Henkel Semiconductor Solutions

Semiconductor
MaTERIALS
molding
compounds
From through-hole discrete components to the
most advanced surface mount devices, Henkel’s
Hysol brand Molding Compounds deliver the
outstanding performance and ease of use you’d
expect from a world leader in materials technology.
Combining low stress and low moisture absorption
with high physical strength, all of Henkel’s
Molding Compounds ensure an optimized process
at high yields even in the most demanding
Pb-free environments. Formulated for the varying
requirements of today’s discrete components,
Hysol products’ high performance Molding
Compounds offer the ultimate in manufacturing
value for general discretes. With fast cycle times,
a robust process window and the ability to run
in excess of 700 cycles prior to mold cleaning,
these materials deliver exceptional results. For
more demanding high voltage applications,
Hysol materials have been formulated to provide
low dielectric properties at high temperatures.
Henkel has also developed Molding Compounds
for thermally conductive discretes that provide
excellent thermal characteristics, offering up to 2.1
W/mK with the ability to go as high as 3 W/mK. The
low moisture absorption and low stress properties
of Hysol Molding Compounds for surface-mounted
leadframe devices all pass stringent JEDEC Level 1,
260°C testing. All Hysol Molding Compounds are
green materials, which are halide-free and Pb-free
compatible and meet RoHS requirements, while
delivering superior performance even in high
temperature reflow conditions.
With materials solutions for QFPs, SoPs, SOICs,
QFNs, SOTs and DPAKs, the Hysol line of Molding
Compounds are formulated for package-specific
demands and deliver exceptional adhesion for
a variety of leadframe finishes. For packaging
specialists building surface-mounted laminate
packages such as BGAs and CSPs, Henkel has
developed a wide range of state-of-the-art Molding
Compound materials utilizing our unique flexible
hardener technology. Maintaining package flatness
throughout package assembly and subsequent PCB
assembly processes is essential for ensuring high
reliability. Henkel’s flexible hardener technology
enables package-specific Molding Compound
formulations that counter-correct any warpage that
may occur during second level reflow processes,
thus ensuring high performance and longterm
reliability. In addition, we have developed
innovative Molding Compound materials for
use with today’s multifunctional memory card
(MMC) and Package-on-Package (PoP) applications.
Hysol MMC and PoP Molding Compounds deliver
the robust performance characteristics and
exceptionally low warpage required for these
devices.
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