Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
MaTERIALS<br />
UNDERFILLs<br />
The shrinking footprint of modern handheld<br />
and mobile products in tandem with the higher<br />
temperature processing demands for advanced<br />
devices has necessitated development of new underfill<br />
technologies that deliver improved shock resistance<br />
and enhanced device reliability.<br />
<strong>Henkel</strong>’s package-level Underfill systems have<br />
been engineered to deliver robust performance<br />
characteristics while meeting stringent JEDEC testing<br />
requirements and ensuring Pb-free compatibility.<br />
With an unyielding focus on quality and performance,<br />
all Hysol Underfills are developed for demanding<br />
end-use requirements including low warpage/low<br />
stress, fine pitch, high reliability and high adhesion.<br />
With a wide variety of formulations from which to<br />
choose, Hysol Underfills have emerged as the premier<br />
industry standard for flip-chip (FC) applications, and<br />
are used in devices such as FC CSPs and FC BGAs for<br />
ASICs, chipsets, graphic chips, microprocessors and<br />
digital signal processors. Formulated with superior<br />
characteristics like fast flow and excellent adhesion,<br />
<strong>Henkel</strong>’s Underfills exhibit no cracking after thermal<br />
shock or thermal cycling.<br />
With Underfills for low Potassium/Copper (K/Cu) die,<br />
materials with tremendously long working lives,<br />
SnapCure processing alternatives, fluxing no-flow<br />
Underfills and high thermal Underfills, our portfolio<br />
of leading edge products continues to get broader and<br />
deeper. The next generation of amine-based Underfill<br />
systems have been introduced and the advantages<br />
are many: <strong>Henkel</strong>’s amine Underfill systems deliver<br />
excellent adhesion to Silicon Nitrogen (SiN) and<br />
polyimide and, when tested against competitive<br />
Underfills, provided superior performance. These nextgeneration<br />
Underfill systems are designed to deliver<br />
lower stress with a unique combination of thermal<br />
mechanical characteristics to prevent delamination,<br />
bump fatigue and Under Bump Metallization (UBM)<br />
failure.<br />
Underfills<br />
Capillaries<br />
No Flow for Small Die Applications<br />
High Lead Packages<br />
DSP, Processor,<br />
ASICs<br />
Pb-Free<br />
Packages<br />
Over-Molded<br />
Flip-Chip<br />
Flip-Chip<br />
on Flex<br />
HYSOL<br />
FP4545FC<br />
ABLEFILL<br />
UF8806G<br />
ABLEFILL<br />
UF8828<br />
HYSOL<br />
FP4583<br />
HYSOL<br />
DC0114<br />
Eutectics<br />
HYSOL<br />
FP4549<br />
HYSOL<br />
FP4583<br />
ABLEFILL<br />
UF8826<br />
ABLEFILL<br />
UF8829<br />
HYSOL<br />
FP4585<br />
HYSOL<br />
FP4585<br />
HYSOL<br />
FP0114<br />
HYSOL<br />
FP4526<br />
HYSOL<br />
FF2200<br />
HYSOL<br />
FP4585<br />
HYSOL<br />
FP4530<br />
HYSOL<br />
FP4531<br />
No-Lead (Pb)<br />
Packages<br />
Fast Cure, Non-JEDEC<br />
Die Edge Coating (DEC)<br />
FCOB/FCOF<br />
Package Level, Longer Cure<br />
New Generation Amine<br />
HYSOL<br />
FP4549<br />
HYSOL<br />
FP4549HT<br />
HYSOL<br />
FF2300<br />
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