Henkel Semiconductor Solutions

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<strong>Semiconductor</strong> MaTERIALS electronic molding compounds Hysol Electronic Molding Compounds protect passive components, such as ceramic and Tantalum (Ta) capacitors and resistors, and are designed for both automolds and conventional molds. Our unique Gold (Au) compounds are ideal for high contrast laser marking and are available in fast cure versions for high productivity. Cutting-edge low stress compounds, capable of thin wall designs for today’s relentless demands to miniaturize every component, are also available. Next-generation molding powders have been designed to meet the Electronics industry’s need for plastics that are environmentally responsible and resistant to cracking after 260°C IR reflow. New blends of proprietary flame retardants are used to replace the traditional Antimony (Sb) oxide/ halogenated resin flame-out systems. The materials pass UL standards and meet the EU’s environmental requirements (i.e., no Halogens, no heavy metals). Combining these flame retardants with new resin technology and filler blends has produced a series of ultra low stress materials that resist cracking after exposure to 260°C IR reflow conditions. Electronic Molding Compounds Tantalum (Ta) Capacitors Resistor Networks Other HYSOL GR2220 Black HYSOL GR2310 Gold HYSOL GR2320 Black HYSOL GR2710 HYSOL GR2720 Black HYSOL GR2725 HYSOL GR2310 Gold HYSOL GR2320 Black HYSOL MG33F HYSOL GR2220 Black HYSOL GR2310 Gold HYSOL GR2320 Black HYSOL GR2620 Black HYSOL GR2811 Gold HYSOL GR2820 Black HYSOL GR2811 Gold HYSOL MG33F Black 32
<strong>Semiconductor</strong> MaTERIALS ELECTRONIC MOLDING COMPOUNDS TANTALUM (TA) CAPACITORS Product HYSOL GR2220 HYSOL GR2310 Description Conventional Mold Spiral Flow in, @ 177°C Tg, °C CTE a1, ppm/°C CTE a2, ppm/°C Cure Time @ 177°C Flexural Strength, psi Flexural Modulus, psi Black/conventional molding of MnO caps. Conventional 40 162 19 60 30 - 45 sec. 18,500 2.4 x 10 6 N Au/non-halogenated molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. Laser Markable Conventional/Auto 27 166 22 75 30 - 45 sec. 20,500 2.1 x 10 6 Y HYSOL GR2320 HYSOL GR2710 HYSOL GR2720 Hysol GR2725 Black/non-halogenated molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. Au/low stress/non-flame retarded molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. Black/low stress/non-flame retarded molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. Black low stress epoxy mold compound. Especially designed for low ESR on conductive polymer Ta and AO capacitors. Conventional/Auto 27 172 22 82 N/A 20,300 N/A Y Conventional/Auto 35 161 13 45 45 - 60 sec. 19,000 2.6 x 10 6 Y Conventional/Auto 35 165 18 63 N/A 18,000 N/A Y Conventional/Auto 55 170 17 60 30 - 45 sec. 20,000 2.2 x 10 6 Y HYSOL GR2811 Au/thin wall-crack-resistant, low stress, fast cycle time. Conventional/Auto 34 162 13 45 30 - 45 sec. 20,000 2.9 x 10 6 Y HYSOL MG33F Black, environmentally responsible, "green," Molding Compound designed especially for the encapsulation of Ta capacitors. Low moisture absorption, excellent moldability with fast cycle times, especially auto-mold applications. Conventional/Auto 28 175 19 61 30 - 45 sec. 20,000 2.2 x 10 6 Y RESISTOR NETWORKS Product Description Conventional Mold Spiral Flow in, @ 177°C Tg, °C CTE a1 , ppm/°C CTE a2 , ppm/°C Cure Time @ 177°C Flexural Strength, psi Flexural Modulus, psi Laser Markable HYSOL GR2310 HYSOL GR2320 HYSOL MG33F OTHER Au/non-halogenated molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. Black/non-halogenated molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. Black, environmentally responsible, "green," Molding Compound designed especially for the encapsulation of Ta capacitors. Low moisture absorption, excellent moldability with fast cycle times, especially auto-mold applications. Conventional/Auto 27 166 22 75 30 - 45 sec. 20,500 2.1 x 10 6 Y Conventional/Auto 27 172 22 82 N/A 20,300 N/A Y Conventional/Auto 28 175 19 61 30 - 45 sec. 20,000 2.2 x 10 6 Y Product Description Conventional Mold Spiral Flow in, @ 177°C Tg, °C CTE a1, ppm/°C CTE a2, ppm/°C Cure Time @ 177°C Flexural Strength, psi Flexural Modulus, psi Laser Markable HYSOL GR2220 Black/conventional molding of MnO caps. Conventional 40 162 19 60 30 - 45 sec. 18,500 2.4 x 10 6 N HYSOL GR2310 HYSOL GR2320 Au/non-halogenated molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. Black/non-halogenated molding powder, Ta and ceramic capacitors, leaded or surface-mounted sensors. Conventional/Auto 27 166 22 75 30 - 45 sec. 20,500 2.1 x 10 6 Y Conventional/Auto 27 172 22 82 N/A 20,300 N/A Y HYSOL GR2620 HYSOL GR2811 HYSOL GR2820 General-purpose, good moldability, and high Tg. Conventional 35 145 32 87 N/A 20,000 N/A N Au/thin wall-crack-resistant, low stress, fast cycle time. Conventional/Auto 34 162 13 45 30 - 45 sec. 20,000 2.9 x 10 6 Y Au/thin wall-crack-resistant, low stress, fast cycle time. Conventional/Auto 25 153 12 50 N/A 17,000 N/A Y 33
Page 1 and 2: Henkel Semiconductor Solutions
Page 3 and 4: Contents Semiconductor Market Solut
Page 5 and 6: Electronic Assembly Materials Adhes
Page 7 and 8: Semiconductor Market Solutions Disc
Page 9 and 10: Semiconductor Market Solutions QFP
Page 11 and 12: Semiconductor Market Solutions SOIC
Page 13 and 14: Semiconductor Market Solutions SMAR
Page 15 and 16: Semiconductor Market Solutions Imag
Page 17 and 18: Semiconductor MaTERIALs DIE ATTACH
Page 19 and 20: Semiconductor MaTERIALS DIE ATTACH
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Page 23 and 24: Semiconductor Market MaTERIALS Solu
Page 25 and 26: Semiconductor MaTERIALS Conductive
Page 27 and 28: Semiconductor MATERIALS UNDERFILLs
Page 29 and 30: Semiconductor MaTERIALS encapsulant
Page 31 and 32: Semiconductor Materials ENCAPSULANT
Page 33: Semiconductor MaTERIALS photonics T
Page 37 and 38: Semiconductor MaTERIALS Molding Com
Page 39 and 40: Semiconductor MaTERIALS Discretes /
Page 41 and 42: Semiconductor MATERIALS Molding Com
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Page 45 and 46: Semiconductor MaTERIALS SOLDER Mate
Page 47 and 48: Molding Compounds Die Attach Paste
Page 49 and 50: Semiconductor Market Solutions INDE
Page 52: Henkel - Your partner worldwide AME

Henkel Semiconductor Solutions

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