Henkel Semiconductor Solutions

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Semiconductor MaTERIALS UNDERFILLs The shrinking footprint of modern handheld and mobile products in tandem with the higher temperature processing demands for advanced devices has necessitated development of new underfill technologies that deliver improved shock resistance and enhanced device reliability. Henkel’s package-level Underfill systems have been engineered to deliver robust performance characteristics while meeting stringent JEDEC testing requirements and ensuring Pb-free compatibility. With an unyielding focus on quality and performance, all Hysol Underfills are developed for demanding end-use requirements including low warpage/low stress, fine pitch, high reliability and high adhesion. With a wide variety of formulations from which to choose, Hysol Underfills have emerged as the premier industry standard for flip-chip (FC) applications, and are used in devices such as FC CSPs and FC BGAs for ASICs, chipsets, graphic chips, microprocessors and digital signal processors. Formulated with superior characteristics like fast flow and excellent adhesion, Henkel’s Underfills exhibit no cracking after thermal shock or thermal cycling. With Underfills for low Potassium/Copper (K/Cu) die, materials with tremendously long working lives, SnapCure processing alternatives, fluxing no-flow Underfills and high thermal Underfills, our portfolio of leading edge products continues to get broader and deeper. The next generation of amine-based Underfill systems have been introduced and the advantages are many: Henkel’s amine Underfill systems deliver excellent adhesion to Silicon Nitrogen (SiN) and polyimide and, when tested against competitive Underfills, provided superior performance. These nextgeneration Underfill systems are designed to deliver lower stress with a unique combination of thermal mechanical characteristics to prevent delamination, bump fatigue and Under Bump Metallization (UBM) failure. Underfills Capillaries No Flow for Small Die Applications High Lead Packages DSP, Processor, ASICs Pb-Free Packages Over-Molded Flip-Chip Flip-Chip on Flex HYSOL FP4545FC ABLEFILL UF8806G ABLEFILL UF8828 HYSOL FP4583 HYSOL DC0114 Eutectics HYSOL FP4549 HYSOL FP4583 ABLEFILL UF8826 ABLEFILL UF8829 HYSOL FP4585 HYSOL FP4585 HYSOL FP0114 HYSOL FP4526 HYSOL FF2200 HYSOL FP4585 HYSOL FP4530 HYSOL FP4531 No-Lead (Pb) Packages Fast Cure, Non-JEDEC Die Edge Coating (DEC) FCOB/FCOF Package Level, Longer Cure New Generation Amine HYSOL FP4549 HYSOL FP4549HT HYSOL FF2300 24
Semiconductor MATERIALS UNDERFILLs CAPILLARY PRODUCT DESCRIPTION FLOW SPEED VISCOSITY, cPs Tg, °C CTEa1, ppm/°C MODULUS, GPa % Filler RECOMMENDED CURE HYSOL FP4545FC HYSOL FP4549 HYSOL FP4583 ABLEFILL UF8806G ABLEFILL UF8826 ABLEFILL UF8828 ABLEFILL UF8829 HYSOL FP4585 HYSOL DC0114 HYSOL FP0114 HYSOL FP4526 HYSOL FP4530 HYSOL FP4531 HYSOL FP4549HT Flux Compatible, high purity, Flip-Chip Underfill for high Pb applications. Fast-flowing, low stress Underfill for fine-pitch flip-chip applications. Fast 9,000 115 30 7.1 55 60 min. @ 165°C Very Fast 2,300 140 45 5.5 50 30 min. @ 165°C High purity, FC Underfill, high Pb applications. Fast 14,000 79 40 6.9 57 120 min. @ 165°C Moisture resistant. For die sizes
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Page 3 and 4: Contents Semiconductor Market Solut
Page 5 and 6: Electronic Assembly Materials Adhes
Page 7 and 8: Semiconductor Market Solutions Disc
Page 9 and 10: Semiconductor Market Solutions QFP
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Page 17 and 18: Semiconductor MaTERIALs DIE ATTACH
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Page 31 and 32: Semiconductor Materials ENCAPSULANT
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Page 35 and 36: Semiconductor MaTERIALS ELECTRONIC
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Page 41 and 42: Semiconductor MATERIALS Molding Com
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Page 45 and 46: Semiconductor MaTERIALS SOLDER Mate
Page 47 and 48: Molding Compounds Die Attach Paste
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Henkel Semiconductor Solutions

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