties of Hysol Molding Compounds for surface-mounted leadframe devices all pass stringent JEDEC Level 1, 260°C testing. All Hysol Molding Compounds are green materials, which are halide-free and Pb-free compatible and meet RoHS requirements, while delivering superior performance even in high temperature reflow conditions. With materials solutions for QFPs, SoPs, SOICs, QFNs, SOTs and DPAKs, the Hysol line of Molding Compounds are formulated for package-specific demands and deliver exceptional adhesion for a variety of leadframe finishes. For packaging specialists building surface-mounted laminate packages such as BGAs and CSPs, Henkel has developed a wide range of state-of-the-art Molding Compound materials utilizing our unique flexible hardener technology. Maintaining package flatness throughout package assembly and subsequent PCB assembly processes is essential for ensuring high reliability. Henkel’s flexible hardener technology enables package-specific Molding Compound formulations that counter-correct any warpage that may occur during second level reflow processes, thus ensuring high performance and longterm reliability. In addition, we have developed innovative Molding Compound materials for use with today’s multifunctional memory card (MMC) and Package-on-Package (PoP) applications. Hysol MMC and PoP Molding Compounds deliver the robust performance characteristics and exceptionally low warpage required for these devices. 34
Semiconductor MaTERIALS Molding CompoundS Semiconductor Molding Compounds Through-Hole Discrete Surface Mount / Lead Frame Surface Mount / Laminate Through-Hole Discretes General Discretes TO, Axial, Bridge, Single In-Line Package (SIP) High Thermal Conductivity Application TO, Full Pack, HSOP High Voltage Application TO, Axial, Bridge, DIP, HYSOL KL1000-3LX HYSOL GR360A-F8 HYSOL KL-5000HT HYSOL GR750 HYSOL MG15F HYSOL KL-2500-1K HYSOL KL-G100 HYSOL KL-G500HT HYSOL GR750HT-25 HYSOL GR15F-1P HYSOL KL-4500-1 HYSOL KL-G150 HYSOL GR750-SC HYSOL KL-G200 Surface Mount / Lead Frames QFP, T/LQFP, TSSOP SOIC QFN DPAK/D2PAK SOT/SMX High Power Packages Power SOIC, Power SSOP HYSOL GR869 HYSOL GR828D HYSOL KL-G900HC HYSOL GR838LC HYSOL GR640HV-L1 HYSOL GR725LV-LS HYSOL KL-7000HA HYSOL GR869 HYSOL KL-G900HP HYSOL GR828DD HYSOL KL-6500S HYSOL KL-G730 HYSOL KL-4500-1NT HYSOL KL-G200S HYSOL KL-G450H HYSOL KL-G450S HYSOL KL-G730 HYSOL KL-G800H Surface Mount / Laminates SIP PBGA, CSP PoP, SCSP MMC HYSOL GR9810 Series HYSOL GR9810 Series HYSOL GR9810-1P HYSOL GR9810-1P Green Product Non-Green Product HYSOL GR9851M 35
Page 1 and 2: Henkel Semiconductor Solutions
Page 3 and 4: Contents Semiconductor Market Solut
Page 5 and 6: Electronic Assembly Materials Adhes
Page 7 and 8: Semiconductor Market Solutions Disc
Page 9 and 10: Semiconductor Market Solutions QFP
Page 11 and 12: Semiconductor Market Solutions SOIC
Page 13 and 14: Semiconductor Market Solutions SMAR
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Page 17 and 18: Semiconductor MaTERIALs DIE ATTACH
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Page 23 and 24: Semiconductor Market MaTERIALS Solu
Page 25 and 26: Semiconductor MaTERIALS Conductive
Page 27 and 28: Semiconductor MATERIALS UNDERFILLs
Page 29 and 30: Semiconductor MaTERIALS encapsulant
Page 31 and 32: Semiconductor Materials ENCAPSULANT
Page 33 and 34: Semiconductor MaTERIALS photonics T
Page 35: Semiconductor MaTERIALS ELECTRONIC
Page 39 and 40: Semiconductor MaTERIALS Discretes /
Page 41 and 42: Semiconductor MATERIALS Molding Com
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Page 45 and 46: Semiconductor MaTERIALS SOLDER Mate
Page 47 and 48: Molding Compounds Die Attach Paste
Page 49 and 50: Semiconductor Market Solutions INDE
Page 52: Henkel - Your partner worldwide AME

Henkel Semiconductor Solutions

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